5 Line Transient Voltage Suppressor Array

SMF05CT1G, SMF12CT1G,
SMF15CT1G, SMF24CT1G,
SZSMF12CT1G
5-Line Transient Voltage
Suppressor Array
This 5−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as computers, printers, automotive electronics,
networking communication and other applications. This device
features a monolithic common anode design which protects five
independent lines in a single SC−88 package.
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SC−88 FIVE TRANSIENT
VOLTAGE SUPPRESSOR
100 W PEAK POWER
Features
 Protects up to 5−Line in a Single SC−88 Package
 Peak Power Dissipation − 100 W (8 x 20 ms Waveform)
 ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
SC−88
CASE 419B
STYLE 24
and Class C (Exceeding 400 V) per Machine Model.
 Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8 kV (Contact)
 Flammability Rating of UL 94 V−0
 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Packages are Available*
PIN ASSIGNMENT
1
6
2
5
3
4
Applications





Hand−Held Portable Applications
Networking and Telecom
Automotive Electronics
Serial and Parallel Ports
Notebooks, Desktops, Servers
Rating
PPK 1
Peak Power Dissipation
8 x 20 ms Double Exponential Waveform
(Note 1)
TJ
TSTG
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
CATHODE
MARKING DIAGRAM
6
XX MG
G
MAXIMUM RATINGS (TJ = 25C unless otherwise specified)
Symbol
PIN 1.
2.
3.
4.
5.
6.
1
Value
Unit
W
100
Operating Junction Temperature Range
−40 to 125
C
Storage Temperature Range
−55 to 150
C
TL
Lead Solder Temperature (10 s)
260
C
ESD
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
16000
400
15000
15000
V
XX = Specific Device Code
6J = SMF05C
6K = SZSMF12C/SMF12C
6L = SMF15C
6M = SMF24C
M = Date Code
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 3.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. 4
1
Publication Order Number:
SMF05C/D
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
SMF05CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
Typ
(Note 2)
IT = 1 mA, (Note 3)
6.2
0.07
Max
Unit
5.0
V
7.2
V
5.0
mA
Reverse Leakage Current
IR
VRWM = 5 V
Clamping Voltage
VC
IPP = 5 A (8 x 20 ms Waveform)
9.8
V
Clamping Voltage
VC
IPP = 8 A (8 x 20 ms Waveform)
12.5
V
Maximum Peak Pulse Current
IPP
8 x 20 ms Waveform
Capacitance
CJ
VR = 0 V, f = 1 MHz (Line to GND)
8.0
A
80
130
pF
Typ
Max
Unit
12
V
15
V
SMF12CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1 mA, (Note 3)
13.3
Reverse Leakage Current
IR
VRWM = 12 V
0.1
mA
Clamping Voltage
VC
IPP = 3 A (8 x 20 ms Waveform)
0.01
21
V
Clamping Voltage
VC
IPP = 6 A (8 x 20 ms Waveform)
23
V
Maximum Peak Pulse Current
IPP
8 x 20 ms Waveform
6.0
A
Capacitance
CJ
VR = 0 V, f = 1 MHz (Line to GND)
40
60
pF
Typ
Max
Unit
15
V
19
V
1.0
mA
SMF15CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1 mA, (Note 3)
17
Reverse Leakage Current
IR
VRWM = 15 V
0.01
Clamping Voltage
VC
IPP = 1 A (8 x 20 ms Waveform)
23
V
Clamping Voltage
VC
IPP = 5 A (8 x 20 ms Waveform)
29
V
Maximum Peak Pulse Current
IPP
8 x 20 ms Waveform
Capacitance
CJ
VR = 0 V, f = 1 MHz (Line to GND)
5.0
A
33
45
pF
Typ
Max
Unit
24
V
32
V
SMF24CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1 mA, (Note 3)
26.7
Reverse Leakage Current
IR
VRWM = 24 V
1.0
mA
Clamping Voltage
VC
IPP = 1 A (8 x 20 ms Waveform)
0.01
40
V
Clamping Voltage
VC
IPP = 2.5 A (8 x 20 ms Waveform)
44
V
Maximum Peak Pulse Current
IPP
8 x 20 ms Waveform
2.5
A
Capacitance
CJ
VR = 0 V, f = 1 MHz (Line to GND)
25
pF
21
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
4. Include SZ-prefix devices where applicable.
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2
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
TYPICAL PERFORMANCE CURVES
100
100
90
90
% OF PEAK PULSE CURRENT
PEAK POWER DISSIPATION (%)
(TJ = 25C unless otherwise specified)
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
tr
PEAK VALUE IRSM @ 8 ms
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
200
0
20
Figure 1. Pulse Derating Curve
100
SMF24CT1G
SMF15CT1G
SMF12CT1G
SMF05CT1G
10
0
5
10
JUNCTION CAPACITANCE (pF)
VCLAMP, CLAMPING VOLTAGE (V)
80
60
Figure 2. 8  20 ms Pulse Waveform
100
1
40
t, TIME (ms)
TA, AMBIENT TEMPERATURE (C)
SMF05CT1G
10
1
15
SMF12CT1G
SMF15CT1G
SMF24CT1G
0
IPP, PEAK PULSE CURRENT (A)
5
10
15
20
25
VBR, REVERSE VOLTAGE (V)
Figure 3. Clamping Voltage vs Peak Pulse Current
Figure 4. Junction Capacitance vs Reverse Voltage
ORDERING INFORMATION
Package
Shipping†
SMF05CT1G
SC−88
(Pb−Free)
3,000 / Tape & Reel
SMF05CT2G*
SC−88
(Pb−Free)
3,000 / Tape & Reel
SMF12CT1G
SC−88
(Pb−Free)
3,000 / Tape & Reel
SMF15CT1G
SC−88
(Pb−Free)
3,000 / Tape & Reel
SMF24CT1G
SC−88
(Pb−Free)
3,000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*The “T2” suffix refers to an alternate tape & reel orientation.
http://onsemi.com
3
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
e
6
5
4
1
2
3
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
−E−
DIM
A
A1
A3
b
C
D
E
e
L
HE
b 6 PL
0.2 (0.008)
E
M
M
A3
C
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
A
A1
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
SC−88/SC70−6/SOT−363
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
SMF05C/D
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