2000 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
FIRST QUARTER 2001
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3
4. Data Retention Bake (sorted by product family)
4
5. Data Retention Bake (sorted by technology)
5
6. Temperature Cycle
6-7
7. Temperature Humidity Bias & HAST
8-9
8. Steam Pressure Pot
10-11
9. Failure Description Detail
12
10. Failure Rate Calculations
13
11. Definitions
14
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
From:
Date:
Pete Cannon
March 16, 2001
Data reporting: Lovia Gomulia
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests
to ensure that the reliability has not deteriorated over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C)
3 Failure Rate: 17 FITS (2.2M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Also, Thermal and Voltage Acceleration are used to compute the overall acceleration
factor. Weighted acceleration factors (WAF) for a group of products are calculated by
taking a weighted average of each device’s AF multiplied by the corresponding sample
size. See page 10 for a more detailed description of the FIT rate calculation methodology.
2.
Data Retention Bake (150°C)
3 Failure Rate: 3 FITS (1.2M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Since there is no bias applied during testing and the stress temperature is fixed for all
devices at 150°C, the acceleration factor is 259 for all groupings.
3.
Temperature Cycle (-65°C to 150°C)
3 Failure Rate: 0.0% (0 failures out of 1,320)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH)
3 Failure Rate: 0.0% (1.8M device-hours)
3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH)
3 Failure Rate: 0.0% (0 failures out of 1,480)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
1
High Temperature Operating Life
(sorted by FAMILY)
FAMILY
QTR
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours WAF
EFR PPM
FITS
ASIC
4
LAST 4Q
0
0
967
5,946
1
1
567
3,834
0
0
521
3,688
0
2
176
2,149
375,428
3,044,404
71
98
0
0
76
14
D-FLASH
4
LAST 4Q
0
300
0
90
0
90
0
90
100,080
71
0
129
EEPROM
4
LAST 4Q
0
0
8,376
47,982
0
0
800
3,599
0
0
800
3,098
0
0
800
3,098
1,163,648
5,312,552
50
50
0
0
16
3
EPLD
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
438,400
28
137
0
0
299
15
EPROM
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
438,400
60
125
0
0
139
17
FLASH
4
LAST 4Q
0
0
900
2,100
0
0
300
690
0
0
300
690
0
0
300
690
328,800
757,680
67
105
0
0
42
12
MICRO
4
LAST 4Q
0
0
223
1,123
0
0
100
418
0
0
100
408
0
0
100
391
105,904
435,020
76
144
0
0
114
15
ATMEL
4
LAST 4Q
0
0
11,066
59,851
1
1
1,967
9,431
0
0
1,921
8,774
0
2
1,576
7,218
2,192,980
10,526,536
54
62
0
0
17
6
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
56K
4
LAST 4Q
0
0
300
1,425
0
0
100
621
0
0
100
621
0
1
100
621
109,600
659,592
55K
4
LAST 4Q
0
0
77
816
1
1
77
815
0
0
76
814
0
1
76
814
42K
4
LAST 4Q
0
0
100
1,300
0
0
100
793
0
0
100
793
0
37K
4
LAST 4Q
0
0
600
1,800
0
0
200
580
0
0
200
580
34K
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
26K
4
LAST 4Q
0
0
300
1,200
0
0
100
400
4
LAST 4Q
0
0
100
400
0
0
4
LAST 4Q
0
400
19K
4
LAST 4Q
0
0
15K
4
LAST 4Q
ATMEL
4
LAST 4Q
25K
24K
