TFA9895
Boosted class-D audio amplifier with speaker boost
protection and multiband dynamic range compressor
Rev. 1 — 23 October 2013
Product short data sheet
1. General description
The TFA9895 is a high efficiency class-D audio amplifier with a sophisticated speaker
boost protection algorithm that features multi-band compression. It can deliver 2.65 W
(RMS; THD = 1 %) output power into a 4 speaker at a battery voltage of 3.6 V. The
internal boost converter raises the supply voltage to 5.3 V, providing ample headroom for
major improvements in sound quality.
A safe working environment is provided for the speaker under all operating conditions.
The TFA9895 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures that the quality of the
audio signal is never degraded by unwanted clipping or distortion in the amplifier or
speaker.
Unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to
accurately calculate both the temperature and the excursion, allowing the TFA9895 to
adapt to changes in the acoustic environment.
Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional
headroom and power output. The supply voltage is only raised when necessary. This
precaution maximizes the output power of the class-D audio amplifier while limiting
quiescent power consumption.
The multi-band processing improves audio quality and apparent volume by allowing the
gain to remain stable in most of the signal while the protection reacts to only those
portions that would be unsafe. The TFA9895 also adds a high-frequency noise gate that
improves the sound of poor-quality audio sources.
The TFA9895 also incorporates advanced battery protection. By limiting the supply
current when the battery voltage is low, it prevents the audio system drawing excessive
load currents from the battery, which could cause a system undervoltage. The advanced
processor minimizes the impact of a falling battery voltage on the audio quality by
preventing distortion as the battery discharges.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in a class-D
audio amplifier provides excellent audio performance and high supply voltage ripple
rejection. The audio input interface is I2S and the control settings are communicated via
an I2C-bus interface.
The TFA9895 is available in a 29-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
2. Features and benefits
Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
Fully embedded software, no additional license fee or porting required
Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more.
Adaptive excursion control guarantees that the speaker membrane excursion never
exceeds its rated limit
Multiband dynamic range compressor (DRC) allows independent control of up to three
frequency bands
Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
Output power: 2.65 W (RMS) into 4 at 3.6 V supply voltage (THD = 1 %)
Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage
Bandwidth extension option to increase low frequency response
Intelligent DC-to-DC converter maximizes audio headroom from any supply level and
limits current consumption at low battery voltages
Compatible with standard Acoustic Echo Cancellers (AECs)
High efficiency and low-power dissipation
Wide supply voltage range (fully operational from 2.5 V to 5.5 V)
Two I2S inputs to support two audio sources
I2C-bus control interface (400 kHz)
Dedicated speech mode with speech activity detector
Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo
Cancellation (AEC) at the host
Fully short-circuit proof across the load and to the supply lines
Sample frequencies from 8 kHz to 48 kHz supported
Three bit-clock/word-select ratios supported (32x, 48x, 64x)
Option to route I2S input direct to I2S output to allow a second I2S output slave device
to be used in combination with the TFA9895
TDM interface supported
Volume control
Low RF susceptibility
Input interface insensitive to clock jitter
Thermally protected
Low ‘pop noise' at all mode transitions
3. Applications
Mobile phones
Tablets
Portable gaming devices
TFA9895_SDS
Product short data sheet
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2 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Portable Navigation Devices (PND)
Notebooks/Netbooks
MP3 players and portable media players
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in DC-to-DC converter coil;
Operating modes with load; DC-to-DC
converter in Adaptive boost mode (no input
signal)
-
1.55
-
mA
on pin VBAT and in DC-to-DC converter coil;
Power-down mode
-
-
1
A
on pin VDDD; Operating modes; speaker
boost protection activated
-
20
-
mA
on pin VDDD; Operating modes; CoolFlux
DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 = WS2 =
DATAI2 = DATAI3 = 0 V
-
10
-
A
RL = 4 ; fs = 48 kHz
-
2.55
-
W
RL = 4 ; fs = 32 kHz
-
2.65
-
W
RL = 8 ; fs = 48 kHz
-
1.5
-
W
RL = 8 ; fs = 32 kHz
-
1.65
-
W
digital supply current
IDDD
Po(RMS)
RMS output power
CLIP = 00
5. Ordering information
Table 2.
Ordering information
Type number
TFA9895UK
Package
Name
Description
Version
WLCSP29
wafer level chip-size package; 29 bumps; 3.19 2.07 0.6 mm
TFA9895UK
TFA9895_SDS
Product short data sheet
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Rev. 1 — 23 October 2013
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3 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
6. Block diagram
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Block diagram
TFA9895_SDS
Product short data sheet
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4 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
7. Pinning information
7.1 Pinning
1
2
3
4
5
6
bump A1
index area
7
E
2
3
4
5
6
7
A
D
B
C
C
B
D
A
E
bump A1
index area
010aaa734
010aaa735
a. Bottom view
Fig 2.
