AT24C16D I2C-Compatible (2-Wire) Serial EEPROM 16-Kbit (2,048 x 8) DATASHEET Features Low Voltage Operation ̶ VCC = 1.7V to 3.6V Internally Organized as 2,048 x 8 (16K) I2C-Compatible (2-Wire) Serial Interface ̶ ̶ 100kHz Standard Mode, 1.7V to 3.6V 400kHz Fast Mode, 1.7V to 3.6V 1MHz Fast Mode Plus (FM+), 2.5V to 3.6V ̶ Schmitt Triggers, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol Write Protect Pin for Full Array Hardware Data Protection Ultra Low Active Current (1mA max) and Standby Current (0.8μA max) 16-byte Page Write Mode ̶ Partial Page Writes Allowed Random and Sequential Read Modes Self-timed Write Cycle Within 5ms Maximum High Reliability ̶ Endurance: 1,000,000 Write Cycles Data Retention: 100 Years ̶ Green Package Options (Lead-free/Halide-free/RoHS Compliant) ̶ 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP,(1) 5-lead SOT23, 8-ball VFBGA, and 4-ball WLCSP Die Sale Options: Wafer Form and Tape and Reel Available Description The Atmel® AT24C16D provides 16,384 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 2,048 words of 8 bits each. This device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The device is available in space-saving 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP(1), 5-lead SOT23, 8-ball VFBGA, and 4-ball WLCSP packages. The entire family of packages operates from 1.7V to 3.6V. Note: 1. Contact Atmel Sales for the availability of this package. Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 1. Pin Descriptions and Pinouts Table 1-1. Pin Descriptions Pin Number Pin Symbol 1, 2, 3 NC 4 GND Asserted State Pin Type No Connect: The NC pins are not bonded to a die pad. These pins can be connected to GND or left floating. — — Ground: The ground reference for the power supply. GND should be connected to the system ground. — Power — Input/ Output — Input High Input — Power Pin Name and Functional Description Serial Data: The SDA pin is an open-drain bidirectional input/output pin used to serially transfer data to and from the device. 5 SDA 6 The SDA pin must be pulled-high using an external pull-up resistor (not to exceed 10K in value) and may be wire-ORed with any number of other open-drain or open-collector pins from other devices on the same bus. Serial Clock: The SCL pin is used to provide a clock to the device and to control the flow of data to and from the device. Command and input data present on the SDA pin is always latched in on the rising edge of SCL, while output data on the SDA pin is clocked out on the falling edge of SCL. SCL The SCL pin must either be forced high when the serial bus is idle or pulled-high using an external pull-up resistor. 7 Write Protect: Connecting the WP pin to GND will ensure normal Write operations. When the WP pin is connected to VCC, all write operations to the memory are inhibited. WP Refer to Note 1 for the behavior of the pin when not connected. 8 Note: Device Power Supply: The VCC pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. VCC 1. If the WP pin is not driven, it is internally pulled down to GND. In order to operate in a wide variety of application environments, the pull-down mechanism is intentionally designed to be somewhat strong. Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull-down mechanism disengages. Atmel recommends connecting these pins to a known state whenever possible. 8-lead SOIC NC 1 8 VCC NC 2 7 WP NC 3 6 SCL GND 4 5 SDA NC NC NC GND 1 2 3 4 VCC WP SCL SDA 8 7 6 5 NC 1 8 VCC NC 1 8 VCC NC 2 7 WP NC 2 7 WP NC 3 6 SCL NC 3 6 SCL GND 4 5 SDA GND 4 5 SDA Top View Top View 5-lead SOT23 SCL 1 GND 2 SDA 3 5 4 Top View (1) WP VCC 8-lead PDIP 8-pad UDFN 8-lead TSSOP Top View 8-ball VFBGA NC 1 8 VCC NC 2 7 WP NC 3 6 SCL GND 4 5 SDA Top View Top View 4-ball WLCSP (1) VCC GND SCL SDA Top View Note: Package drawings are not to scale. Note: 2 1. Refer to “Device Addressing” for details about addressing the SOT23 and WLCSP version of the device. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 Device Block Diagram and System Configuration Figure 2-1. Block Diagram POR Generator Memory System Control Module VCC High Voltage Generation Circuit Row Decoder 2. EEPROM Array 1 page Write Protection Control WP Address Register and Counter Column Decoder SCL Data Register DOUT Data & ACK Input/Output Control DIN GND Figure 2-2. Start Stop Detector SDA System Configuration Using 2-Wire Serial EEPROMs VCC RPUP(max) = tR(max) 0.8473 x CL V - VOL(max) RPUP(min) = CC IOL VCC SCL SDA WP I2C Bus Master: Microcontroller NC VCC NC WP Slave AT24Cxxx NC SDA GND GND SCL AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 3 3. Device Operation and Communication The AT24C16D operates as a slave device and utilizes a simple I2C-compatible 2-Wire digital serial