ATWINC1500A - Complete

ATWINC1500A-MU DATASHEET
IEEE 802.11 b/g/n Network Controller SoC
Datasheet
Description
ATWINC1500A is a single chip IEEE 802.11 b/g/n Radio/Baseband/MAC network
controller optimized for low-power mobile applications. ATWINC1500A supports
single stream 1x1 802.11n mode providing up to 72Mbps PHY rate.
ATWINC1500A features fully integrated Power Amplifier, LNA, Switch, and
Power Management. ATWINC1500A also features an on-chip microcontroller
and integrated flash memory for system software. Implemented in 65nm CMOS
technology, the ATWINC1500A offers very low power consumption while
simultaneously providing high performance and minimal bill of materials.
The ATWINC1500A supports 2- and 3-wire Bluetooth coexistence protocols. The
ATWINC1500A provides multiple peripheral interfaces including UART, SPI, I2C
the only external clock source needed for the ATWINC1500A is a high-speed
crystal or oscillator with a wide range of reference clock frequencies supported
(12-40MHz). The ATWINC1500A is available in QFN packaging.
Features
 IEEE 802.11 b/g/n 20MHz (1x1) solution
 Single spatial stream in 2.4GHz ISM band
 Integrated PA and T/R Switch
 Superior Sensitivity and Range via advanced PHY signal processing
 Advanced Equalization and Channel Estimation
 Advanced Carrier and Timing Synchronization
 Wi-Fi Direct and Soft-AP support
 Supports IEEE 802.11 WEP, WPA, WPA2 Security
 Supports China WAPI security
 Superior MAC throughput via hardware accelerated two-level A-MSDU/AMPDU frame aggregation and block acknowledgement
 On-chip memory management engine to reduce host load
 Integrated Flash memory for system software
 SPI, UART, and I2C host interfaces
 2/3 wire Bluetooth coexistence interface
 Operating temperature range of -40°C to +85°C
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 Power save modes:
– <4µA Deep Power Down mode typical @3.3V I/O
– 280uA Doze mode with chip settings preserved (used for beacon monitoring)
– On-chip low power sleep oscillator
– Fast host wake-up from Doze mode by a pin or host I/O transaction
 Fast boot options:
– On-Chip Boot ROM (firmware instant boot)
– SPI flash boot (firmware patches and state variables)
– Low-leakage on-chip memory for state variables
– Fast AP re-association (150ms)
 On-Chip Network Stack to offload MCU:
– Integrated Network IP stack to minimize host CPU requirements
– Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS
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Ta bl e of Conte nts
1
Ordering Information and IC Marking ........................................................................ 5
2
Block Diagram ............................................................................................................. 5
3
Pinout and Package Information ................................................................................ 5
3.1
3.2
4
Electric Specifications ................................................................................................ 9
4.1
4.2
4.3
5
7.2
7.3
MAC
7.1.1
7.1.2
PHY
7.2.1
7.2.2
Radio
7.3.1
7.3.2
.............................................................................................................................................. 13
Features ................................................................................................................................. 13
Description.............................................................................................................................. 13
.............................................................................................................................................. 14
Features ................................................................................................................................. 14
Description.............................................................................................................................. 14
.............................................................................................................................................. 14
Receiver Performance ............................................................................................................ 14
Transmitter Performance ........................................................................................................ 16
External Interfaces .................................................................................................... 16
8.1
8.2
8.3
8.4
8.5
8.6
9
Processor ............................................................................................................................................ 12
Memory Subsystem............................................................................................................................. 12
Non-Volatile Memory (EFuse) ............................................................................................................. 12
WLAN Subsystem ...................................................................................................... 13
7.1
8
Crystal Oscillator ................................................................................................................................. 10
Low Power Oscillator........................................................................................................................... 11
CPU and Memory Subsystems ................................................................................. 12
6.1
6.2
6.3
7
Absolute Ratings ................................................................................................................................... 9
Recommended Operating Conditions ................................................................................................... 9
DC Electric Characteristics .................................................................................................................. 10
Clocking ................................................................................................................... 10
5.1
5.2
6
Pin Description ...................................................................................................................................... 5
Package Description ............................................................................................................................. 7
I2C Slave Interface .............................................................................................................................. 17
I2C Master Interface ............................................................................................................................ 18
SPI Slave Interface.............................................................................................................................. 19
UART .............................................................................................................................................. 21