1
b. Transparent top view
Bump configuration
1
2
A
DATAI2
DATAO
B
WS2
WS1
C
BCK2
D
E
3
4
5
6
7
ADS1
ADS2
OUTB
TEST3
VDDP
GNDP
BCK1
TEST4
TEST1
OUTA
n.c.
SCL
TEST5
TEST2
GNDB
n.c.
SDA
DATAI1 DATAI3
VDDD
GNDD
VBAT
BST
INB
010aaa736
Transparent top view
Fig 3.
TFA9895_SDS
Product short data sheet
Bump mapping
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Rev. 1 — 23 October 2013
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5 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Table 3.
Pinning
Symbol
Pin
Type
Description
DATAI2
A1
I
digital audio data input 2
DATAO
A2
O
digital audio data output
DATAI1
A3
I
digital audio data input 1
DATAI3
A4
I
digital audio data input 3
ADS1
A5
I
address select input 1
ADS2
A6
I
address select input 2
OUTB
A7
O
inverting output
WS2
B1
I
digital audio word select input 2
WS1
B2
I
digital audio word select input 1
I
test signal input 3; for test purposes only, connect to PCB ground
B6
P
power supply voltage
GNDP
B7
P
power ground
BCK2
C1
I
digital audio bit clock input 2
BCK1
C2
I
digital audio bit clock input 1
O
test signal input 4; for test purposes only, connect to PCB ground
B3
TEST3
B4
B5
VDDP
C3
TEST4
C4
C5
TEST1
C6
I
test signal input 1; for test purposes only, connect to VBST
OUTA
C7
O
non-inverting output
n.c.
D1
-
not connected; connect to D2 or to PCB ground
SCL
D2
I
I2C-bus clock input
I
test signal input 5; for test purposes only, connect to PCB ground
D3
TEST5
D4
D5
TFA9895_SDS
Product short data sheet
TEST2
D6
I
test signal input 2; for test purposes only, connect to VBST
GNDB
D7
P
boosted ground
n.c.
E1
-
not connected; connect to E2 or to PCB ground
SDA
E2
I/O
I2C-bus data input/output
VDDD
E3
P
digital supply voltage
GNDD
E4
P
digital ground
VBAT
E5
I
battery supply voltage sense input
VBST
E6
O
boosted supply voltage output
INB
E7
P
DC-to-DC boost converter input
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Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
6 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
8. Functional description
The TFA9895 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated speaker boost protection algorithm. Figure 1 is a block diagram of the
TFA9895.
The device contains three I2S input interfaces and one I2S output interface. One of I2S
inputs DATAI1 and DATAI2 can be selected as the audio input stream. The third I2S input,
DATAI3, is provided to support stereo applications and the I2S pass-through option. The
pass-through option is provided to allow an I2S output slave device (e.g. a CODEC),
connected in parallel with the TFA9895, to be routed directly to the audio host via the I2S
output.
The I2S output signal on DATAO can be configured to transmit the DSP output signal,
amplifier output current information, DATAI3 Left or Right signal information or amplifier
gain information. The gain information can be used to facilitate communication between
two devices in stereo applications.
The speaker boost protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures that the audio quality is always acceptable.
The protection algorithm implements an adaptive loudspeaker model that is used to
predict the extent of membrane excursion. The model is continuously updated to ensure
that the protection scheme remains effective even when speaker parameter values
change or the acoustic enclosure is modified.
The speaker boost protection algorithm boosts the output sound pressure level within
given mechanical, thermal and quality limits. An optional Bandwidth extension mode
extends the low frequency response up to a predefined limit before maximizing the output
level. This mode is suitable for listening to high-quality music in quiet environments.
A multiband dynamic range compressor allows up to three frequency bands to be
controlled independently to improve audio performance.
The frequency response of the TFA9895 can be modified via ten fully programmable
cascaded second-order biquad filters. The first two biquads are processed with 48-bit
double precision; biquads 3 to 8 are processed with 24-bit single precision.
At low battery voltage levels, the gain is automatically reduced to limit battery current.
The output volume can be controlled by the speaker boost protection algorithm or by the
host application (external). In the latter case, the boost features of the speaker boost
protection algorithm must be disabled to avoid neutralizing external volume control.