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours WAF
EFR PPM
FITS
41
53
0
0
204
58
76,168
814,216
109
111
0
0
244
34
0
50,000
420,836
204
204
0
0
90
11
0
0
200
580
219,200
638,560
66
82
0
0
63
17
100
400
0
0
100
400
109,600
438,400
60
125
0
0
139
17
0
0
100
400
0
100
59,600
288,400
41
41
0
0
375
77
100
400
0
0
100
400
0
100
50,000
250,000
41
41
0
0
447
89
0
400
0
300
0
200
266,800
103
0
33
5,493
22,738
0
0
990
4,322
0
0
945
3,766
0
0
900
3,703
1,146,204
4,711,876
61
71
0
0
13
3
0
0
3,796
28,572
0
0
200
700
0
0
200
700
0
0
200
700
372,608
2,037,856
38
44
0
0
65
10
0
0
11,066
59,851
1
1
1,967
9,431
0
0
1,921
8,774
0
2
1,576
7,218
2,192,980
10,526,536
54
62
0
0
17
6
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
Data Retention Bake
(sorted by FAMILY)
FAMILY
QTR
ASIC
4
LAST 4Q
0
231
0
231
0
4
LAST 4Q
0
100
0
100
EEPROM
4
LAST 4Q
0
0
850
3,000
0
0
EPLD
4
LAST 4Q
0
0
50
300
EPROM
4
LAST 4Q
0
0
FLASH
4
LAST 4Q
MICRO
ATMEL
D-FLASH
Device-Hours
AF
FITS
100
165,500
259
21
0
100
100,000
259
35
850
3,000
0
0
850
3,000
850,000
3,000,000
259
259
4
1
0
0
50
300
0
0
50
300
50,000
300,000
259
259
71
12
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
0
0
200
500
0
0
198
498
0
0
198
498
198,336
498,336
259
259
18
7
4
LAST 4Q
0
0
100
250
0
0
100
250
0
0
100
250
100,000
250,000
259
259
35
14
4
LAST 4Q
0
0
1,250
4,581
0
0
1,248
4,579
0
0
1,248
4,448
1,248,336
4,513,836
259
259
3
1
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
Device-Hours
AF
FITS
42K
4
LAST 4Q
0
231
0
231
0
100
165,500
259
21
37K
4
LAST 4Q
0
0
150
500
0
0
149
499
0
0
149
499
149,168
499,168
259
259
24
7
34K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
19K
4
LAST 4Q
0
0
850
3,050
0
0
849
3,049
0
0
849
3,049
849,168
3,049,168
259
259
4
1
15K
4
LAST 4Q
0
0
200
600
0
0
200
600
0
0
200
600
200,000
600,000
259
259
18
6
ATMEL
4
LAST 4Q
0
0
1,250
4,581
0
0
1,248
4,579
0
0
1,248
4,448
1,248,336
4,513,836
259
259
3
1
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Temperature Cycle
PACKAGE
QTR
BCC
4
LAST 4Q
0
0
231
693
0
0
231
693
0.0%
0.0%
BQFP
4
LAST 4Q
0
100
0
100
0.0%
CBGA
4
LAST 4Q
0
0
50
100
0
0
50
100
0.0%
0.0%
DBGA
4
LAST 4Q
0
0
77
77
0
0
77
77
0.0%
0.0%
DIP
4
LAST 4Q
0
0
77
154
0
0
77
154
0.0%
0.0%
LAP
4
LAST 4Q
0
150
0
150
0.0%
PDIP
4
LAST 4Q
0
0
150
427
0
0
150
427
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
177
730
0
0
177
730
0.0%
0.0%
PQFP
4
LAST 4Q
0
50
0
50
0.0%
4
LAST 4Q
0
77
0
77
0.0%
SOIC
4
LAST 4Q
0
0
408
1,016
0
0
408
1,016
0.0%
0.0%
TQFP
4
LAST 4Q
0
0
50
350
0
0
50
350
0.0%
0.0%
TSOP
4
LAST 4Q
0
0
100
350
0
0
100
350
0.0%
0.0%
TSSOP
4
LAST 4Q
0
127
0
127
0.0%
SBDIP
200 Cycles
REJ
SS
1K Cycles
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
VQFP
4
LAST 4Q
0
50
0
50
0.0%
4
LAST 4Q
0
50
0
50
0.0%
4
LAST 4Q
0
0
1,320
4,501
0
0
1,320
4,501
0.0%
0.0%
VSOP
ATMEL
200 Cycles
REJ
SS
1K Cycles
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
Temperature Humidity Bias
PACKAGE
QTR
BCC
4
LAST 4Q
0
0
231
924
0
0
231
924
0
0
231
924
0
4
LAST 4Q
0
100
0
100
0
100
4
LAST 4Q
0
0
0
0
0
0
4
LAST 4Q
0
0
100
100
0
0
100
100
0
0
100
100
4
LAST 4Q
0
150
0
150
0
4
LAST 4Q
0
100
0
100
PLCC
4
LAST 4Q
0