Wi-Fi/Bluetooth Coexistence ............................................................................................................... 22
GPIOs .............................................................................................................................................. 22
Power Management ................................................................................................... 22
9.1
9.2
9.3
9.4
Power Architecture .............................................................................................................................. 22
Power Consumption ............................................................................................................................ 24
9.2.1 Description of Device States................................................................................................... 24
9.2.2 Controlling the Device States¨ ................................................................................................ 24
9.2.3 Restrictions for Power States ................................................................................................. 24
Power-Up/Down Sequence ................................................................................................................. 24
Digital I/O Pin Behavior during Power-Up Sequences......................................................................... 26
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10 Reference Design ...................................................................................................... 26
11 Reference Documentation and Support................................................................... 28
11.1 Reference Documents......................................................................................................................... 28
12 Revision History ........................................................................................................ 29
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Ordering Information and IC Marking
Table 1-1.
2
Ordering Details
Atmel Official Part Number (for ordering)
Package Type
IC Marking
ATWINC1500A-MU
5x5 QFN in Tape and Reel
ATWINC1500A
Block Diagram
Figure 2-1.
ATWINC1500A Block Diagram
Vbatt
SDIO
SPI
I2C
UART
Bluetooth
Coexistance
RTC
Clock
PMU
XO
GPIO
WINC1500
Host Interface
802.11bgn
Forward
Error
Correction
Microcontroller
802.11bgn
OFDM
Channel
Estimation /
Equalization
Rx
Digital
Core
802.11bgn
MAC
Flash
PLL
RAM
802.11bgn
Coding
802.11bgn
iFFT
Pinout and Package Information
3.1
Pin Description
~
Tx
Digital
Core
DPD
3
X
ADC
DAC
X
ATWINC1500A is offered in an exposed pad 40-pin QFN package. This package has an exposed paddle that
must be connected to the system board ground. The QFN package pin assignment is shown in Figure 3-1. The
color shading is used to indicate the pin type as follows: green – power, red – analog, blue – digital I/O, yellow
– digital input, grey – unconnected or reserved. The ATWINC1500A pins are described in Table 3-1.
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Figure 3-1.
Pin Assignment
Table 3-1.
Pin Description
Pin #
Pin Name
Pin Type
Description
1
TP_P
Analog
Test Pin/Customer No Connect
2
VDD_RF_RX
Power
Tuner RF Supply (see Section 9.1)
3
VDD_AMS
Power
Tuner BB Supply (see Section 9.1)
4
VDD_RF_TX
Power
Tuner RF Supply (see Section 9.1)
5
VDD_BATT_PPA
Power
PA 1st Stage Supply (see Section 9.1)
6
VDD_BATT_PA
Power
PA 2nd Stage Supply (see Section 9.1)
7
RFIOP
Analog
Pos RF Differential I/O
8
RFION
Analog
Neg RF Differential I/O
9
SDIO_SPI_CFG
Digital Input
Tie to 1 for SPI, 0 for SDIO
10
GPIO0/HOST_WAKE
Digital I/O, Programmable Pull-Up
GPIO0/SLEEP Mode Control
11
GPIO2/IRQN
Digital I/O, Programmable Pull-Up
GPIO2/Device Interrupt
12
SD_DAT3
Digital I/O, Programmable Pull-Up
SDIO Data3
13
SD_DAT2/SPI_RXD
Digital I/O, Programmable Pull-Up
SDIO Data2/SPI Data Rx
14
VDDC
Power
Digital Core Power Supply (see Section 9.1)
15
VDDIO
Power
Digital I/O Power Supply (see Section 9.1)
16
SD_DAT1/SPI_SSN
Digital I/O, Programmable Pull-Up
SDIO Data1/SPI Slave Select
17
SD_DAT0/SPI_TXD
Digital I/O, Programmable Pull-Up
SDIO Data0/SPI Data Tx
18
SD_CMD/SPI_SCK
Digital I/O, Programmable Pull-Up
SDIO Command/SPI Clock
19
SD_CLK
Digital I/O, Programmable Pull-Up
SDIO Clock
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Pin #
Pin Name
Pin Type
Description
20
VBATT_BUCK
Power
Battery Supply for DC/DC Converter (see
Section 9.1)
21
VSW
Power
Switching output of DC/DC Converter (see
Section 9.1)
22
VREG_BUCK
Power
Core Power from DC/DC Converter (see Section 9.1)
23
CHIP_EN
Analog
PMU Enable
24
GPIO1/RTC_CLK
Digital I/O, Programmable Pull-Down
GPIO1/32kHz Clock Input
25
TEST_MODE
Digital Input
Test Mode – Customer Tie to GND
26
VDDIO
Power
Digital I/O Power Supply (see Section 9.1)
27
VDDC
Power
Digital Core Power Supply (see Section 9.1)
28
NC
None
Customer no connect
29
GPIO15
Digital I/O, Programmable Pull-Up
GPIO15
30
GPIO16
Digital I/O, Programmable Pull-Up
GPIO16
31
GPIO18
Digital I/O, Programmable Pull-Up
GPIO18
32
I2C_SCL1
Digital I/O, Programmable Pull-Up
I2C Slave Clock
33
I2C_SDA1
Digital I/O, Programmable Pull-Up
I2C Slave Data
34
RESETN
Digital Input
Active-Low Hard Reset
35
XO_N
Analog
Crystal Oscillator N
36
XO_P
Analog
Crystal Oscillator P
37
VDD_SXDIG
Power
SX Power Supply (see Section 9.1)
38
VDD_VCO
Power
VCO Power Supply (see Section 9.1)
39
VDDIO_A
Power
Tuner VDDIO Power Supply (see Section 9.1)
40
TP_N
Analog
Test Pin/Customer No Connect
41
PADDLE VSS
Power
Connect to System Board Ground
Note:
3.2
1.
All digital IO have 2mA drive strength expect for I2C_SCL/SDA which have 4mA.
Package Description
The ATWINC1500A QFN package information is provided in Table 3-2.
Table 3-2.
QFN Package Information
Parameter
Value
Units
Package Size
5x5
mm
±0.1mm
QFN Pad Count
40
Total Thickness
0.85
mm
±0.05mm
QFN Pad Pitch
0.40
mm
Pad Width
0.20
mm
Exposed Pad size
3.7x3.7
mm
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The ATWINC1500A 40L QFN package view is shown in Figure 3-2.
Figure 3-2.
QFN Package
The QFN package is a qualified Green Package.
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Electric Specifications
4.1
Absolute Ratings
Table 4-1.
Absolute Maximum Ratings
Characteristic
Symbol
Min
Max
Unit
Core Supply Voltage
VDDC
-0.3
1.5
V
I/O Supply Voltage
VDDIO
-0.3
5.0
V
Battery Supply Voltage
VBATT
-0.3
5.0
V
Digital Input Voltage
VIN
-0.3
VDDIO
V
Analog Input Voltage
VESDHBM
-0.3
1.5
V
-1000, -2000
(see notes below)
+1000, +2000
(see notes below)
V
-65
150
ºC
Junction Temperature
1225
ºC
RF input power max
23
dBm
ESD Human Body Model
Storage Temperature
Notes:
1.
2.
3.
4.2
TA
VIN corresponds to all the digital pins.
VAIN corresponds to the following analog pins: VDD_RF_RX, VDD_RF_TX, VDD_AMS, RFIOP, RFION,
XO_N, XO_P, VDD_SXDIG, VDD_VCO.
For VESDHBM, each pin is classified as Class 1, or Class 2, or both:

