AT24CS16 - Complete

AT24CS16
I2C-Compatible (2-wire) Serial EEPROM with a
Unique, Factory Programmed 128-bit Serial Number
16-Kbit (2,048 x 8)
DATASHEET
Standard Features

Low-voltage Operation
̶







VCC = 1.7V to 5.5V
Internally Organized as 2,048 x 8 (16Kb)
I2C-compatible (2-wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400kHz (1.7V) and 1MHz (2.5V, 5.0V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page Write Mode
̶


Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High-reliability
̶
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
̶

Green Package Options (Pb/Halide-free/RoHS-compliant)
̶

8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, and 5-lead SOT23
Die Sale Options: Wafer Form and Tape and Reel Available
Enhanced Features in the CS Serial EEPROM Series


All Standard Features Supported
128-bit Unique Factory-programmed Serial Number
̶
̶
̶
Permanently Locked, Read-only Value
Stored in a Separate Memory Area
Guaranteed Unique Across Entire CS Series of Serial EEPROMs
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
1.
Description
The Atmel® AT24CS16 provides 16,384 bits of Serial Electrically Erasable and Programmable Read-Only
Memory (EEPROM) organized as 2,048 words of 8 bits each. The device is optimized for use in many industrial
and commercial applications where low-power and low-voltage operation are essential. The AT24CS16 is
available in space-saving, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, and 5-lead SOT23 packages and
is accessed via a 2-wire serial interface. Additionally, this device supports full operation from 1.7V to 5.5V.
The AT24CS16 provides the additional feature of a factory programmed, guaranteed unique 128-bit serial
number, while maintaining all of the traditional features available in the 16Kb Serial EEPROM. The time
consuming step of performing and ensuring true serialization of product on a manufacturing line can be
removed from the production flow by employing the CS Series Serial EEPROM. The 128-bit serial number is
programmed and permanently locked from future writing during the Atmel production process. Further, this
128-bit location does not consume any of the user read/write area of the 16Kb Serial EEPROM. The uniqueness
of the serial number is guaranteed across the entire CS Series of Serial EEPROMs, regardless of the size of the
memory array or the type of interface protocol. This means that as an application's needs for memory size or
interface protocol evolve in future generations, any previously deployed serial number from any Atmel CS
Series Serial EEPROM part will remain valid.
2.
Pin Descriptions and Pinouts
Figure 2-1.
Pin Configuration
Pin Name
Function
NC
No Connect
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
GND
Ground
VCC
Power Supply
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
8-lead TSSOP
(Top View)
(Top View)
NC
1
8
VCC
NC
2
7
WP
NC
3
6
SCL
GND
4
5
SDA
NC
NC
NC
GND
Note:
2
8-lead SOIC
NC
NC
NC
GND
1
2
3
4
8
7
6
5
8-pad UDFN
5-lead SOT23
(Top View)
(Top View)
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
SCL
1
GND
2
SDA
3
Drawings are not to scale.
5
WP
4
VCC
VCC
WP
SCL
SDA
Absolute Maximum Ratings*
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions beyond those indicated in
the operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Operating Temperature .........................-55C to +125C
Storage Temperature ............................-65C to +150C
Voltage on any pin
with respect to ground ..............................-1.0V to +7.0V
Maximum Operating Voltage................................. 6.25V
DC Output Current ............................................... 5.0mA
4.
Block Diagram
Figure 4-1.
Block Diagram
VCC
GND
WP
Start
Stop
Logic
SCL
SDA
Serial
Control
Logic
Device
Address
Comparator
Data Latches
A1
A0
Read
Load
COMP
Read/Write
A2
High Voltage
Pump & Timing
Enable
INC
Data Word
ADDR/Counter
128-bit
Serial
Number
Row Decoder
3.
EEPROM
Array
Column
Decoder
Serial MUX
DOUT / ACK
Logic
DOUT
DIN
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
3
5.
Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.
Device/Page Addresses: The AT24CS16 does not utilize device address pins, which limits the number of
devices on a single bus to one.
Write Protect (WP): AT24CS16 has a Write Protect (WP) pin that provides hardware data protection. When the
Write Protect pin is connected to ground (GND), normal Read/Write operations to the full array are possible.