The speaker boost protection algorithm output is converted into two pulse width
modulated (PWM) signals which are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
TFA9895_SDS
Product short data sheet
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Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
7 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
The adaptive DC-to-DC converter boosts the battery supply voltage in line with the output
of the speaker boost protection algorithm. It switches to Follower mode (VBST = VBAT; no
boost) when the audio output voltage is lower than the battery voltage.
8.1 Protection mechanisms
The following protection circuits are included in the TFA9895:
•
•
•
•
•
OverTemperature Protection (OTP)
OverVoltage Protection (OVP)
UnderVoltage Protection (UVP)
OverCurrent Protection (OCP)
Invalid Data Protection (IDP)
The reaction of the device to fault conditions differs depending on the protection circuit
involved.
8.1.1 OverTemperature Protection (OTP)
OTP prevents heat damage to the TFA9895. It is triggered when the junction temperature
exceeds Tact(th_prot). When OTP is activated, the output stages are set floating. OTP is
cleared automatically via an internal timer (approximately 200 ms), after which the output
stages start to operate normally again.
8.1.2 Supply voltage protection (UVP and OVP)
If VBAT drops below the undervoltage protection threshold, VP(uvp), UVP is activated and
the outputs are set floating. When the supply voltage rises above VP(uvp) again, the
system will be restarted after approximately 200 ms.
If the power supply voltage (VDDP) rises above the overvoltage protection threshold,
VP(ovp), OVP is activated and the outputs are set floating. The power stages are
re-enabled as soon as the supply voltage drops below VP(ovp) again. The system will be
restarted after approximately 200 ms.
8.1.3 OverCurrent Protection (OCP)
OCP detects a short circuit across the load or between one of the amplifier outputs and
one of the supply lines. When the output current exceeds the overcurrent protection
threshold (IO(ocp)), it is limited to IO(ocp) while the amplifier outputs are switching (the
amplifier is not powered down completely). This feature is called current limiting. The
amplifier can distinguish between an impedance drop at the loudspeaker and a low-ohmic
short circuit across the load or to one of the supply lines. The impedance threshold
depends on which supply voltage is being used.
8.1.4 Invalid Data Protection (IDP)
IDP checks if the word select signal is correctly connected to the TFA9895. If the bit
clock/word select (BCK-to-WS) ratio is not stable, the IDP alarm is raised and the
TFA9895 powers down, deactivating the DSP. The TFA9895 starts up again automatically
when the BCK-to-WS ratio stabilizes. So, in practice, stable word select and bit clock
signals are needed for the TFA9895 to exit Power-down mode and also when loading
DSP settings.
TFA9895_SDS
Product short data sheet
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TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VBAT
battery supply voltage
on pin VBAT
0.3
+5.5
V
VDDP
power supply voltage
on pin VDDP
0.3
+5.5
V
VDDD
digital supply voltage
on pin VDDD
0.3
+1.95
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
VESD
electrostatic discharge voltage
40
+85
C
according to Human Body Model (HBM)
2
+2
kV
according to Charge Device Model (CDM)
500
+500
V
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-a)
thermal resistance from junction to ambient
in free air; natural convection
-
4-layer application board
60
Unit
K/W
11. Characteristics
11.1 DC Characteristics
Table 6.
DC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDP
power supply voltage
on pin VDDP
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in the DC-to-DC
converter coil; Operating modes with
load; DC-to-DC converter in Adaptive
boost mode (no output signal)
-
1.55 -
mA
on pin VBAT and in the DC-to-DC
converter coil; Power-down mode
-
-
1
A
on pin VDDD; Operating modes; speaker
boost Protection activated
-
20
-
mA
on pin VDDD; Operating modes;
CoolFlux DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 =
WS2 = DATAI2 = DATAI3 = 0 V
-
10
-
A
IDDD
digital supply current
TFA9895_SDS
Product short data sheet
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9 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Table 6.
DC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA
VIH
HIGH-level input voltage
0.7VDDD -
3.6
V
VIL
LOW-level input voltage
-
-
0.3VDDD
V
-
-
3
pF
1.8 V on input pin
-
-
0.1
A
Cin
input capacitance
ILI
input leakage current
[2]
Pins DATAO, push-pull output stages
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDDD
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
Pins SDA, open-drain outputs, external 10 k resistor to VDDD
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDDD
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
VDDP = 5.3 V
-
100
-
m
130
-
150
C
Pins OUTA, OUTB
RDSon
drain-source on-state
resistance
Protection
Tact(th_prot)
thermal protection activation
temperature
VP(ovp)
overvoltage protection supply
voltage
protection on VDDP
5.5
-
6.0
V
VP(uvp)
undervoltage protection supply protection on VBAT
voltage
2.3
-
2.5
V
IO(ocp)
overcurrent protection output
current
1.45
-
-
A
5.25
5.3
5.35
V
DC-to-DC converter
VO(VBST)
output voltage on pin VBST
boosted supply voltage when nominal
voltage programmed to 5.3 V
[1]
LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; value is guaranteed by design and checked during product validation.