The Class 1 pins include all the pins (both analog and digital)

The Class 2 pins are all digital pins only

VESDHBM is ±1kV for Class1 pins. VESDHBM is ±2kV for Class2 pins
Recommended Operating Conditions
Table 4-2.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ
Max
Units
I/O Supply Voltage
VDDIO
2.7
3.3
3.6
V
Battery Supply Voltage
VBATT
3.0
3.6
4.2
Operating Temperature
Notes:
1.
2.
3.
-40
85
ºC
I/O supply voltage is applied to the following pins: VDDIO_A, VDDIO.
Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, VBATT_BUCK.
Refer to Sections 9.1 and Table 9-3 for the details of power connections.
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4.3
DC Electric Characteristics
Table 4-3 provides the DC characteristics for the ATWINC1500A digital pads.
Table 4-3.
Electrical Characteristics
VDDIO Condition
VDDIOL
Characteristic
Min
Max
Unit
Input Low Voltage VIL
-0.30
0.60
V
Input High Voltage VIH
VDDIO-0.60
VDDIO+0.30
V
0.45
V
Output Low Voltage VOL
VDDIOM
Output High Voltage
VOH
VDDIO-0.50
Input Low Voltage VIL
-0.30
0.63
V
Input High Voltage VIH
VDDIO-0.60
VDDIO+0.30
V
0.45
V
V
Output Low Voltage VOL
VDDIOH
Output High Voltage
VOH
VDDIO-0.50
Input Low Voltage VIL
-0.30
0.65
V
Input High Voltage VIH
VDDIO-0.60
VDDIO+0.30 (up to 3.60)
V
0.45
V
V
Output Low Voltage VOL
Output High Voltage
VOH
VDDIO-0.50
V
All
Output Loading
20
pF
All
Digital Input Load
6
pF
5
Clocking
5.1
Crystal Oscillator
Table 5-1.
Crystal Oscillator Parameters
Parameter
Min
Typ
Max
Units
Crystal Resonant
Frequency
12
26
40
MHz
50
150
Ω
Crystal Equivalent
Series Resistance
Stability – Initial Offset1
-100
100
ppm
Stability - Temperature and Aging
-25
25
ppm
Note:
1.
Initial offset must be calibrated to maintain ±25ppm in all operating conditions. This calibration is performed
during final production testing.
The block diagram in Figure 5-1(a) shows how the internal Crystal Oscillator (XO) is connected to the external
crystal. The XO has 5pF internal capacitance on each terminal XO_P and XO_N. To bypass the crystal
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oscillator with an external reference, an external signal capable of driving 5pF can be applied to the XO_N
terminal as shown Figure 5-1(b).
Figure 5-1.
XO Connections: (a) Crystal Oscillator is Used, (b) Crystal Oscillator is Bypassed
External Clock
XO_N
XO_P
XO_N
XO_P
ATWINC1500A
ATWINC1500A
(a)
(b)
Table 5-2 specifies the electrical and performance requirements for the external clock.
Table 5-2.
5.2
Bypass Clock Specification
Parameter
Min
Max
Unit
Comments
Oscillation frequency
12
32
MHz
Must be able to drive 5pF load @ desired frequency
Voltage swing
0.5
1.2
Vpp
Must be AC coupled
Stability – Temperature and Aging
-25
+25
ppm
Phase Noise
-130
dBc/Hz
Jitter(RMS)
<1psec
At 10kHz offset
Based on integrated phase noise
spectrum from 1kHz to 1MHz
Low Power Oscillator
ATWINC1500A has an internally-generated 32kHz clock to provide timing information for various sleep
functions. Alternatively, ATWINC1500A allows for an external 32kHz clock to be used for this purpose, which is
provided through Pin 24 (RTC_CLK). Software selects whether the internal clock or external clock is used.
The internal low-power clock is ring-oscillator based and has accuracy within 10,000ppm. When using the
internal low-power clock, the advance wakeup time in beacon monitoring mode has to be increased by about
1% of the sleep time to compensate for the oscillator inaccuracy. For example, for the DTIM interval value of 1,
wakeup time has to be increased by 1ms.
For any application targeting very low power consumption, an external 32kHz RTC clock should be used.
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6
CPU and Memory Subsystems
6.1
Processor
ATWINC1500A has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions,
including but not limited to association, authentication, power management, security key management, and
MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of
operation, such as STA and AP modes.
6.2
Memory Subsystem
The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data
RAM. ATWINC1500A also has 4Mb of flash memory, which can be used for system software. In addition, the
device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to
perform various data management tasks on the TX and RX data packets.
6.3
Non-Volatile Memory (EFuse)
ATWINC1500A has 768 bits of non-volatile EFuse memory that can be read by the CPU after device reset.
This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters,
such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and
other software-specific configuration parameters. The EFuse is partitioned into six 128-bit banks. Each bank
has the same bit map, which is shown in Figure 6-1. The purpose of the first 80 bits in each bank is fixed, and
the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each
bank can be programmed independently, this allows for several updates of the device parameters following the
initial programming, e.g. updating MAC address. Refer to ATWINC1500A Programming Guide for the EFuse
programming instructions.
Flags
8
Bank 0
F
48
MAC ADDR
7
8
G
16
FO
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
128 Bits
12
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15
Freq.
Offset
1
Used
1
TX
Gain
Correc
tion
Reserved
4
Used
3
Version
1
Invalid
Used
1
EFuse Bit Map
MAC ADDR
Used
Figure 6-1.
7
WLAN Subsystem
The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The
following two subsections describe the MAC and PHY in detail.
7.1
MAC
7.1.1
Features
The ATWINC1500A IEEE802.11 MAC supports the following functions:

