Dual 2-Input Exclusive-OR

NLX2G86
Dual 2-Input Exclusive-OR
Gate
The NLX2G86 is a high performance dual 2−input Exclusive−OR
Gate operating from a 1.65 V to 5.5 V supply.
Features
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Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ86
This is a Pb−Free Device
A1
7
B1
6
8
1
UQFN8
MU SUFFIX
CASE 523AN
AC MG
G
AC = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Y2
5
VCC 8
1
MARKING
DIAGRAM
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
4 GND
A1
=1
Y1
B1
A2
1
Y1
2
B2
3
A2
Y2
B2
Figure 2. Logic Symbol
Figure 1. Pinout (Top View)
PIN ASSIGNMENT
Pin
Function
1
Y1
2
B2
3
A2
4
GND
A
B
Y
5
Y2
L
L
L
6
B1
L
H
H
7
A1
H
L
H
8
VCC
H
H
L
© Semiconductor Components Industries, LLC, 2009
April, 2009 − Rev. 0
FUNCTION TABLE
Input
Output
Y=A+B
1
Publication Order Number:
NLX2G86/D
NLX2G86
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
IIK
DC Input Diode Current
VI < GND
*50
mA
IOK
DC Output Diode Current
VO < GND
*50
mA
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
(Note 1)
260
_C
)150
_C
TBD
_C/W
TBD
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Min
Max
Unit
1.65
1.5
5.5
5.5
V
(Note 5)
0
5.5
V
(HIGH or LOW State)
0
5.5
V
*40
)125
_C
0
0
0
0
20
20
10
5
ns/V
Operating
Data Retention Only
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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2
NLX2G86
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
TA = 255C
VCC
(V)
Min
0.75 VCC
0.7 VCC
VIH
High−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
VIL
Low−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
VOH
High−Level Output
Voltage
VIN = VIH
VOL
Low−Level Output
Voltage
VIN = VIL
IIN
Input Leakage Current
IOFF
Power Off Leakage
Current
ICC
Quiescent Supply
Current
Typ
*405C v TA v 855C
Max
Min
Max
Unit
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
Condition
V
0.25 VCC
0.3 VCC
V
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
V
IOH = −100 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
V
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IOL = 100 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
V
IOL = 4 mA
IOL = 8 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
0 to 5.5
$1.0
$1.0
mA
0 V v VIN v 5.5 V
0.0
1.0
10
mA
VIN or VOUT = 5.5 V
1.65 to 5.5
1.0
10
mA
VIN = 5.5 V, GND
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
VCC
Symbol
tPLH
tPHL
Parameter
Propagation Delay
(Figure 3 and 4)
TA = 25_C
*40_C v TA v 125_C
Condition
(V)
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
1.8 $ 0.15
2.0
7.9
9.0
2.0
10.5
ns
RL = 1 MW, CL = 15 pF
2.5 $ 0.2
1.2
4.1
7.0
1.2
7.5
RL = 1 MW, CL = 15 pF
3.3 $ 0.3
0.8
3.0
4.8
0.8
5.2
1.2
3.8
5.4
1.2
5.9
0.5
2.2
3.5
0.5
3.8
0.8
2.9
4.2
1.0
4.6
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 $ 0.5
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
2.5
pF
pF
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CPD
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
9
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
11
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NLX2G86
tf = 3 ns
tf = 3 ns
INPUT
A and B
90%
50%
VCC or GND
VCC
90%
50%
10%
10%
tPHL
OUTPUT
INPUT
GND
RL
CL
tPLH
VOH
OUTPUT Y
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
50%
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
NLX2G86MUTCG
Package Type
Tape and Reel Size†
UQFN8
(Pb−Free)
3000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLX2G86
PACKAGE DIMENSIONS
UQFN8
MU SUFFIX
CASE 523AN−01
ISSUE O
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉ
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÉÉÉ
MOLD CMPD
EXPOSED Cu
E
A1
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DETAIL B
DIM
A
A1
A3
b
D
E
e
L
L1
L3
OPTIONAL
CONSTRUCTION
2X
0.10 C
TOP VIEW
L1
(A3)
DETAIL B
L3
A
0.05 C
b
0.05 C
SIDE VIEW
(0.10)
C
A1
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.60 BSC
0.50 BSC
0.35
0.45
−−−
0.15
0.25
0.35
(0.15)
SOLDERING FOOTPRINT*
DETAIL A
OPTIONAL
CONSTRUCTION
1.70
0.50
PITCH
8X
8X
L3
L
1
e
5
3
0.35
1
DETAIL A
1.70
7
8
8X
b
0.10 C A B
BOTTOM VIEW
0.05 C
7X
0.25
8X
0.53
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
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Phone: 81−3−5773−3850
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLX2G86/D
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