interface to communicate with a host controller, commonly referred to as the bus Master. The Master initiates and controls all Read and Write operations to the slave devices on the serial bus, and both the Master and the slave devices can transmit and receive data on the bus. The serial interface is comprised of just two signal lines: Serial Clock (SCL) and Serial Data (SDA). The SCL pin is used to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive command and data information from the Master as well as to send data back to the Master. Data is always latched into the AT24C16D on the rising edge of SCL and always output from the device on the falling edge of SCL. Both the SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to minimize the effects of input spikes and bus noise. All command and data information is transferred with the Most-Significant Bit (MSB) first. During bus communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data have been transferred, the receiving device must respond with either an Acknowledge (ACK) or a No-acknowledge (NACK) response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the Master. Therefore, nine clock cycles are required for every one byte of data transferred. There are no unused clock cycles during any Read or Write operation, so there must not be any interruptions or breaks in the data stream during each data byte transfer and ACK or NACK clock cycle. During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will occur. Start and Stop conditions are used to initiate and end all serial bus communication between the Master and the slave devices. The number of data bytes transferred between a Start and a Stop condition is not limited and is determined by the Master. In order for the serial bus to be idle, both the SCL and SDA pins must be in the logic-high state at the same time. 3.1 Clock and Data Transition Requirements The SDA pin is an open drain terminal and therefore must be pulled high with an external pull-up resistor. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. 3.2 Start and Stop Conditions 3.2.1 Start Condition A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is at a stable Logic 1 state and will bring the device out of standby mode. The Master uses a Start condition to initiate any data transfer sequence; therefore, every command must begin with a Start condition. The device will continuously monitor the SDA and SCL pins for a Start condition but will not respond unless one is detected. Please refer to Figure 3-1 for more details. 3.2.2 Stop Condition A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the Logic 1 state. The Master can use the Stop condition to end a data transfer sequence with the AT24C16D which will subsequently return to standby mode. The Master can also utilize a repeated Start condition instead of a Stop condition to end the current data transfer if the Master will perform another operation. Please refer to Figure 3-1 for more details. 4 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 3.3 Acknowledge and No-Acknowledge After every byte of data is received, the receiving device must confirm to the Master that it has successfully received the data byte by responding with what is known as an Acknowledge (ACK). An ACK is accomplished by the transmitting device first releasing the SDA line at the falling edge of the eighth clock cycle followed by the receiving device responding with a Logic 0 during the entire high period of the ninth clock cycle. When the AT24C16D is transmitting data to the Master, the Master can indicate that it is done receiving data and wants to end the operation by sending a Logic 1 response to the AT24C16D instead of an ACK response during the ninth clock cycle. This is known as a No-Acknowledge (NACK) and is accomplished by the Master sending a Logic 1 during the ninth clock cycle, at which point the AT24C16D will release the SDA line so the Master can then generate a Stop condition. The transmitting device, which can be the bus Master or the Serial EEPROM, must release the SDA line at the falling edge of the eighth clock cycle to allow the receiving device to drive the SDA line to a Logic 0 to ACK the previous 8-bit word. The receiving device must release the SDA line at the end of the ninth clock cycle to allow the transmitter to continue sending new data. A timing diagram has been provided in Figure 3-1 to better illustrate these requirements. Figure 3-1. Start Condition, Data Transitions, Stop Condition, and Acknowledge SCL SDA Must Be Stable SDA Must Be Stable 1 2 Acknowledge Window 8 9 Stop Condition SDA Acknowledge Valid Start Condition SDA Change Allowed 3.4 SDA Change Allowed The transmitting device (Master or Slave) must release