2003 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
FIRST QUARTER 2004
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product family)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7. Temperature Humidity Bias & HAST
8. Steam Pressure Pot
9. Failure Description Detail
7-8
9
10
11-12
10. Technology List
13
11. Failure Rate Calculations
14
12. Definitions
15
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
March 15, 2004
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests
to ensure that the reliability has not deteriorated over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C)1
3 Failure Rate: 2 FITS (4.9M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Also, Thermal and Voltage Acceleration are used to compute the overall acceleration
factor. Weighted acceleration factors (WAF) for a group of products are calculated by
taking the weighted average of each device’s acceleration factor multiplied by its
corresponding device hours.
2.
Data Retention Bake (150°C)
3 Failure Rate: 12 FITS (304K device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Since there is no bias applied during testing and the stress temperature is fixed for all
devices at 150°C, the acceleration factor is 259 for all groupings.
3.
Temperature Cycle (-65°C to 150°C) *
3 Failure Rate: 0.17% (3 failure out of 1,729)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
3 Failure Rate: 0.00% (0 failures out of 1.3M device-hours)
3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
3 Failure Rate: 0.00% (0 failures out of 822)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1 junction temperatures may reach up to 200° C.
1
High Temperature Operating Life
(sorted by FAMILY)
FAMILY
48 Hours
QTR
REJ
ASIC
CCD
D-FLASH
DSP
EEPROM
EPLD
EPROM
FLASH
RF & Auto
MICRO
S-CARD
SRAM
VAN DLC
ATMEL
168 Hours
SS
REJ
500 Hours
SS
REJ
1K Hours
SS
REJ
Device-Hours*
WAF
EFR PPM
FITS
SS
4
0
787
0
603
0
501
0
335
443,968
28
0
75
LAST 4Q
0
7,377
0
3,495
0
2,516
0
2,216
4,134,644
53
0
4
4
0
44
0
44
0
44
0
44
44,000
78
0
267
LAST 4Q
0
101
0
101
0
81
0
81
111,812
77
0
106
4
0
300
0
100
0
100
0
99
109,100
21
0
397
LAST 4Q
0
1,199
0
400
0
400
0
399
652,652
72
0
19
4
0
45
0
45
0
45
0
45
45,000
3
0
8,021
LAST 4Q
0
45
0
45
0
45
0
45
45,000
3
0
8,021
4
0
2,650
0
700
0
700
0
700
793,600
85
0
14
LAST 4Q
0
29,754
0
2,500
0
2,500
0
2,400
4,996,992
43
0
4
4
0
300
0
100
0
100
0
100
109,600
348
0
24
LAST 4Q
0
1,200
0
400
0
400
0
400
653,200
80
0
18
4
0
300
0
100
0
100
0
100
109,600
21
0
395
LAST 4Q
0
1,200
0
400
0
400
0
400
653,200
111
0
13
4
0
600
0
200
0
200
0
200
219,200
348
0
12
LAST 4Q
0
1,500
0
500
0
500
0
500
762,800
197
0
6
4
0
2,297
0
2,297
0
1,112
0
1,112
2,265,080
290
0
1
LAST 4Q
0
10,824
0
10,354
0
4,961
0
4,961
12,996,224
318
0
0
4
1
7,600
0
190
0
145
0
145