When the Write Protect pin is connected to VCC, all Write operations to the memory are inhibited but Read
operations are still possible. This operation is summarized in Table 5-1 below.
Table 5-1.
4
Write Protect
WP Pin Status
Part of the Array Protected
At VCC
Full Array
At GND
Normal Read/Write Operations
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
6.
Memory Organization
AT24CS16, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires an
11-bit data word address for random word addressing.
6.1
Pin Capacitance
Table 6-1.
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0MHz, VCC = 5.5V.
Symbol
Test Condition
CI/O
CIN
Note:
6.2
1.
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (A0, A1, A2, SCL)
6
pF
VIN = 0V
This parameter is characterized and is not 100% tested.
DC Characteristics
Table 6-2.
DC Characteristics
Applicable over recommended operating range from: TAI = -40C to +85C, VCC = 1.7V to 5.5V (unless otherwise noted).
Symbol
Parameter
VCC
Supply Voltage
ICC1
Supply Current VCC = 5.0V
Read at 400kHz
ICC2
Supply Current VCC = 5.0V
Write at 400kHz
ISB1
Standby Current VCC = 1.7V
VIN = VCC or VSS
ISB2
Standby Current VCC = 5.5V
VIN = VCC or VSS
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
μA
ILO
Output Leakage Current
VOUT = VCC or VSS
0.05
3.0
μA
VIL
Input Low Level(1)
–0.6
VCC x 0.3
V
VIH
Input High Level(1)
VCC x 0.7
VCC + 0.5
V
VOL1
Output Low Level VCC = 1.7V
IOL = 0.15mA
0.2
V
VOL2
Output Low Level VCC = 3.0V
IOL = 2.1mA
0.4
V
Note:
1.
Test Condition
Min
Typ
Max
Units
5.5
V
0.4
1.0
mA
2.0
3.0
mA
1.0
μA
1.7
μA
VIL min and VIH max are reference only and are not tested.
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
5
6.3
AC Characteristics
Table 6-3.
AC Characteristics
Applicable over recommended operating range from TAI = -40C to +85C, VCC = 1.7V to 5.5V, CL = 1TTL Gate and 100pF
(unless otherwise noted).
1.7V
Symbol
Parameter
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
1.2
0.4
μs
tHIGH
Clock Pulse Width High
0.6
0.4
μs
tI
Noise Suppression Time
tAA
Clock Low to Data Out Valid
0.1
tBUF
Time the bus must be free before a new
transmission can start
1.3
0.5
μs
tHD.STA
Start Hold Time
0.6
0.25
μs
tSU.STA
Start Setup Time
0.6
0.25
μs
tHD.DAT
Data In Hold Time
0
0
μs
tSU.DAT
Data In Setup Time
100
100
ns
tR
Inputs Rise Time(1)
Max
Min
400
100
(1)
0.9
0.05
Max
Units
1000
kHz
50
ns
0.55
μs
0.3
0.3
μs
300
100
ns
tF
Inputs Fall Time
tSU.STO
Stop Setup Time
0.6
0.25
μs
tDH
Data Out Hold Time
50
50
ns
tWR
(1)
Endurance
Note:
6
Min
2.5V, 5.0V
1.
Write Cycle Time
5
3.3V, +25C, Page Mode
1,000,000
This parameter is ensured by characterization only.
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
5
ms
Write Cycles
7.
Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop condition as defined below.
Figure 7-1.
Data Validity
SDA
SCL
Data Stable
Data Stable
Data
Change
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the
Stop command will place the EEPROM in a standby power mode.
Figure 7-2.
Start and Stop Definition
SDA
SCL
Start
Stop
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
7
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock
cycle.
Figure 7-3.
Output Acknowledge
1
SCL
8
9
DATA IN
DATA OUT
Start
Acknowledge
Standby Mode: The AT24CS16 features a low-power standby mode which is enabled upon power-up as well
as after the receipt of the Stop condition and the completion of any internal operations.
2-wire Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be
reset by following these steps:
1.
Create a Start condition (if possible).
2.
3.
Clock nine cycles.
Create another Start condition followed by Stop condition as shown in Figure 7-4.
The device should be ready for the next communication after above steps have been completed. In the event
that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset
the device.
Figure 7-4.
Software reset
Dummy Clock Cycles
SCL
1
Start
Condition
SDA
8
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
2
3
8
9
Start
Condition
Stop
Condition
Figure 7-5.
Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
tHIGH
tF
tR
tLOW
SCL
tSU.STA
tLOW
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Figure 7-6.
Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
th
SDA
8 Bit
ACK
WORDN
tWR
Stop
Condition
Note:
1.
(1)
Start
Condition
The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
9
8.
Device Addressing
Standard EEPROM Access: The 16K EEPROM device requires an 8-bit device address word following a Start
condition to enable the chip for a read or write operation.
The device address word consists of a mandatory ‘1010’ (Ah) sequence for the first four most significant bits
as shown in Figure 8-1. This is common to all Serial EEPROM devices.
The next three bits are used for memory page addressing and are the most significant bits of the data word
address which follows.
The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit
is high, and a Write operation is initiated if this bit is low.
Upon a valid compare of the device address, the EEPROM will output a zero. If a compare is not successfully
made, the chip will return to a standby state.
Figure 8-1.
Device Address
Density
Access Area
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
16K
EEPROM
1
0
1
0
P2
P1
P0
R/W
Serial Number
1
0
1
1
0
0
0
1
MSB
LSB
Serial Number Access: The AT24CS16 utilizes a separate memory block containing a factory programmed
128-bit serial number. Access to this memory location is obtained by beginning the device address word with a
‘1011’ (Bh) sequence.
Due to the size of the serial number, the next three bits of the device address must be set to zero to gain access
to the serial number.
The eighth bit of the device address needs be set to a one to read the Serial Number. A zero in this bit position,
other than during a dummy write sequence to set the address pointer, will result in a unknown data read from
the part. Writing or altering the 128-bit serial number is not possible.
Further specific protocol is needed to read the serial number from of the device. See Section 10., “Read
Operations” on page 12 for more details on accessing the special feature.
10
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
9.
Write Operations
Byte Write: A Byte Write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, such as a microcontroller, must terminate the Write sequence with a Stop condition. At this
time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled
during this write cycle and the EEPROM will not respond until the Write is complete.
Figure 9-1.
Byte Write
S
T
A
R
T
Device Address
W
R
I
T
E
Word Address
S
T
O
P
Data
SDA LINE
R A
/ C
WK
M
S
B
A
C
K
A
C
K
Page Write: The 16K EEPROM are capable of an 16-byte Page Write. A Page Write is initiated in the same way
as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is clocked in.
Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to
15 data words. The EEPROM will respond with a zero after each data word received. The microcontroller must
terminate the Page Write sequence with a Stop condition.
The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the internally
generated word address reaches the page boundary, the subsequent byte loaded will be placed at the
beginning of the same page. If more than 16 data words are transmitted to the EEPROM, the data word address
will roll-over and previously loaded data will be overwritten.
Figure 9-2.
Page Write
S
T
A
R
T
W
R
I
T
Device Address E
Word Address (n)
Data (n)
Data (n + 1)
S
T
O
P
Data (n + x)
SDA LINE
M
S
B
R A
/ C
WK
A
C
K
A
C
K
A
C
K
A
C
K
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
acknowledge polling can be initiated. This involves sending a Start condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the next Read or Write sequence to begin.
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
11
10.
Read Operations
Read operations are initiated in the same way as Write operations with the exception that the Read/Write select
bit in the device address word is set to one. There are four read operations:




Current Address Read
Random Address Read
Sequential Read
Serial Number Read
Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the chip power is maintained. The address roll-over during read is from the last byte of the last memory page to
the first byte of the first page. The address roll-over during write is from the last byte of the current page to the
first byte of the same page.
Once the device address with the Read/Write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
zero but does generate a following Stop condition.
Figure 10-1.
Current Address Read
S
T
A
R
T
R
E
A
D
Device Address
S
T
O
P
Data
SDA LINE
N
O
R A
/ C
WK
M
S
B
A
C
K
Random Read: A Random Read requires a dummy byte write sequence to load in the data word address. Once
the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start condition. The microcontroller now initiates a Current Address
Read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop condition.
Figure 10-2.