TFA9895_SDS
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© NXP B.V. 2013. All rights reserved.
10 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
11.2 AC characteristics
Table 7.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RL = 4 ; fs = 48 kHz
-
2.55
-
W
RL = 4 ; fs = 32 kHz
-
2.65
-
W
Amplifier output power
Po(RMS)
RMS output power
THD+N = 1 %; CLIP = 00
RL = 8 ; fs = 48 kHz
-
1.5
-
W
RL = 8 ; fs = 32 kHz
-
1.65
-
W
RL = 4 ; fs = 48 kHz
-
2.35
-
W
RL = 4 ; fs = 32 kHz
-
2.55
-
W
RL = 8 ; fs = 48 kHz
-
1.25
-
W
RL = 8 ; fs = 32 kHz
-
1.4
-
W
RL = 4 ; fs = 48 kHz
-
3.75
-
W
RL = 4 ; fs = 32 kHz
-
3.75
-
W
RL = 8 ; fs = 48 kHz
-
2
-
W
RL = 8 ; fs = 32 kHz
-
2
-
W
-
-
1
mV
[2]
-
80
-
%
[2]
-
0.03
0.1
%
-
31
-
V
-
45
-
V
-
100
-
dB
-
97
-
dB
-
90
-
dB
-
-
2
ms
THD+N = 1 %; CLIP = 10
THD+N = 10 %; CLIP = 00
Amplifier output; pins OUTA and OUTB
VO(offset)
output offset voltage
absolute value
Amplifier performance
po
output power efficiency
THD+N
total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ;
LL = 44 H
Vn(o)
output noise voltage
including DC-to-DC converter; Po(RMS)
= 2.65 W;
A-weighted; DATAI1 = DATAI2 = 0 V
CoolFlux DSP disabled and
bypassed
CoolFlux DSP enabled
S/N
signal-to-noise ratio
[2]
VO = 4.5 V (peak); A-weighted
CoolFlux DSP disabled and
bypassed
CoolFlux DSP enabled
PSRR
power supply rejection ratio
Vripple = 200 mV (RMS); fripple = 217 Hz
[2]
Amplifier power-up, power-down and propagation delays
td(on)
turn-on delay time
PLL locked on BCK (IPLL = 0)
fs = 8 kHz to 48 kHz
PLL locked on WS (IPLL = 1)
td(off)
fs = 8 kHz
-
-
27
ms
fs = 48 kHz
-
-
6
ms
-
-
10
s
turn-off delay time
TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
11 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Table 7.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
td(mute_off)
mute off delay time
td(soft_mute)
soft mute delay time
tPD
propagation delay
Min
Typ
Max
Unit
-
1
-
ms
-
1
-
ms
fs = 8 kHz
-
-
3.2
ms
fs = 48 kHz
-
-
600
s
fs = 8 kHz
-
-
14
ms
fs = 48 kHz
-
-
4
ms
CoolFlux bypassed
speaker boost protection mode,
tLookAhead = 2 ms
[1]
LBST = boost converter inductor; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; value is guaranteed by design and checked during product validation.
12. Application information
12.1 Application diagrams
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TFA9895_SDS
Product short data sheet
Typical mono application (simplified)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
12 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
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TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
13 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
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Typical mono application with two audio sources and a second I2S slave device
TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
14 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
13. Package outline
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TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
15 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 8.
Table 8.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
16 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
TFA9895_SDS
Product short data sheet
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TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
15. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TFA9895_SDS v.1
20131023
Product data sheet
-
-
TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
18 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TFA9895_SDS
Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
19 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9895_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 October 2013
© NXP B.V. 2013. All rights reserved.
20 of 21
TFA9895
NXP Semiconductors
Boosted class-D audio amplifier with speaker boost protection
18. Contents
1
2
3
4
5
6
7
7.1
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
9
10
11
11.1
11.2
12
12.1
13
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
14.3.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
Protection mechanisms . . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
Supply voltage protection (UVP and OVP) . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
Invalid Data Protection (IDP) . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 9
AC characteristics. . . . . . . . . . . . . . . . . . . . . . 11
Application information. . . . . . . . . . . . . . . . . . 12
Application diagrams . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering of WLCSP packages. . . . . . . . . . . . 16
Introduction to soldering WLCSP packages . . 16
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Quality of solder joint . . . . . . . . . . . . . . . . . . . 17
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 October 2013
Document identifier: TFA9895_SDS