508,240
14
132
295
LAST 4Q
1
10,306
0
978
0
905
0
790
1,795,512
60
97
19
LAST 4Q
0
45
0
45
0
0
0
0
9,720
66
0
1,428
4
4
0
256
0
90
0
90
0
90
97,968
5
0
1,997
LAST 4Q
0
642
0
190
0
185
0
135
225,796
4
0
1,071
4
0
1,011
0
145
0
145
0
145
186,568
4
0
1,332
LAST 4Q
0
3,206
0
570
0
565
0
365
793,328
3
0
378
4
1
16,190
0
4,614
0
3,282
0
3,115
4,931,924
176
62
2
LAST 4Q
1
67,399
0
19,978
0
13,458
0
12,692
27,830,880
73
15
1
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
308
385,000
600
0
4
0
0
290
560
867,240
1,477,908
119
71
121
95
20
19
135
290
0
0
135
240
142,968
373,756
4
3
0
0
1,599
708
0
0
45
290
0
0
45
90
52,968
300,868
4
3
0
0
4,865
1,059
461
0
76
0
76
392,936
133
0
18
0
0
691
2,254
0
0
267
1,034
0
0
267
1,034
605,232
3,272,132
259
341
0
0
6
1
150
1,045
0
0
150
1,045
0
0
75
433
0
0
75
433
162,600
1,445,104
258
321
0
0
22
2
0
45
0
45
0
45
0
45
77,220
78
0
152
0
0
317
1,258
0
0
317
1,098
0
0
80
390
0
0
80
390
199,816
994,192
258
323
0
18
LAST 4Q
0
3
4
LAST 4Q
0
273
0
273
0
273
0
273
468,468
111
0
18
HCCD
4
LAST 4Q
0
0
44
101
0
0
44
101
0
0
44
81
0
0
44
81
44,000
111,812
78
77
0
0
267
107
CMOS
4
LAST 4Q
0
0
45
120
0
0
45
120
0
0
45
45
0
0
45
45
45,000
61,200
8
26
0
0
2,545
576
BCDMOS
4
LAST 4Q
0
0
338
1,613
0
0
338
1,613
0
0
158
953
0
0
158
953
188,240
2,416,240
600
398
0
0
8
1
BICMOS
4
LAST 4Q
0
0
713
3,412
0
0
713
3,102
0
0
342
1,607
0
0
342
1,607
746,328
3,792,628
263
353
0
0
5
1
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
539
0
539
0
308
0
Z92
4
LAST 4Q
1
1
8,245
10,479
0
0
335
809
0
0
290
605
Z91
4
LAST 4Q
0
0
301
747
0
0
135
295
0
0
Z86
4
LAST 4Q
0
0
211
1,011
0
0
45
295
UNI
4
LAST 4Q
0
461
0
UHF
4
LAST 4Q
0
0
691
2,254
SIGE
4
LAST 4Q
0
0
NMOS
4
LAST 4Q
Z95
I2L
HCMOS
4
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
300
757,104
70
0
17
0
0
135
435
135,000
649,800
1
26
0
0
6,787
54
366
1,023
0
0
200
742
291,832
1,447,572
36
44
0
0
87
14
0
133
0
44
151,396
62
0
98
90
0
60
0
60
60,000
259
0
59
0
400
0
400
0
400
686,400
95
0
14
300
1,199
0
0
100
400
0
0
100
400
0
0
99
399
109,100
652,652
21
92
0
0
397
15
0
0
400
1,100
0
0
200
500
0
0
200
500
0
0
200
500
209,600
743,600
223
153
0
0
20
8
4
LAST 4Q
0
0
1,400
7,444
0
0
300
1,000
0
0
300
977
0
0
300
877
352,800
1,676,012
142
61
0
0
18
9
34K
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
653,200
21
111
0
0
395
13
26K
4
LAST 4Q
0
100
0
100
0
100
0
100
171,600
33
0
162
19K
4
LAST 4Q
0
0
1,950
21,082
0
0
500
2,100
0
0
500
2,100
0
0
500
2,100
569,600
4,156,736
136
69
0
0
12
3
15K
4
LAST 4Q
0
100
0
100
0
100
0
100
100,000
93
0
4,028
0
200
0
200
0
200
455,344
38
0
0
98
54
4
LAST 4Q
1
1
16,190
67,399
0
0
4,614
19,978
0
0
3,282
13,458
0
0
3,115
12,692
4,931,924
27,830,880
176
73
62
15
2
1
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
4,298
0
600
0
300
0
57K
4