Random Read
S
T
A
R
T
W
R
I
T
Device Address E
S
T
A
R
T Device Address
Word Address (n)
R
E
A
D
S
T
O
P
Data (n)
SDA LINE
M
S
B
R A
/ C
WK
Dummy Write
12
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
A
C
K
A
C
K
N
O
A
C
K
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address
Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM
receives an acknowledge, it will continue to increment the data word address and serially clock out sequential
data words. When the memory address limit is reached, the data word address will roll-over and the Sequential
Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond
with a zero but does generate a following Stop condition.
Figure 10-3.
Device
Address
Sequential Read
R
E
A
D
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
SDA LINE
R A
/ C
WK
A
C
K
A
C
K
A
C
K
N
O
A
C
K
Serial Number Read: Reading the serial number is similar to the sequential read sequence but requires use of
the device address seen in Figure 8-1 on page 10, a dummy write, and the use of specific word address.
Note:
The entire 128-bit value must be read from the starting address of the serial number block to guarantee
a unique number.
Since the address pointer of the device is shared between the regular EEPROM array and the serial number
block, a dummy write sequence, as part of a Random Read or Sequential Read protocol, should be performed
to ensure the address pointer is set to zero. A Current Address Read of the serial number block is supported but
if the previous operation was to the EEPROM array, the address pointer will retain the last location accessed,
incremented by one. Reading the serial number from a location other than the first address of the block will not
result in a unique serial number.
Additionally, the word address must begin with a ‘10’ sequence regardless of the intended address. If a word
address other than ‘10’ is used, then the device will output undefined data.
Example:
If the application desires to read the first byte of the serial number, the word address input would
need to be 80h.
When the end of the 128-bit serial number is reached (16 bytes of data), the data word address will roll-over
back to the beginning of the 128-bit serial number. The Serial Number Read operation is terminated when the
microcontroller does not respond with an zero (ACK) and instead issues a Stop condition (see Figure 10-4 on
page 14).
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
13
Figure 10-4.
Serial Number Read
S
T
A
R
T
SDA LINE
W
R
I
T
E
Device
Address
1 0 1 1 0 0 0
Word
Address n
1 0 0 0 0 0 0 0
R A
/ C
W K
M
S
B
S
T
A
R
T
Device
Address
R
E
A
D
1 0 1 1 0 0 0
A
C
K
A
C
K
Serial Number
Data Byte 0x0
A
C
K
Dummy Write
S
T
O
P
Serial Number
Data Byte 0x1
Serial Number
Data Byte 0x2
Serial Number
Data Byte 0x3
Serial Number
Data Byte 0xF
N
O
A
C
K
14
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
11.
Part Markings
AT24CS16: Package Marking Information
8-lead SOIC
8-lead TSSOP
ATMLHYWW
NA M
@
AAAAAAAA
ATHYWW
NA M @
AAAAAAA
5-lead SOT-23
8-lead UDFN
2.0 x 3.0 mm Body
NA MU
NA
HM@
YXX
Note 1:
YMXX
Top Mark
Bottom Mark
designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT24CS16
Truncation Code ###: NA
Date Codes
Y = Year
3: 2013
4: 2014
5: 2015
6: 2016
Voltages
7: 2017
8: 2018
9: 2019
0: 2020
M = Month
A: January
B: February
...
L: December
WW = Work Week of Assembly
02: Week 2
04: Week 4
...
52: Week 52
Country of Assembly
Lot Number
@ = Country of Assembly
AAA...A = Atmel Wafer Lot Number
Trace Code
M: 1.7V min
Grade/Lead Finish Material
U: Industrial/Matte Tin
H: Industrial/NiPdAu
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
1/22/13
TITLE
Package Mark Contact:
[email protected]
24CS16SM, AT24CS16 Package Marking Information
DRAWING NO.
REV.
24CS16SM
A
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
15
12.
Ordering Code Detail
AT2 4 C S 1 6 - S S H M - B
Atmel Designator
Product Family
24CS = Serial EEPROM, with
128-bit Serial Number Feature
Shipping Carrier Option
B
T
E
Operating Voltage
M
Device Density
16 = 16K
= Bulk (Tubes)
= Tape and Reel, Standard Quantity Option
= Tape and Reel, Expanded Quantity Option
= 1.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
H
= Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
U = Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
11 = 11mil Wafer Thickness
Package Option
SS = JEDEC SOIC
X = TSSOP
MA = UDFN
ST = SOT23
WWU = Wafer Unsawn
16
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
13.
Ordering Information
Additional package types that are not listed may be available. Please contact Atmel for more details.