IEEE 802.11b/g/n

IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling

Advanced IEEE 802.11n features:

7.1.2
–
Transmission and reception of aggregated MPDUs (A-MPDU)
–
Transmission and reception of aggregated MSDUs (A-MSDU)
–
Immediate Block Acknowledgement
–
Reduced Interframe Spacing (RIFS)
Support for IEEE802.11i and WFA security with key management
–
WEP 64/128
–
WPA-TKIP
–
128-bit WPA2 CCMP (AES)

Support for WAPI security

Advanced power management
–
Standard 802.11 Power Save Mode
–
Wi-Fi Alliance WMM-PS (U-APSD)

RTS-CTS and CTS-self support

Supports either STA or AP mode in the infrastructure basic service set mode

Supports independent basic service set (IBSS)
Description
The ATWINC1500A MAC is designed to operate at low power while providing high data throughput. The IEEE
802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control
logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a
programmable processor provides optimal power efficiency and real-time response while providing the
flexibility to accommodate evolving standards and future feature enhancements.
Dedicated datapath engines are used to implement data path functions with heavy computational. For
example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine
performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES,
and WAPI security requirements.
Control functions which have real-time requirements are implemented using hardwired control logic modules.
These logic modules offer real-time response while maintaining configurability via the processor. Examples of
hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX
control, interframe spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off
timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block
communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher
engine, and the DMA interface to the TX/RX FIFOs).
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The MAC functions implemented solely in software on the microprocessor have the following characteristics:

Functions with high memory requirements or complex data structures. Examples are association table
management and power save queuing.

Functions with low computational load or without critical real-time requirements. Examples are
authentication and association.

Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS
scheduling.
7.2
PHY
7.2.1
Features
The ATWINC1500A IEEE802.11 PHY supports the following functions:
7.2.2

Single antenna 1x1 stream in 20MHz channels

Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps

Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps

Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0,
14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps

IEEE 802.11n mixed mode operation

Per packet TX power control

Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and
frame detection
Description
The ATWINC1500A WLAN PHY is designed to achieve reliable and power-efficient physical layer
communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced
algorithms have been employed to achieve maximum throughput in a real world communication environment
with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC
(Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier
sensing and clear channel assessment, as well as the automatic gain control.
7.3
Radio
7.3.1
Receiver Performance
Radio Performance under Typical Conditions: VBAT=3.6V; VDDIO=3.3V; Temp: 25°C.
Table 7-1.
Parameter
Receiver Performance
Description
Frequency
Sensitivity
802.11b
Sensitivity
802.11g
14
Unit
Minimum
MHz
2,412
Typical
2,484
1Mbps DSS
dBm
-98
2Mbps DSS
dBm
-94
5.5Mbps DSS
dBm
-92
11Mbps DSS
dBm
-88
6Mbps OFDM
dBm
-90
9Mbps OFDM
dBm
-89
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Maximum
Parameter
Sensitivity
802.11n
(BW=20MHz)
Maximum Receive
Signal Level
Adjacent Channel Rejection
Cellular Blocker Immunity
Description
Unit
Minimum
Typical
12Mbps OFDM
dBm
-88
18Mbps OFDM
dBm
-85
24Mbps OFDM
dBm
-83
36Mbps OFDM
dBm
-80
48Mbps OFDM
dBm
-76
54Mbps OFDM
dBm
-74
MCS 0
dBm
-89
MCS 1
dBm
-87
MCS 2
dBm
-85
MCS 3
dBm
-82
MCS 4
dBm
-77
MCS 5
dBm
-74
MCS 6
dBm
-72
MCS 7
dBm
-71
1-11Mbps DSS
dBm
0
6-54Mbps OFDM
dBm
0
MCS 0 – 7
dBm
0
1Mbps DSS (30MHz offset)
dB
50
11Mbps DSS (25MHz offset)
dB
43
6Mbps OFDM (25MHz offset)
dB
40
54Mbps OFDM (25MHz offset)
dB
25
MCS 0 – 20MHz BW (25MHz offset)
dB
40
MCS 7 – 20MHz BW (25MHz offset)
dB
20
776-794MHz CDMA
dBm
-14
824-849MHz GSM
dBm
-10
880-915MHz GSM
dBm
-10
1710-1785MHz GSM
dBm
-15
1850-1910MHz GSM
dBm
-15
1850-1910MHz WCDMA
dBm
-24
1920-1980MHz WCDMA
dBm
-24
Maximum
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7.3.2
Transmitter Performance
Radio Performance under Typical Conditions: VBAT=3.6V; VDDIO=3.3V; Temp: 25°C.
Table 7-2.
Transmitter Performance
Parameter
Description
Frequency
Unit
Minimum
MHz
2,412
802.11b DSSS 1Mbps
dBm
802.11b DSSS 11Mbps
dBm
20.61
802.11g OFDM 6Mbps
dBm
20.51
802.11g OFDM 54Mbps
dBm
17.81
802.11n HT20 MCS 0
dBm
18.81
802.11n HT20 MCS 7
dBm
15.31
Tx Power Accuracy
dB
±1.52
Carrier Suppression
dBc
30.0
76-108
dBm/Hz
-125
776-794
dBm/Hz
-125
869-960
dBm/Hz
-125
925-960
dBm/Hz
-125
1570-1580
dBm/Hz
-125
1805-1880
dBm/Hz
-125
1930-1990
dBm/Hz
-125
2110-2170
dBm/Hz
-125
2nd
dBm/MHz
-33
3rd
dBm/MHz
-38
Out of Band Transmit
Power
Harmonic Output
Power
Notes:
1.
2.
3.
Maximum
2,484
20.61
Output Power
8
Typical3
Measured at 802.11 spec compliant EVM/Spectral Mask.
Measured at RF Pin assuming 50Ω differential.
RF performance guaranteed for Temp range -30 to 85deg. 1dB derating in performance at -40deg.
External Interfaces
ATWINC1500A external interfaces include I2C Slave for control, SPI Slave and SDIO Slave for control and
data transfer, I2C Master for external EEPROM, UART for debug, control, and data transfer, General Purpose
Input/Output (GPIO) pins, and a Wi-Fi/Bluetooth coexistence interface. With the exception of the SPI Slave and
SDIO Slave host interfaces, which are selected using the dedicated SDIO_SPI_CFG pin, the other interfaces
can be assigned to various pins by programming the corresponding pin muxing control register for each pin to
a specific value between 0 and 6.The default values of these registers are 0, which is GPIO mode. The
summary of the available interfaces and their corresponding pin mux settings is shown in Table 8-1. For
specific programming instructions refer to ATWINC1500A Programming Guide.
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Table 8-1.
8.1
Pin-Mux Matrix of External Interfaces
I2C Slave Interface
The I2C Slave interface, used primarily for control by the host processor, is a two-wire serial interface
consisting of a serial data line (SDA, Pin 33) and a serial clock (SCL, Pin 32). It responds to the seven bit
address value 0x60. The ATWINC1500A I2C supports I2C bus Version 2.1 - 2000 and can operate in standard
mode (with data rates up to 100Kb/s) and fast mode (with data rates up to 400Kb/s).
The I2C Slave is a synchronous serial interface. The SDA line is a bidirectional signal and changes only while
the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to
perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the
maximum capacitance specification of 400pF. Data is transmitted in byte packages.
For specific information, refer to the Philips Specification entitled “The I2C -Bus Specification, Version 2.1”.
The I2C Slave timing is provided in Figure 8-1 and 0.
Figure 8-1.
I2C Slave Timing Diagram
tPR
tSUDAT
tHDDAT
tBUF
tSUSTO
SDA
tHL
tLH
tWL
SCL
tHDSTA
tLH
tHL
tWH
tPR
fSCL
tPR
tSUSTA
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Table 8-2.
8.2
I2C Slave Timing Parameters
Parameter
Symbol
Min
Max
Units
SCL Clock Frequency
fSCL
0
400
kHz
SCL Low Pulse Width
tWL
1.3
µs
SCL High Pulse Width
tWH
0.6
µs
SCL, SDA Fall Time
tHL
300
ns
SCL, SDA Rise Time
tLH
300
ns
START Setup Time
tSUSTA
0.6
µs
START Hold Time
tHDSTA
0.6
µs
SDA Setup Time
tSUDAT
100
ns
SDA Hold Time
tHDDAT
0
40
ns
ns
STOP Setup time
tSUSTO
0.6
µs
Bus Free Time Between
STOP and START
tBUF
1.3
µs
Glitch Pulse Reject
tPR
0
50
Remarks
This is dictated by external
components
Slave and Master Default
Master Programming Option
ns
I2C Master Interface
ATWINC1500A provides an I2C bus master, which is intended primarily for accessing an external EEPROM
memory through a software-defined protocol. The I2C Master is a two-wire serial interface consisting of a serial
data line (SDA) and a serial clock line (SCL). SDA can be configured on one of the following pins: GPIO1 (pin
24) or I2C_SDA (pin 33). SCL can be configured on one of the following pins: GPIO0 (pin 10) or I2C_SCL (pin
32). For more specific instructions refer to ATWINC1500A Programming Guide.
The I2C Master interface supports three speeds:

Standard mode (100kb/s)

Fast mode (400kb/s)

High-speed mode (3.4Mb/s)
The timing diagram of the I2C Master interface is the same as that of the I2C Slave interface (see Figure 8-1).
The timing parameters of I2C Master are shown in Table 8-3.
Table 8-3.
I2C Master Timing Parameters
Standard Mode
Parameter
18
Fast Mode
High-Speed Mode
Symbol
Units
Min
Max
Min
Max
Min
Max
100
0
400
0
3400
SCL Clock Frequency
fSCL
0
SCL Low Pulse Width
tWL
4.7
1.3
0.16
µs
SCL High Pulse Width
tWH
4
0.6
0.06
µs
SCL Fall Time
tHLSCL
300
300
10
40
ns
SDA Fall Time
tHLSDA
300
300
10
80
ns
SCL Rise Time
tLHSCL
1000
300
10
40
ns
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kHz
Standard Mode
Parameter
High-Speed Mode
Units
Min
8.3
Fast Mode
Symbol
Max
Min
1000
Max
Min
Max
300
10
80
SDA Rise Time
tLHSDA
START Setup Time
tSUSTA
4.7
0.6
0.16
µs
START Hold Time
tHDSTA
4
0.6
0.16
µs
SDA Setup Time
tSUDAT
250
100
10
ns
SDA Hold Time
tHDDAT
5
40
0
STOP Setup time
tSUSTO
4
0.6
0.16
Bus Free Time Between
STOP and START
tBUF
4.7
1.3
Glitch Pulse Reject
tPR
0
70
ns
ns
µs
µs
50
ns
SPI Slave Interface
ATWINC1500A provides a Serial Peripheral Interface (SPI) that operates as a SPI slave. The SPI Slave
interface can be used for control and for serial I/O of 802.11 data. The SPI Slave pins are mapped as shown in
Table 8-4. The RXD pin is same as Master Output, Slave Input (MOSI), and the TXD pin is same as Master
Input, Slave Output (MISO). The SPI Slave is a full-duplex slave-synchronous serial interface that is available
immediately following reset when pin 9 (SDIO_SPI_CFG) is tied to VDDIO.
Table 8-4.
SPI Slave Interface Pin Mapping
Pin #
SPI Function
9
CFG: Must be tied to VDDIO
16
SSN: Active Low Slave Select
18
SCK: Serial Clock
13
RXD: Serial Data Receive (MOSI)
17
TXD: Serial Data Transmit (MISO)
When the SPI is not selected, i.e., when SSN is high, the SPI interface will not interfere with data transfers
between the serial-master and other serial-slave devices. When the serial slave is not selected, its transmitted
data output is buffered, resulting in a high impedance drive onto the serial master receive line.
The SPI Slave interface responds to a protocol that allows an external host to read or write any register in the
chip as well as initiate DMA transfers. For the details of the SPI protocol and more specific instructions refer to
ATWINC1500A Programming Guide.
The SPI Slave interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock
Phase (CPHA) settings. These modes are illustrated in 0 and Figure 8-2. The red lines in Figure 8-2
correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1.
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Table 8-5.
SPI Slave Modes
Mode
CPOL
CPHA
0
0
0
1
0
1
2
1
0
3
1
1
Figure 8-2.
SPI Slave Clock Polarity and Clock Phase Timing
CPOL = 0
SCK
CPOL = 1
SSN
CPHA = 0
RXD/TXD
(MOSI/MISO)
CPHA = 1
z
1
z
2
1
3
2
4
3
The SPI Slave timing is provided in Figure 8-3 and Table 8-6.
Figure 8-3.
20
SPI Slave Timing Diagram
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0
5
4
6
5
7
6
8
7
z
8
z
Table 8-6.
8.4
SPI Slave Timing Parameters
Parameter
Symbol
Min
Max
Units
Clock Input Frequency
fSCK
48
MHz
Clock Low Pulse Width
tWL
15
ns
Clock High Pulse Width
tWH
15
ns
Clock Rise Time
tLH
10
ns
Clock Fall Time
tHL
10
ns
Input Setup Time
tISU
5
ns
Input Hold Time
tIHD
5
ns
Output Delay
tODLY
0
Slave Select Setup Time
tSUSSN
5
ns
Slave Select Hold Time
tHDSSN
5
ns
20
ns
UART
ATWINC1500A has a Universal Asynchronous Receiver/Transmitter (UART) interface for serial
communication. It is intended primarily for debugging, and it can also be used for control or data transfer if the
baud rate is sufficient for a given application. The UART is compatible with the RS-232 standard, where
ATWINC1500A operates as Data Terminal Equipment (DTE). It has a two-pin RXD/TXD interface, where RXD
can be enabled on one of four alternative pins and TXD can be enabled on one of three alternative pins by
programming their corresponding pin mux control registers to 3 (see Table 8-1). The UART features
programmable baud rate generation with fractional clock division, which allows transmission and reception at a
wide variety of standard and non-standard baud rates. The UART input clock is selectable between 10MHz,
5MHz, 2.5MHz, and 1.25MHz. The clock divider value is programmable as 13 integer bits and 3 fractional bits