0
100
350
0
0
PQFP
4
LAST 4Q
0
50
4
LAST 4Q
0
SOIC
4
LAST 4Q
TQFP
BQFP
CBGA
DBGA
LAP
PDIP
SBDIP
TSOP
TSSOP
UBGA
168 Hours
REJ
SS
500 Hours
REJ
SS
HAST
1K Hours
REJ
SS
100 Hours
REJ
SS
Device-Hours
% Defective
0
231,000
924,000
0.0%
0.0%
0
0
100,000
0.0%
0
50
100,000
0.0%
0
0
100,000
100,000
0.0%
0.0%
150
0
0
150,000
0.0%
0
100
0
0
150
350
300,000
800,000
0.0%
0.0%
100
350
0
0
100
350
0
0
100
444
300,000
1,238,000
0.0%
0.0%
0
50
0
50
0
0
50,000
0.0%
200
0
200
0
200
0
0
200,000
0.0%
0
0
550
1,200
0
0
550
1,200
0
0
550
1,200
0
0
50
100
650,000
1,400,000
0.0%
0.0%
4
LAST 4Q
0
0
50
300
0
0
50
300
0
0
50
300
0
50
50,000
400,000
0.0%
0.0%
4
LAST 4Q
0
0
0
0
0
0
0
0
98
348
196,000
696,000
0.0%
0.0%
4
LAST 4Q
0
150
0
150
0
150
0
0
150,000
0.0%
4
LAST 4Q
0
0
0
0
0
0
0
50
100,000
0.0%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Temperature Humidity Bias / HAST
Temperature Humidity Bias
PACKAGE
QTR
VQFP
4
LAST 4Q
0
0
0
0
0
0
0
4
LAST 4Q
0
0
0
0
0
0
4
LAST 4Q
0
0
1,031
3,624
0
0
1,031
3,624
0
0
1,031
3,624
VSOP
ATMEL
168 Hours
REJ
SS
500 Hours
REJ
SS
HAST
1K Hours
REJ
SS
100 Hours
REJ
SS
Device-Hours
% Defective
50
100,000
0.0%
0
50
100,000
0.0%
0
0
398
1,492
1,827,000
6,608,000
0.0%
0.0%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Steam Pressure Pot
PACKAGE
QTR
BCC
4
LAST 4Q
0
0
231
693
0.0%
0.0%
BQFP
4
LAST 4Q
0
100
0.0%
CBGA
4
LAST 4Q
0
0
50
99
0.0%
0.0%
DBGA
4
LAST 4Q
0
0
100
100
0.0%
0.0%
DIP
4
LAST 4Q
0
0
100
200
0.0%
0.0%
LAP
4
LAST 4Q
0
150
0.0%
PDIP
4
LAST 4Q
0
0
149
449
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
200
797
0.0%
0.0%
PQFP
4
LAST 4Q
0
50
0.0%
4
LAST 4Q
0
100
0.0%
SOIC
4
LAST 4Q
0
0
500
1,200
0.0%
0.0%
TQFP
4
LAST 4Q
0
0
50
350
0.0%
0.0%
TSOP
4
LAST 4Q
0
0
100
350
0.0%
0.0%
TSSOP
4
LAST 4Q
0
150
0.0%
SBDIP
168 Hours
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Steam Pressure Pot
PACKAGE
QTR
VQFP
4
LAST 4Q
0
50
0.0%
4
LAST 4Q
0
50
0.0%
4
LAST 4Q
0
0
1,480
4,888
0.0%
0.0%
VSOP
ATMEL
168 Hours
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Failure Description Detail
Q1 - 2000
a.
High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 55K, DIL
48: Read1 and read boot failures.
Q2 - 2000
a.
High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K,
FBGA 280: Root cause investigation currently in progress.
Q4 - 2000
a.
High Temperature Operating Life, 1 failure, 168-hour read point, ASIC, 55K, DIL
24: Root cause investigation currently in progress.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12
Failure Rate Calculations
Failure Rate:
χ2
λ
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
=
α
(1 −
, 2⋅n + 2 )
100
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= e Z⋅
[ VS
− Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
13
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage
(commonly 30% above nominal), and dynamic bias conditions. Readouts at
various time points are taken to determine the Early Failure Rate (EFR) and
Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million
(DPPM) and IFR is expressed in Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
14
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