LAST 4Q
0
0
135
435
0
0
135
435
0
0
135
435
56K
4
LAST 4Q
0
0
550
2,282
0
0
366
1,569
0
0
55K
4
LAST 4Q
0
383
0
134
4
LAST 4Q
0
90
0
4
LAST 4Q
0
400
39K
4
LAST 4Q
0
0
37K
4
LAST 4Q
35K
58K
46K
42K
ATMEL
* The Device-Hours computation includes a few 5,000-hour read-outs.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
FAMILY
168 Hours
QTR
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
D-FLASH
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
EEPROM
4
LAST 4Q
0
1,500
0
1,500
0
1,500
1,500,000
259
2
EPLD
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
EPROM
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
FLASH
4
LAST 4Q
0
0
100
250
0
0
100
250
0
0
100
250
100,000
250,000
259
259
35
14
MICRO
4
LAST 4Q
0
0
50
277
0
0
50
277
0
0
50
200
50,000
238,500
259
259
71
15
VAN DLC
4
LAST 4Q
0
127
0
127
0
77
102,000
259
35
4
LAST 4Q
0
0
304
2,758
0
0
304
2,758
0
0
304
2,631
304,000
2,694,500
259
259
12
1
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
Device-Hours
AF
FITS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
204
0
204
0
77
140,500
259
25
39K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
37K
4
LAST 4Q
0
0
50
250
0
0
50
250
0
0
50
250
50,000
250,000
259
259
71
14
35K
4
LAST 4Q
0
0
100
700
0
0
100
700
0
0
100
700
100,000
700,000
259
259
35
5
34K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
19K
4
LAST 4Q
0
0
50
1,100
0
0
50
1,100
0
0
50
1,100
50,000
1,100,000
259
259
71
3
15K
4
LAST 4Q
0
100
0
100
0
100
100,000
259
35
4
LAST 4Q
0
0
304
2,758
0
0
304
2,758
0
0
304
2,631
304,000
2,694,500
259
259
12
1
Z92
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
200 Cycles
500 Cycles
1K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
308
0
308
0
308
0.00%
CASON
4
LAST 4Q
0
0
50
50
0
0
50
50
0
0
50
50
0.00%
0.00%
CBGA
4
LAST 4Q
0
77
0
77
0
77
0.00%
CERQUAD
4
LAST 4Q
0
0
35
35
0
0
35
35
0
0
0
0
0.00%
0.00%
CPGA
4
LAST 4Q
0
77
0
77
0
77
0.00%
4
LAST 4Q
0
77
0
77
0
77
0.00%
MLF / QFN
4
LAST 4Q
0
0
481
558
0
0
442
519
3
3
442
519
0.62%
0.54%
PBGA
4
LAST 4Q
0
77
0
77
0
77
0.00%
PDIP
4
LAST 4Q
0
0
50
431
0
0
50
428
0
0
50
428
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
204
604
0
0
204
604
0
0
127
527
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
563
1,451
0
0
524
1,226
0
0
524
1,226
0.00%
0.00%
BCC
FBGA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Cycle
PACKAGE
QTR
200 Cycles
500 Cycles
1K Cycles
REJ
SS
REJ
SS
REJ
SS
% Defective
SSOP
4
LAST 4Q
0
0
119
291
0
0
119
245
0
0
119
245
0.00%
0.00%
TQFP
4
LAST 4Q
0
50
0
50
0
50
0.00%
TSOP
4
LAST 4Q
0
0
150
450
0
0
150
450
0
0
150
450
0.00%
0.00%
VQFP
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
0
0
0.00%
0.00%
ATMEL
4
LAST 4Q
0
0
1,729
4,613
0
0
1,651
4,300
3
3
1,462
4,111
0.17%
0.07%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Temperature Humidity Bias / HAST