(with 8.0 being the smallest recommended value for normal operation). This results in the maximum supported
baud rate of 10MHz/8.0 = 1.25MBd.
The UART can be configured for seven or eight bit operation, with or without parity, with four different parity
types (odd, even, mark, or space), and with one or two stop bits. It also has Rx and Tx FIFOs, which ensure
reliable high speed reception and low software overhead transmission. FIFO size is 4x8 for both Rx and Tx
direction. The UART also has status registers showing the number of received characters available in the FIFO
and various error conditions, as well the ability to generate interrupts based on these status bits.
An example of UART receiving or transmitting a single packet is shown in Figure 8-4. This example shows 7-bit
data (0x45), odd parity, and two stop bits.
For more specific instructions refer to ATWINC1500A Programming Guide.
Figure 8-4.
Example of UART Rx or Tx Packet
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8.5
Wi-Fi/Bluetooth Coexistence
ATWILC1000A supports 2-wire and 3-wire Wi-Fi/Bluetooth Coexistence signaling conforming to the IEEE
802.15.2-2003 standard, Part 15.2. The type of coexistence interface used (2 or 3 wire) is chosen to be
compatible with the specific Bluetooth device used in a given application. Table 8-7 shows a usage example of
the 2-wire interface using the GPIO3 and GPIO4 pins; 3-wire interface using the GPIO3, GPIO4, and GPIO5
pins; for more specific instructions on configuring Coexistence refer to ATWILC1000A Programming Guide.
Table 8-7.
8.6
Coexistence Pin Assignment Example
Pin Name
Function
Target
Pin #
2-wire
3-wire
GPIO3
BT_Req
BT is requesting to access the medium to transmit or
receive. Goes high on TX or RX slot.
28
Used
Used
GPIO4
BT_Pri
Priority of the BT packets in the requested slot. High
to indicate high priority and low for normal.
29
Not Used
Used
GPIO5
WL_Act
Device response to the BT request. High - BT_req is
denied and BT slot blocked.
30
Used
Used
GPIO6
Ant_SW
Direct control on Antenna (coex bypass).
31
Optional
Optional
GPIOs
Eight General Purpose Input/Output (GPIO) pins, labeled GPIO0, GPIO1, GPIO2, GPIO7, GPIO8, GPIO15,
GPIO16, and GPIO18, are available to allow for application specific functions. Each GPIO pin can be
programmed as an input (the value of the pin can be read by the host or internal processor) or as an output
(the output values can be programmed by the host or internal processor), where the default mode after powerup is input. GPIOs 7 and 8 are only available when the host does not use the SDIO interface, which shares two
of its pins with these GPIOs. Therefore, for SDIO-based applications, six GPIOs are available. For more
specific usage instructions refer to ATWINC1500A Programming Guide.
9
Power Management
9.1
Power Architecture
ATWINC1500A uses an innovative power architecture to eliminate the need for external regulators and reduce
the number of off-chip components. This architecture is shown in Figure 9-1. The Power Management Unit
(PMU) has a DC/DC Converter that converts VBATT to the core supply used by the digital and RF/AMS blocks.
Table 9-1 shows the typical values for the digital and RF/AMS core voltages. The PA and EFuse are supplied
by dedicated LDOs, and the VCO is supplied by a separate LDO structure.
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Figure 9-1.
Power Architecture
RF/AMS
VDDIO
VDD_VCO
VDDIO_A
1.2V
LDO1
LDO2
VBATT
VDD_BATT
1.0V
PA
~
SX
VDD_AMS,
VDD_RF,
VDD_SXDIG
EFuse
LDO
RF/AMS Core
2.5V
Digital
VDDC
VDDIO
RF/AMS Core Voltage
EFuse
Digital Core
Pads
dcdc_ena
PMU
Digital Core Voltage
Sleep
Osc
CHIP_EN
ena
Sleep
LDO
Dig Core
LDO
ena
VREG_BUCK
ena
VBATT_BUCK
DC/DC Converter
Vin
Table 9-1.
VSW
Vout
Off-Chip
LC
PMU Output Voltages
Parameter
Typical
RF/AMS Core Voltage (VREG_BUCK)
1.35V
Digital Core Voltage (VDDC)
1.10V
The power connections in Figure 9-1 provide a conceptual framework for understanding the ATWINC1500A
power architecture. Refer to the reference design in Chapter 10 for an example of power supply connections,
including proper isolation of the supplies used by the digital and RF/AMS blocks.
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9.2
Power Consumption
9.2.1
Description of Device States
ATWINC1500A has several Devices States:
9.2.2

