NLX1G74 Single D Flip-Flop The NLX1G74 is a high performance, full function edge−triggered D Flip−Flop in ultra−small footprint. The NLX1G74 input structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com Features • • • • • • • • Extremely High Speed: tPD = 2.6 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation MARKING DIAGRAM Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C 1 24 mA Balanced Output Sink and Source Capability at VCC = 3.0 V 8 1 UQFN8 MU SUFFIX CASE 523AN Balanced Propagation Delays AA MG G Overvoltage Tolerant (OVT) Input Pins Ultra Small Package AA = Device Code M = Date Code* G = Pb−Free Package This is a Pb−Free Device (Note: Microdot may be in either location) PINOUT DIAGRAM TRUTH TABLE Inputs CP 7 Outputs PR CLR CP D Q Q Operating Mode L H L H L L X X X X X X H L H L H H Asynchronous Set Asynchronous Clear Undetermined H H H H ↑ ↑ h l H L L H Load and Read Register H H ↑ X NC NC Hold = High Voltage Level = High Voltage Level One Setup Time Prior to the Low−to−High Clock Transition L = Low Voltage Level l = Low Voltage Level One Setup Time Prior to the Low−to−High Clock Transition NC = No Change X = High or Low Voltage Level and Transitions are Acceptable ↑ = Low−to−High Transition ↑ = Not a Low−to−High Transition For ICC reasons, DO NOT FLOAT Inputs D 6 Q 5 VCC 8 4 GND 1 PR H h 2 3 CLR Q LOGIC DIAGRAM PR 1 D 6 3 Q CP 7 5 Q 2 CLR VCC = 8, GND = 4 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2009 April, 2009 − Rev. 0 1 Publication Order Number: NLX1G74/D NLX1G74 MAXIMUM RATINGS Symbol Value Unit DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage − Output in High or Low State (Note 1) −0.5 to VCC +0.5 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C °C VCC Parameter TL Lead Temperature, 1 mm from Case for 10 Seconds 260 TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) VESD Level 1 UL 94 V−0 @ 0.125 in >2000 >200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm X 1 inch, 2 ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Max Unit 1.65 1.5 5.5 5.5 V VI Input Voltage (Note 6) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V TA Operating Free−Air Temperature −40 +85 °C Dt/DV Input Transition Rise or Fall Rate 0 0 0 20 10 5.0 ns/V VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. ORDERING INFORMATION Device NLX1G74MUTCG Package Shipping† UQFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NLX1G74 DC ELECTRICAL CHARACTERISTICS TA = 25_C VCC Symbol VIH VIL Parameter Condition High−Level Input Voltage Low−Level Input Voltage (V) Min 1.65 0.75 VCC 0.75 VCC 2.3 to 5.5 0.7 VCC 0.7 VCC Max Min Max 1.65 0.25 VCC 0.25 VCC 0.3 VCC 0.3 VCC High−Level Output Voltage VIN = VIL or VIL IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4.0 0.008 0.10 0.12 0.15 0.19 0.30 0.30 Unit V 2.3 to 5.5 VOH IIN Typ *40_C v TA v 85_C VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V Input Leakage Current VIN = VCC or GND 5.5 $0.1 $1.0 mA IOFF Power off Input Leakage Current 5.5V or VIN = GND 0 1.0 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 1.0 10 mA http://onsemi.com 3 NLX1G74 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ Î ÎÎÎ ÎÎ Î ÎÎÎ ÎÎ ÎÎÎ Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎ Î ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ Î ÎÎÎ ÎÎ Î ÎÎÎ ÎÎ ÎÎÎ Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25°C Symbol fMAX tPLH, tPHL tPLH, tPHL tS tH tW tREC Parameter Maximum Clock Frequency (50% Duty Cycle) (Waveform 1) Propagation Delay, CP to Q or Q (Waveform 1) Propagation Delay, PR or CLR to Q or Q (Waveform 2) Setup Time, D to CP (Waveform 1) Hold Time, D to CP (Waveform 1) Pulse Width, CP, CLR, PR (Waveform 3) Recover Time PR; CLR to CP (Waveform 3) VCC (V) 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 1.8 ± 0.15 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 Test Conditions CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open CL = 15 pF RD = 1 MW S1 = Open CL = 50 pF, RD = 500 W, S1 = Open Min 75 150 200 250 175 200 2.5 1.5 1.0 0.8 1.0 1.0 2.5 1.5 1.0 0.8 1.0 1.0 6.5 3.5 2.0 1.5 2.0 1.5 0.5 0.5 0.5 0.5 0.5 0.5 6.0 4.0 3.0 2.0 3.0 2.0 8.0 4.5 3.0 3.0 3.0 3.0 Typ 6.5 3.8 2.8 2.2 3.4 2.6 6.5 3.8 2.8 2.2 3.4 2.6 TA = −40 to 85°C Max 12.5 7.5 6.5 4.5 7.0 5.0 14 9.0 6.5 5.0 7.0 5.0 Min 75 150 200 250 175 200 2.5 1.5 1.0 0.8 1.0 1.0 2.5 1.5 1.0 0.8 1.0 1.0 6.5 3.5 2.0 1.5 2.0 1.5 0.5 0.5 0.5 0.5 0.5 0.5 6.0 4.0 3.0 2.0 3.0 2.0 8.0 4.5 3.0 3.0 3.0 3.0 Max Unit MHz 13 8.0 7.0 5.0 7.5 5.5 14.5 9.5 7.0 5.5 7.5 5.5 ns ns ns ns ns MHz 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 2 (per flip−flop). CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. CAPACITANCE (Note 8) Symbol Condition Typical Unit Input Capacitance VCC = 5.5 V 7.0 pF COUT Output Capacitance VCC = 5.5 V 7.0 pF CPD Power Dissipation Capacitance (Note 9) Frequency = 10 MHz VCC = 3.3 V VCC = 5.0 V 16 21 pF CIN Parameter 8. TA = +25°C, f = 1 MHz 9. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. (See Figure 1) CPD is related to ICCD dynamic operating current by the expression: ICCD = CPD VCC fin + ICC(static). http://onsemi.com 4 NLX1G74 Vcc D 50% 0V th ts Vcc tw CP 50% 0V fmax tPLH, tPHL VOH Q, Q 50% VOL WAVEFORM 1 − PROPAGATION DELAYS, SETUP AND HOLD TIMES tR = tF = 3.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc PR 50% 0V Vcc CLR 50% 0V tPLH tPHL Q 50% 50% VOL VOH tPLH Q 50% tPHL 50% WAVEFORM 2 − PROPAGATION DELAYS tR = tF = 3.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns PR, CLR Vcc tw 50% 0V trec Vcc 50% CP tw 0V WAVEFORM 3 − RECOVERY TIME tR = tF = 3.0 ns from 10% to 90%; f = 1 MHz; tw = 500 ns Output Reg: VOL ≤ 0.8 V, VOH ≥ 2.0 V Figure 1. AC Waveforms VCC PULSE GENERATOR DUT RT CL Figure 2. Test Circuit http://onsemi.com 5 RL NLX1G74 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ MOLD CMPD EXPOSED Cu E A1 ÇÇÇ ÉÉÉ A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 (0.15) DETAIL A OPTIONAL CONSTRUCTION 8X 8X L3 L 1.70 5 3 8 8X b 0.10 C A B BOTTOM VIEW 0.50 PITCH 1 7 1 DETAIL A SOLDERING FOOTPRINT* e 0.05 C 0.35 1.70 NOTE 3 7X 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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