the SDA line at this point to allow the receiving device (Master or Slave) to drive the SDA line low to ACK the previous 8-bit word. The receiver (Master or Slave) must release the SDA line at this point to allow the transmitter to continue sending new data. Standby Mode The AT24C16D features a low power standby mode which is enabled when any one of the following occurs: A valid power-up sequence is performed (see Section 8.5). A Stop condition is received by the device unless it initiates an internal write cycle (see Section 5.). At the completion of an internal write cycle (see Section 5.). An unsuccessful match of the device type identifier or hardware address in the Device Address byte occurs (see Section 4.1). The bus Master does not ACK the receipt of data read out from the device; instead it sends a NACK response. (see Section 6.). AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 5 3.5 Software Reset After an interruption in protocol, power loss, or system reset, any 2-Wire part can be protocol reset by following these steps: 1. Create a Start condition (if possible). 2. 3. Clock nine cycles. Create another Start condition followed by a Stop condition as seen in Figure 3-2. The device should be ready for the next communication after above steps have been completed. In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device (see Section 8.5.1, “Device Reset”). Figure 3-2. Software Reset Dummy Clock Cycles SCL 1 Start Condition SDA 6 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 2 3 8 9 Start Condition Stop Condition 4. Memory Organization The AT24C16D is internally organized as 128 pages of 16 bytes each. 4.1 Device Addressing Accessing the device requires an 8-bit Device Address word following a Start condition to enable the device for a Read or Write operation. Since multiple slave devices can reside on the serial bus each slave device must have its own unique address so the Master can access each device independently. The most significant four bits of the Device Address word is referred to as the device type identifier. The device type identifier ‘1010’ (Ah) is required in bits 7 through 4 of the Device Address byte (see Table 4-1). Following the four bit device type identifier in the bit 3, bit 2, and bit 1 position of the Device Address byte are bits A10, A9, and A8 which are the three most significant bits of the memory array word address. The eighth bit (bit 0) of the Device Address byte is the Read/Write operation select bit. A Read operation is initiated if this bit is high, and a Write operation is initiated if this bit is low. Please refer to Table 4-1 to review these bit positions. Upon the successful comparison of the Device Address byte, the EEPROM will return an ACK. If a valid comparison is not made, the device will NACK and return to a standby state. Table 4-1. Device Address Byte Most Significant Bits of the Word Address Device Type Identifier Read/ Write Package Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Package Types 1 0 1 0 A10 A9 A8 R/W For all operations except the Current Address Read, a Word Address byte must be transmitted to the device immediately following the Device Address byte. The Word Address byte consists of the remaining eight bits of the 11-bit memory array word address, and is used to specify which byte location in the EEPROM to start reading or writing. Please refer to Table 4-2 to review these bit positions. Table 4-2. Word Address Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 A7 A6 A5 A4 A3 A2 A1 A0 The relationship of the AC timing parameters with respect to SCL and SDA for the AT24C16D are shown in the timing waveform Figure 8-1 on page 14. The AC timing characteristics and specifications are outlined in Section 8.4 “AC Characteristics” on page 14. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 7 5. Write Operations All Write operations for the AT24C16D begin with the Master sending a Start condition, followed by a Device Address byte with the R/W bit set to ‘0’, and then by the Word Address byte. The data value(s) to be written to the device immediately follow the Word Address byte. 5.1 Byte Write The AT24C16D supports the writing of single 8-bit bytes. Selecting a data word in the AT24C16D requires an 11-bit word address. Upon receipt of the proper Device Address and Word Address bytes, the EEPROM will send an Acknowledge. The device will then be ready to receive the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will respond with an ACK. The addressing device, such as a bus Master, must then terminate the Write operation with a Stop condition. At that time, the EEPROM will enter an internally self-timed write cycle which will be completed within tWR while the data word