Temperature Humidity Bias
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
HAST
100 Hours
REJ
SS
PACKAGE
QTR
BCC
4
LAST 4Q
0
308
0
308
0
308
0
0
0
308,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
0
50
50
100,000
100,000
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
0
77,000
0.00%
0
77
0
77
0
77
0
0
0
77,000
0.00%
0
0
0
0
0
0
0
0
75
152
150,000
304,000
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
0
77,000
0.00%
4
LAST 4Q
0
300
0
300
0
300
0
0
50
200
100,000
700,000
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
177
277
0
0
177
277
0
0
100
150
0
0
50
350
238,500
913,500
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
149
853
0
0
149
853
0
0
149
649
0
177
149,000
1,105,000
0.00%
0.00%
SSOP
4
LAST 4Q
0
0
42
92
0
0
42
92
0
0
42
92
0
0
77
154
196,000
400,000
0.00%
0.00%
TQFP
4
LAST 4Q
0
0
0
0
0
0
0
50
0
100,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
0
150
350
300,000
700,000
0.00%
0.00%
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
0
0
0
0
38,500
38,500
0.00%
0.00%
4
LAST 4Q
0
0
445
2,138
0
0
445
2,138
0
0
291
1,730
0
0
452
1,483
1,272,000
4,900,000
0.00%
0.00%
CASON
CBGA
FBGA
MLF / QFN
PBGA
PDIP
TSOP
VQFP
ATMEL
4
LAST 4Q
4
LAST 4Q
Device-Hours* % Defective
* The Device-Hours computation includes a few 500-hour read-outs.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Steam Pressure Pot
PACKAGE
QTR
BCC
4
LAST 4Q
0
562
0
331
0
0
0.0%
4
LAST 4Q
0
100
0
100
0
0
0.0%
CASON
4
LAST 4Q
0
0
50
50
0
0
50
50
0
0
50
50
0.0%
0.0%
CBGA
4
LAST 4Q
0
154
0
477
0
0
0.0%
4
LAST 4Q
0
200
0
200
0
0
0.0%
4
LAST 4Q
0
100
0
100
0
0
0.0%
4
LAST 4Q
0
154
0
77
0
0
0.0%
4
LAST 4Q
0
100
0
100
0
0
0.0%
4
LAST 4Q
0
200
0
200
0
0
0.0%
4
LAST 4Q
0
154
0
77
0
0
0.0%
4
LAST 4Q
0
0
50
477
0
0
50
604
0
0
50
50
0.0%
0.0%
BQFP
CPGA
CQFP
FBGA
ICMOD
LQFP / VQFP
PBGA
PDIP
96 Hours
REJ
SS
168 Hours
REJ
SS
240 Hours
REJ
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
% Defective
10
Steam Pressure Pot
PACKAGE
QTR
PLCC
4
LAST 4Q
0
0
227
727
0
0
150
500
0
0
50
50
0.0%
0.0%
PQFP
4
LAST 4Q
0
200
0
200
0
0
0.0%
4
LAST 4Q
0
0
226
1,007
0
604
0
0
0.0%
0.0%
4
LAST 4Q
0
0
42
87
0
0
0
0
0.0%
0.0%
4
LAST 4Q
0
50
0
0
0
0
0.0%
TSOP
4
LAST 4Q
0
0
150
346
0
0
150
346
0
0
149
149
0.0%
0.0%
TSSOP
4
LAST 4Q
0
200
0
200
0
0
0.0%
4
LAST 4Q
0
0
77
77
0
0
0
0
0.0%
0.0%
4
LAST 4Q
0
0
822
4,945
0
0
400
4,166
0
0
299
299
0.00%
0.00%
SOIC
SSOP
TQFP
VQFP
ATMEL
96 Hours
REJ
SS
168 Hours
REJ
SS
240 Hours
REJ
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
% Defective
11
Failure Description Detail
Q4-2003
a. Temperature Cycle, 3 failures, 1000 cycle read point, RF & Auto, 6UH6, MLF/QFN
28. Root Cause: ground bonds were broken. Corrective Action: change bonding
from normal wedge to “stitch on ball”.
