DSN2, 1.6x0.8, 0.9P (0603)

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DSN2, 1.6x0.8, 0.9P, (0603)
CASE 152AB−01
ISSUE B
DATE 03 JAN 2011
SCALE 8:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
0.05 C
A B
D
DIM
A
A1
b
D
E
L
L2
L3
E
0.05 C
TOP VIEW
0.05 C
A
0.05 C
A1
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.25
0.31
−−−
0.05
0.55
0.65
1.60 BSC
0.80 BSC
1.45
1.55
0.90
1.00
0.25
0.35
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
PIN 1
XXXX
YYY
0.05 C A B
L
L/2
b
1
XXXX
YYY
0.05 C A B
L2
L3
BOTTOM VIEW
= Specific Device Code
= Year Code
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
CATHODE BAND MONTH CODING
MOUNTING FOOTPRINT*
DEC
1.70
SEP
0.52
0.80
MAR
FEB
JAN
PIN 1
0.70
1.05
DIMENSIONS: MILLIMETERS
See Application Note AND8464/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
JUN
98AON40452E
NOV OCT
XXXX
YYY
XXXX
Y09
DEVICE CODE
YEAR CODE
(EXAMPLE)
INDICATES AUG 2009
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DSN2, 1.6X0.8, 0.9P, (0603)
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON40452E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
17 JUN 2009
A
ADDED PIN 1 DESIGNATOR TO SOLDER FOOTPRINT. REQ. BY E. ROMERO.
18 MAR 2010
B
CHANGED APPLICATION NOTE REFERENCE IN SOLDER FOOTPRINT NOTE TO
AND8464/D. REQ. BY S. SHACKELL.
03 JAN 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 01B
Case Outline Number:
152AB
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