is being programmed into the nonvolatile EEPROM. All inputs are disabled during this write cycle, and the EEPROM will not respond until the Write is complete. Figure 5-1. Byte Write 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D2 D1 D0 0 SCL Device Address Byte SDA 1 0 1 0 A10 A9 A8 0 0 MSB Start by Master 5.2 Data Word Word Address Byte A7 A6 A5 A4 A3 A2 A1 A0 0 ACK from Slave D7 D6 D5 D4 D3 MSB MSB ACK from Slave ACK from Slave Stop by Master Page Write A Page Write operation allows up to 16 bytes to be written in the same write cycle, provided all bytes are in the same row of the memory array (where address bits A10 through A4 are the same). Partial Page Writes of less than 16 bytes are also allowed. A Page Write is initiated the same way as a Byte Write, but the bus Master does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the bus Master can transmit up to fifteen additional data words. The EEPROM will respond with an ACK after each data word is received. Once all data to be written has been sent to the device, the bus Master must issue a Stop condition (see Figure 5-2) at which time the internally self-timed write cycle will begin. The lower four bits of the word address are internally incremented following the receipt of each data word. The higher order address bits are not incremented and retain the memory page row location. Page Write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. When the incremented word address reaches the page boundary, the address counter will roll-over to the beginning of the same page. Nevertheless, creating a roll-over event should be avoided as previously loaded data in the page could become unintentionally altered. 8 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 Figure 5-2. Page Write 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 A1 A0 0 SCL Device Address Byte SDA 1 0 1 0 A10 A9 Word Address Byte A8 0 A7 0 MSB A6 A5 A4 A3 A2 MSB Start by Master ACK from Slave ACK from Slave 1 2 3 4 5 6 7 8 9 D6 D5 D4 D3 2 3 4 5 D2 D1 D0 0 MSB 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 0 MSB ACK from Slave 5.3 6 Data Word (n+x), max of 16 without rollover Data Word (n) D7 1 ACK from Slave Stop by Master Acknowledge Polling An Acknowledge Polling routine can be implemented to optimize time sensitive applications that would prefer not to wait the fixed maximum write cycle time (tWR). This method allows the application to know immediately when the Serial EEPROM write cycle has completed, so a subsequent operation can be started. Once the internally self-timed write cycle has started, an Acknowledge Polling routine can be initiated. This involves repeatedly sending a Start condition followed by a valid Device Address byte with the R/W bit set at Logic 0. The device will not respond with an ACK while the write cycle is ongoing. Once the internal write cycle has completed, the EEPROM will respond with an ACK, allowing a new Read or Write operation to be immediately initiated. A flow chart has been included below in Figure 5-3 to better illustrate this technique. Figure 5-3. Acknowledge Polling Flow Chart Send any Write protocol. Send Stop condition to initiate the write cycle. Send Start condition followed by a valid Device Address byte with R/W = 0. Did the device ACK? YES Proceed to next Read or Write operation. NO 5.4 Write Cycle Timing The length of the self-timed write cycle (tWR) is defined as the amount of time from the Stop condition that begins the internal Write operation to the Start condition of the first Device Address byte sent to the AT24C16D that it subsequently responds to with an ACK. Figure 5-4 has been included to show this measurement. During the internally self-timed write cycle any attempts to read from or write to the memory array will not be processed. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 9 Figure 5-4. Write Cycle Timing SCL 8 9 9 ACK ACK Data Word n SDA D0 tWR Stop Condition 5.5 Start Condition First Acknowledge from the device to a valid device address sequence after write cycle is initiated. The minumum tWR can only be determined through the use of an ACK Polling routine. Stop Condition Write Protection The AT24C16D utilizes a hardware data protection scheme that allows the user to write protect the entire memory contents when the WP pin is at VCC (or a valid VIH). No write protection will be set if the WP pin is at GND or left floating. Table 5-1. AT24C16D Write Protect Behavior WP Pin Voltage Part of the Array Protected VCC Full Array GND None — Write Protection Not Enabled The status of the WP pin is sampled at the Stop condition for every Byte Write or Page Write command prior to the start of an internally self-timed Write operation. Changing the WP pin state