b. High Temperature Operating Life, 1 failure, 48 hour read point, Micro, Z92, SSOP
16: Root Cause: passivation scratch. Corrective Action: Implement high voltage
burn in.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µ
µ m]
TYPICAL PRODUCTS / APPLICATIONS
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
7
7
15.3
19.3
19.5
19.6
19.7
19.76
19.8
19.8
19.9
26
33.5
34
35.5
37
39
39.1
42
55
55.8
56
56.8
57.0
58.0
EEPROM
EEPROM
Embedded Memory Configurator
Embedded Memory
EPLD
EPLD
CMOS
Embedded Memory Configurator
Embedded Memory
Logic
FLASH
EPROM
Embedded Memory Configurator
EEPROM
EEPROM
EEPROM
BiCMOS
Logic
CMOS
Logic
Embedded Memory
CMOS
CMOS
1.8 - 2.3
1.1
1.0
0.7
0.5
0.5
0.7
0.7
0.7
0.7
0.5
0.5
0.35
0.35
0.25
0.25
0.6
0.5
0.5
0.35
0.35
0.25
0.18
sEEPROM
sEEPROM
Configurator
sEEPROM, MC (Intel core), MC (AVR core)
PLD
PLD
ASIC
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
ASIC
EPROM
Configurators, sEEPROM, FLASH, Microcontroller, EPLD
FLASH, PEROM, DATA FLASH, sEEPROM
DATA FLASH
FLASH, DATA FLASH
ASIC
ASIC
ASIC
ASIC
ASIC
ASIC
ASIC
7
57.5
BCDMOS
CMOS
6BD1
0.21
ASIC
HNO
0.8
ASIC
HNO
I²L
6IL4
2
ASIC
HNO
SIGE1
6SG1
0.8
ASIC
HNO
UHF
6UH6
0.5
ASIC
GFO
GFO
NTO
NTO
NTO
HCCD1
HCCD3
Z86
Z91
Z92
NMOS
NMOS
CMOS Digital
CMOS Digital
CMOS Digital
2.5
1.5
0.8
0.6
0.5
CCD
CCD
SRAM,MICRO, VAN DLC
SRAM, ASIC, MICRO
ASIC, MICRO,VAN DLC
RELIABILITY MONITOR -- ATMEL PROPRIETARY
13
Failure Rate Calculations
Failure Rate:
χ2
λ
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
=
α
(1 −
, 2⋅n + 2 )
100
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= e Z⋅
[ VS
− Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
14
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
15
Distribution
SJO Engineering
Cheung, Manton
D'Souza, Gladwyn
Do, To Nhi
Hui, Ed
Hwang, Tom
Kuo, Wei-Yen
Lim, Victor
Louie, Carey
Malik, Arun
Mok, Tsung
Pearce, Tim
Phan, Alan
Schumann, Steve
Suciu, Paul
Wong, Jason
Wong, Will
SJO Q & R
Arquero, Felix
Johnson, Jim
Lin, Hao-Chou
Sun, Larry
Webb, Kory
White, Kathy
Woo, Brian
Executive Management
Perlegos, Gust
SJO Sales / Marketing
Bryant, John
Franklin, Dirk
Fulhorst, Paul
Katz, Jeff
Kwong, Ken
Panfil, Jim
Rosenberg, Joel
Sidhu, Anup
Tehrani, Abbas
CSO
Brown, Tom
Johnson, Phil
Streicher, Ray
RFO
Bissonnier, Christelle
Blanchart, Jacques
NFO
Faes, Francois
Houze, Pierre
Lecuyer, Pascal
SJO Operations
Demas, Themi
EUROPE Field Quality
Sinha, Aloke
SJO MFG
Ly, Uyen-Chi
Schleich, Chuck
NORWAY
Vegard, Wollan
SJO Distribution
Furman, Mike
SJO Assembly
Raoofi, Barry
ASIA Marketing
Skar, Haakon
HNO Q&R
Seiler, Josef
Junesch, Otmar
GFO Q&R
Borel, Gerard
Thiebaud, Claude
Please contact Pete Cannon (x4122) if you would like to be added or removed from this distribution
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