Delivery Information
Atmel Ordering Code
Lead Finish
Package
Form
Quantity
Bulk (Tubes)
100 per Tube
Tape and Reel
4,000 per Reel
Bulk (Tubes)
100 per Tube
Tape and Reel
5,000 per Reel
Tape and Reel
5,000 per Reel
Tape and Reel
15,000 per Reel
Tape and Reel
5,000 per Reel
AT24CS16-SSHM-B
Operation
Range
8S1
AT24CS16-SSHM-T
AT24CS16-XHM-B
AT24CS16-XHM-T
NiPdAu
(Lead-free/Halogen-free)
8X
AT24CS16-MAHM-T
Industrial
Temperature
(-40C to 85C)
8MA2
AT24CS16-MAHM-E
AT24CS16-STUM-T
AT24CS16-WWU11M(1)
Note:
1.
Matte Tin
(Lead-free/Halogen-free)
N/A
5TS1
Wafer Sale
Note 1
For Wafer sales, please contact Atmel Sales.
Package Type
8S1
8-lead, 0.15" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8MA2
8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)
5TS1
5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
17
14.
Packaging Information
14.1
8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
SYMBOL MIN
A
1.35
NOM
MAX
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
6/22/11
Package Drawing Contact:
[email protected]
18
TITLE
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
GPC
SWB
DRAWING NO.
REV.
8S1
G
14.2
8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
A
b
A1
e
D
SYMBOL
Side View
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
A2
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
MIN
NOM
MAX
A
-
-
1.20
A1
0.05
-
0.15
A2
0.80
1.00
1.05
D
2.90
3.00
3.10
2, 5
4.40
4.50
3, 5
0.25
0.30
4
E
NOTE
6.40 BSC
E1
4.30
b
0.19
e
0.65 BSC
L
0.45
L1
C
0.60
0.75
1.00 REF
0.09
-
0.20
2/27/14
TITLE
Package Drawing Contact:
[email protected]
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
TNR
DRAWING NO.
8X
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
REV.
E
19
14.3
8MA2 — 8-pad UDFN
E
1
8
Pin 1 ID
2
7
3
6
4
5
D
C
TOP VIEW
A2
SIDE VIEW
A
A1
E2
b (8x)
8
7
1
D2
6
3
5
4
e (6x)
K
L (8x)
BOTTOM VIEW
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
2
Pin#1 ID
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
SYMBOL
MIN
NOM
MAX
A
0.50
0.55
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
D
1.90
2.00
2.10
D2
1.40
1.50
1.60
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
b
0.18
0.25
0.30
C
L
3
1.52 REF
0.30
e
K
NOTE
0.35
0.40
0.50 BSC
0.20
-
-
11/26/14
Package Drawing Contact:
[email protected]
20
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
TITLE
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
GPC
DRAWING NO.
REV.
YNZ
8MA2
G
14.4
5TS1 — 5-lead SOT23
e1
C
4
5
E1
C
L
E
L1
1
3
2
END VIEW
TOP VIEW
b
A2
SEATING
PLANE
e
A
A1
D
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
SYMBOL
MIN
A
A1
A2
c
D
E
E1
L1
e
e1
b
0.00
0.70
0.08
NOM
0.90
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
0.30
-
MAX
1.00
0.10
1.00
0.20
0.50
NOTE
3
1,2
1,2
1,2
3,4
5/31/12
Package Drawing Contact:
[email protected]
TITLE
GPC
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
TSZ
DRAWING NO.
5TS1
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
REV.
D
21
15.
Revision History
Doc. Rev.
8859B
Date
01/2015
Comments
Added bulk SOIC and TSSOP, and UDFN Expanded Quantity Options. Updated from
preliminary to complete status, ordering code table, 8X and 8MA2 package drawings,
and the disclaimer page.
Corrected pinouts from bottom to top view and reorganization figures. No changes to
functional specification.
8859A
22
02/2013
Initial document release.
AT24CS16 [DATASHEET]
Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015
XXXXXX
Atmel Corporation
1600 Technology Drive, San Jose, CA 95110 USA
T: (+1)(408) 441.0311
F: (+1)(408) 436.4200
|
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© 2015 Atmel Corporation. / Rev.: Atmel-8859B-SEEPROM-AT24CS16-Datasheet_012015.
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