after the Stop condition has been sent will not alter or interrupt the execution of the write cycle. The WP pin state must be valid with respect to the associated setup (tSU.WP) and hold (tHD.WP) timing as shown in the Figure 5-5 below. The WP setup time is the amount of time that the WP state must be stable before the Stop condition is issued. The WP hold time is the amount of time after the Stop condition that the WP must remain stable. If an attempt is made to write to the device while the WP pin has been asserted, the device will acknowledge the Device Address, Word Address, and Data bytes but no write cycle will occur when the Stop condition is issued, and the device will immediately be ready to accept a new Read or Write command. Figure 5-5. SCL Write Protect Setup and Hold Timing 1 2 7 8 9 Stop by Master Data Word Input Sequence Page/Byte Write Operation SDA IN D7 D6 D1 D0 ACK by Slave tSU.WP WP 10 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 tHD.WP 6. Read Operations Read operations are initiated the same way as Write operations with the exception that the Read/Write Select bit in the Device Address word must be a Logic 1. There are three Read operations: 6.1 Current Address Read Random Address Read Sequential Read Current Address Read The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the VCC is maintained to the part. The address roll-over during read is from the last byte of the last page to the first byte of the first page of the memory. A Current Address Read operation will output data according to the location of the internal data word address counter. This is initiated with a Start condition, followed by a valid Device Address byte with the R/W bit set to Logic 1. The device will ACK this sequence and the current address data word is serially clocked out on the SDA line. All types of Read operations will be terminated if the bus Master does not respond with an ACK (it NACKs) during the ninth clock cycle, which will force the device into standby mode. After the NACK response, the Master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. Figure 6-1. Current Address Read 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D2 D1 D0 1 SCL Device Address Byte SDA 1 0 1 0 A10 A9 Data Word (n) A8 1 0 MSB Start by Master 6.2 D7 D6 D5 D4 D3 MSB ACK from Slave NACK from Master Stop by Master Random Read A Random Read begins in the same way as a Byte Write operation does to load in a new data word address. This is known as a “dummy write” sequence; however, the Data Byte and the Stop condition of the Byte Write must be omitted to prevent the part from entering an internal write cycle. Once the Device Address and Word Address are clocked in and acknowledged by the EEPROM, the bus Master must generate another Start condition. The bus Master now initiates a Current Address Read by sending a Start condition, followed by a valid Device Address byte with the R/W bit set to Logic 1. In this second Device Address byte, the bit positions usually reserved for the most significant bits of the Word Address (bit 3, 2, and 1) are don’t care bits since the address that will be read from is determined only by what was sent in the dummy write portion of the sequence. The EEPROM will ACK the Device Address and serially clock out the data word on the SDA line. All types of Read operations will be terminated if the bus Master does not respond with an ACK (it NACKs) during the ninth clock cycle, which will force the device into standby mode. After the NACK response, the Master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 11 Figure 6-2. Random Read 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 A1 A0 0 SCL Device Address Byte SDA 1 0 1 0 A10 A9 Word Address Byte A8 0 A7 0 MSB A6 A5 A4 A3 A2 MSB Start by Master ACK from Slave ACK from Slave Dummy Write 1 2 3 4 5 6 7 8 9 1 2 3 0 1 0 X X X 1 0 D7 MSB 6 7 8 9 D6 D5 D4 D3 D2 D1 D0 1 MSB Start by Master 6.3 5 Data Word (n) Device Address Byte 1 4 ACK from Slave Stop by Master NACK from Master Sequential Read Sequential Reads are initiated by either a Current Address Read or a Random Read. After the bus Master receives a data word, it responds with an acknowledge. As long as the EEPROM receives an ACK, it will continue to increment the word address and serially clock out sequential data words. When the maximum memory address is reached, the data word address will roll-over and the sequential read will continue from the beginning of the memory array. All types of Read operations will be terminated if the bus Master does not respond with an ACK (it NACKs) during the ninth clock cycle, which will force the device into standby mode. After the NACK response, the Master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. Figure 6-3. Sequential Read 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D2 D1 D0 0 SCL Device Address Byte SDA 1 0 1 0 A10 A9 Data Word (n) A8 1 0 D7 MSB Start by Master 1 D5 D4 2 3 4 5 6 7 8 9 ACK from Master 1 2 D6 D5 D4 D3 D2 3 4 5 6 7 8 9 1 2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 0 MSB ACK from Master 3 4 5 6 7 8 9 D1 D0 1 Data Word (n+x) Data Word (n+2) MSB 7. D3 ACK from Slave Data Word (n+1) D7 D6 MSB D7 D6 D5 D4 D3 D2 MSB ACK from Master NACK from Master Device Default Condition from Atmel The AT24C16D is delivered with the EEPROM array set to Logic 1, resulting in FFh data in all locations. 12 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 Stop by Master 8. Electrical Specifications 8.1 Absolute Maximum Ratings Temperature under Bias. . . . . . . . . -55C to +125C Storage Temperature . . . . . . . . . . . -65C to +150C Supply Voltage with respect to ground . . . . . . . . . . -0.5V to +4.10V Voltage on any pin with respect to ground . . . . . . . -0.6V to VCC + 0.5V DC Output Current . . . . . . . . . . . . . . . . . . . . . 5.0mA 8.2 Functional operation at the “Absolute Maximum Ratings” or any other conditions beyond those indicated in Section 8.2 “DC and AC Operating Range” is not implied or guaranteed. Stresses beyond those listed under “Absolute Maximum Ratings” and/or exposure to the “Absolute Maximum Ratings” for extended periods may affect device reliability and cause permanent damage to the device. The voltage extremes referenced in the “Absolute Maximum Ratings” are intended to accommodate short duration undershoot/overshoot pulses that the device may be subjected to during the course of normal operation and does not imply or guarantee functional device operation at these levels for any extended period of time. DC and AC Operating Range Table 8-1. DC and AC Operating Range AT24C16D 8.3 Operating Temperature (Case) Industrial Temperature Range VCC Power Supply Low Voltage Grade -40C to +85C 1.7V to 3.6V DC Characteristics Table 8-2. DC Characteristics Symbol Parameter VCC Supply Voltage ICC1 Supply Current, Read ICC2 Supply Current, Write ISB Standby Current ILI Input Leakage Current ILO Output Leakage Current VIL Input Low Level(2) VIH Input High Level(2) VOL1 Output Low Level VCC = 1.8V VOL2 Output Low Level VCC = 3.0V Notes: 1. 2. Test Conditions Typical(1) Min 1.7 Max Units 3.6 V VCC = 1.8V(2) Read at 400kHz 0.08 0.3 mA VCC = 3.6V Read at 1MHz 0.15 0.5 mA VCC = 3.6V Write at 1MHz 0.20 1.0 mA 0.08 0.4 μA 0.10 0.8 μA VIN = VCC or VSS 0.10 3.0 μA VOUT = VCC or VSS 0.05 3.0 μA -0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V IOL = 0.15mA 0.2 V IOL = 2.1mA 0.4 V VCC = 1.8V(2) VCC = 3.6V VIN = VCC or VSS Typical values characterized at TA = +25°C unless otherwise noted. This parameter is characterized but is not 100% tested in production. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 13 8.4 AC Characteristics Table 8-3. AC Characteristics Symbol Parameter fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low tHIGH Clock Pulse Width High Standard Mode Fast Mode Fast Mode Plus VCC1.7V to 3.6V VCC1.7V to 3.6V VCC 2.5V to 3.6V Min Max Min 100 Max Min 400 Max Units 1000 kHz 4,700 1,300 500 ns 4,000 600 400 ns (1) tI Input Filter Spike Suppression (SCL,SDA) tAA Clock Low to Data Out Valid tBUF Bus Free Time between Stop and Start(1) 4,700 1,300 500 ns tHD.STA Start Hold Time 4,000 600 250 ns tSU.STA Start Set-up Time 4,700 600 250 ns tHD.DAT Data In Hold Time 0 0 0 ns tSU.DAT Data In Set-up Time 200 100 100 ns tR Inputs Rise Time (1) (1) 100 100 100 ns 4,500 900 450 ns 1,000 300 100 ns 300 300 100 ns tF Inputs Fall Time tSU.STO Stop Set-up Time 4,700 600 250 ns tSU.WP Write Protect Setup Time 4,000 600 100 ns tHD.WP Write Protect Hold Time 4,000 600 400 ns tDH Data Out Hold Time 100 50 50 ns tWR Write Cycle Time Notes: 5 5 5 1. These parameters are determined through product characterization and are not 100% tested in production. 2. AC measurement conditions: CL : 100pF RPUP (SDA bus line pull-up resistor to VCC): 1.3k (1000kHz), 4k (400kHz), 10k (100kHz) Input pulse voltages: 0.3 x VCC to 0.7 x VCC Input rise and fall times: 50ns Input and output timing reference voltages: 0.5 x VCC Figure 8-1. Bus Timing tHIGH tF tR tLOW SCL tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA SDA OUT 14 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 tDH tBUF ms 8.5 Power-Up Requirements and Reset Behavior During a power-up sequence, the VCC supplied to the AT24C16D should monotonically rise from GND to the minimum VCC level as specified in Section 8.2 with a slew rate no greater than 1V/μs. 8.5.1 Device Reset To prevent inadvertent write operations or any other spurious events from occurring during a power-up sequence, the AT24C16D includes a Power-On-Reset (POR) circuit. Upon power-up, the device will not respond to any commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of reset and into standby mode. The system designer must ensure the instructions are not sent to the device until the VCC supply has reached a stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is greater than or equal to the minimum VCC level, the bus Master must wait at least tPUP before sending the first command to the device. See Table 8-4 for the values associated with these power-up parameters. Table 8-4. Power-up Conditions(1) Symbol Parameter Min tPUP Time required after VCC is stable before the device can accept commands. 100 VPOR Power-On Reset Threshold Voltage. tPOFF Minimum time at VCC = 0V between power cycles. Note: 1. Max Units μs 1.5 V 1 ms These parameters are characterized but they are not 100% tested in production. If an event occurs in the system where the VCC level supplied to the AT24C16D drops below the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to GND, waiting at least the minimum tPOFF time, and then performing a new power-up sequence in compliance with the requirements defined in this section. 8.6 Pin Capacitance Table 8-5. Symbol Test Condition CI/O CIN Note: 8.7 Pin Capacitance(1) 1. Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (SCL) 6 pF VIN = 0V Min Max Units 1,000,000 — Write Cycles 100 — Years This parameter is characterized but is not 100% tested in production. EEPROM Cell Performance Characteristics Table 8-6. EEPROM Cell Performance Characteristics Operation Test Condition Write Endurance(1) Data Retention(2) Notes: 1. 2. TA = 25°C, VCC(min)< VCC < VCC(max) Byte or Page Write Mode TA = 55°C, VCC(min)< VCC < VCC(max) Write endurance performance is determined through characterization and the qualification process. The data retention capability is determined through qualification and is checked on each device in production. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 15 9. Ordering Code Detail AT24C16D-SSHMxx-T Atmel Designator Shipping Carrier Option T = Tape and Reel, Standard Quantity Option E = Tape and Reel, Expanded Quantity Option B = Bulk (Tubes) Product Family 24C = Standard I2C-compatible Serial EEPROM Product Variation xx = Applies to select packages only. See ordering table for variation details. Device Density 16 = 16 Kilobit Operating Voltage M = 1.7V to 3.6V Device Revision Package Device Grade or Wafer/Die Thickness H = Green, NiPdAu Lead Finish Industrial Temperature Range (-40°C to +85°C) U = Green, Matte Tin Lead Finish or SnAgCu Ball Industrial Temperature Range (-40°C to +85°C) 11 = 11mil Wafer Thickness Package Option SS = JEDEC SOIC X = TSSOP MA = 2.0mm x 3.0mm UDFN P = PDIP ST = SOT23 C = VFBGA U = WLCSP WWU = Wafer Unsawn 16 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 10. Ordering Information Delivery Information Atmel Ordering Code Lead Finish Package Form Quantity Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8P3 Bulk (Tubes) 50 per Tube 5TS1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel 4U-5 Tape and Reel 5,000 per Reel AT24C16D-SSHM-T Operation Range 8S1 AT24C16D-SSHM-B AT24C16D-XHM-T AT24C16D-XHM-B NiPdAu (Lead-free/Halogen-free) 8X AT24C16D-MAHM-T 8MA2 AT24C16D-MAHM-E AT24C16D-PUM AT24C16D-STUM-T AT24C16D-CUM-T Matte Tin (Lead-free/Halogen-free) SnAgCu Ball AT24C16D-UUM0B-T(1) (Lead-free/Halogen-free) AT24C16D-WWU11M(2) N/A Notes: 1. 2. Industrial Temperature (-40C to 85C) Wafer Sale WLCSP Package: This device includes a backside coating to increase product robustness. CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells. Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light does not occur. For wafer sales, please contact Atmel Sales. Package Type 8S1 8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm x 0.60mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN) 8P3 8-lead, 0.30" wide, Plastic Dual In-line Package (PDIP) 5TS1 5-lead, 1.60mm body, Plastic Thin Shrink Small Outline (SOT23) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very thin Fine Ball Grid Array (VFBGA) 4U-5 4-ball, 2 x 2 Grid Array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP) AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 17 11. Part Markings AT24C16D: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-lead PDIP 8-pad UDFN 2.0 x 3.0 mm Body ### H%@ YXX ATHYWW ###% @ AAAAAAA ATMLHYWW ###% @ AAAAAAAA 5-lead SOT-23 8-ball VFBGA ATMLUYWW ###% @ AAAAAAAA 4-ball WLCSP 1.5 x 2.0 mm Body ###%U Top Mark ###U YMXX YMXX Note 1: Bottom Mark XX PIN 1 designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT24C16D Truncation Code ###: 16D Date Codes Y = Year 4: 2014 5: 2015 6: 2016 7: 2017 Voltages 8: 2018 9: 2019 0: 2020 1: 2021 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code % = Minimum Voltage M: 1.7V min Grade/Lead Finish Material H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 9/23/14 TITLE Package Mark Contact: [email protected] 18 24C16DSM, AT24C16D Package Marking Information AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 DRAWING NO. REV. 24C16DSM B 12. Packaging Information 12.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. MIN NOM MAX – – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 SYMBOL A D 4.90 BSC E 6.00 BSC E1 3.90 BSC e 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° NOTE 3/6/2015 Package Drawing Contact: [email protected] TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. REV. 8S1 H AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 19 12.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E NOTE 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] 20 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 GPC TNR DRAWING NO. 8X REV. E 12.3 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C TOP VIEW A2 SIDE VIEW A A1 E2 b (8x) 8 7 1 D2 6 3 5 4 e (6x) K L (8x) BOTTOM VIEW Notes: COMMON DIMENSIONS (Unit of Measure = mm) 2 Pin#1 ID 1. This drawing is for general information only. Refer to Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. 3. Dimensions b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. SYMBOL MIN NOM MAX A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 D 1.90 2.00 2.10 D2 1.40 1.50 1.60 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 b 0.18 0.25 0.30 C L 3 1.52 REF 0.30 e K NOTE 0.35 0.40 0.50 BSC 0.20 - - 11/26/14 Package Drawing Contact: [email protected] TITLE 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) GPC DRAWING NO. REV. YNZ 8MA2 G AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 21 12.4 8P3 — 8-lead PDIP E 1 E1 .381 Gage Plane N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = mm) D e D1 A2 A A1 b2 L b3 b v 4 PLCS Side View 0.254 m C MIN NOM MAX A - - 5.334 A1 0.381 A2 2.921 3.302 4.953 b 0.356 0.457 0.559 5 b2 1.143 1.524 1.778 6 b3 0.762 0.991 1.143 6 c 0.203 0.254 0.356 D 9.017 9.271 10.160 3 D1 0.127 0.000 0.000 3 E 7.620 7.874 8.255 4 E1 6.096 6.350 7.112 3 3.810 2 SYMBOL - e Notes: 2 - 2.540 BSC eA L NOTE 7.620 BSC 2.921 3.302 4 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 07/31/14 Package Drawing Contact: [email protected] 22 TITLE GPC DRAWING NO. 8P3, 8-lead, 0.300” Wide Body, Plastic Dual In-line Package (PDIP) PTC 8P3 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 REV. E 12.5 5TS1 — 5-lead SOT23 e1 C 4 5 E1 C L E L1 1 3 2 END VIEW TOP VIEW b A2 SEATING PLANE e A A1 D SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. SYMBOL MIN A A1 A2 c D E E1 L1 e e1 b 0.00 0.70 0.08 NOM 0.90 2.90 BSC 2.80 BSC 1.60 BSC 0.60 REF 0.95 BSC 1.90 BSC 0.30 - MAX 1.00 0.10 1.00 0.20 0.50 NOTE 3 1,2 1,2 1,2 3,4 5/31/12 Package Drawing Contact: [email protected] TITLE GPC 5TS1, 5-lead 1.60mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TSZ DRAWING NO. 5TS1 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 REV. D 23 12.6 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 2 1 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 Package Drawing Contact: [email protected] 24 TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 REV. F 12.7 4U-5 — 4-ball WLCSP k 0.015 TOP VIEW BOTTOM VIEW A 2 1 (4X) 2 1 A1 CORNER A1 CORNER A A e1 E B B d1 B D db (4X) d0.015 m C A B v d 0.05 m C SIDE VIEW A3 A2 A SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) -C- A1 k 0.075 C PIN ASSIGNMENT MATRIX A B 1 2 VCC VSS SCL SDA SYMBOL MIN TYP MAX A 0.260 0.295 0.330 A1 0.080 0.095 0.110 A2 0.160 0.175 0.190 A3 0.025 REF 3 D Contact Atmel for details d1 0.400 BSC E Contact Atmel for details e1 b NOTE 0.400 BSC 0.147 0.162 0.177 Note: 1. Dimensions are NOT to scale. 2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu. 3. Product offered with Back Side Coating (BSC) 4/28/15 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. REV. 4U-5, 4-ball, 2x2 Array, 0.40mm Pitch Wafer Level Chip Scale Package (WLCSP) with BSC GBM 4U-5 E AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 25 13. 26 Revision History Doc. No. Date 8906C 05/2015 8906B 01/2015 8906A 04/2014 Comments Updated 8S1 - JEDEC SOIC and 4U-5 - WLCSP package drawings. Added 100kHz timing set for reference, UDFN extended quantity option, and the figure for “System Configuration Using 2-Wire Serial EEPROMs”. Updated the 8X, 8MA2, and 4U-5 package outline drawings and the ordering information section. Remove preliminary status. Initial document release. AT24C16D [DATASHEET] Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.