ON_Transmit
– Device is actively transmitting an 802.11 signal

ON_Receive
– Device is actively receiving an 802.11 signal

ON_Doze
– Device is on but is neither transmitting nor receiving

Power_Down
– Device core supply off (Leakage)

IDLE connect
– Device is connected with 1 DTIM beacon interval
Controlling the Device States
Table 9-2 shows how to switch between the device states using the following:

CHIP_EN
– Device pin (pin #23) used to enable DC/DC Converter

VDDIO
– I/O supply voltage from external supply
Table 9-2.
Device States
Power Consumption1
Device State
VDDIO
IVBATT
IVDDIO
ON_Transmit
VDDIO
On
230mA @ 18dBm
29mA
ON_Receive
VDDIO
On
68mA
29mA
ON_Doze
VDDIO
On
280µA
<10µA
Power_Down
GND
On
<0.5µA
<0.2µA
Note:
9.2.3
CHIP_EN
1.
Conditions: VBAT @ 3.6v, [email protected]
Restrictions for Power States
When no power supplied to the device, i.e., the DC/DC Converter output and VDDIO are both off (at ground
potential). In this case, a voltage cannot be applied to the device pins because each pin contains an ESD
diode from the pin to supply. This diode will turn on when voltage higher than one diode-drop is supplied to the
pin.
If a voltage must be applied to the signal pads while the chip is in a low power state, the VDDIO supply must
be on, so the SLEEP or Power_Down state must be used.
Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one
diode-drop below ground to any pin.
9.3
Power-Up/Down Sequence
The power-up/down sequence for ATWILC1000A is shown in Figure 9-2. The timing parameters are provided
in Table 9-3.
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Figure 9-2.
Power Up/Down Sequence
VBATT
tA
t A'
VDDIO
tB
t B'
CHIP_EN
tC
t C'
RESETN
XO Clock
Table 9-3.
Power-Up/Down Sequence Timing
Parameter
Min
tA
tB
Max
Units
Description
Notes
0
ms
VBATT rise to VDDIO rise
VBATT and VDDIO can rise simultaneously
or can be tied together. VDDIO must not rise
before VBATT.
0
ms
VDDIO rise to CHIP_EN rise
CHIP_EN must not rise before VDDIO.
CHIP_EN must be driven high or low, not
left floating.
tC
5
ms
CHIP_EN rise to RESETN rise
This delay is needed because XO clock
must stabilize before RESETN removal. RESETN must be driven high or low, not left
floating.
tA’
0
ms
VDDIO fall to VBATT fall
VBATT and VDDIO can fall simultaneously
or can be tied together. VBATT must not fall
before VDDIO.
tB’
0
ms
CHIP_EN fall to VDDIO fall
VDDIO must not fall before CHIP_EN.
CHIP_EN and RESETN can fall simultaneously.
tC’
0
ms
RESETN fall to VDDIO fall
VDDIO must not fall before RESETN. RESETN and CHIP_EN can fall simultaneously.
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9.4
Digital I/O Pin Behavior during Power-Up Sequences
Table 9-4 represents digital IO Pin states corresponding to device power modes.
Table 9-4.
Digital I/O Pin Behavior in Different Device States
Device State
VDDIO
CHIP_EN
RESETN
Output Driver
Input Driver
Pull Up/Down
Resistor
(96kΩ)
Power_Down:
core supply off
High
Low
Low
Disabled (HiZ)
Disabled
Disabled
Power-On Reset:
core supply on, hard reset on
High
High
Low
Disabled (HiZ)
Disabled
Enabled
Power-On Default:
core supply on, device out of
reset but not programmed
yet
High
High
High
Disabled (HiZ)
Enabled
Enabled
High
Programmed
by firmware
for each pin:
Enabled or
Disabled
Opposite of
Output
Driver state
Programmed
by firmware for
each pin: Enabled or Disabled
On_Doze/
On_Transmit/
On_Receive:
core supply on, device programmed by firmware
10
High
High
Reference Design
The ATWINC1500A reference design schematic is shown in Figure 10-1.
26
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Figure 10-1.
ATWINC1500A Reference Schematic
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11
Reference Documentation and Support
11.1
Reference Documents
Atmel offers a set of collateral documentation to ease integration and device ramp.
The following list of documents available on Atmel web or integrated into development tools.
Title
Content
Datasheet
This Document
Design Files
Package
User Guide, Schematic, PCB layout, Gerber, BOM & System notes on: RF/Radio Full Test Report,
radiation pattern, design guidelines, temperature performance, ESD.
Platform Getting
Started Guide
How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start
guidelines.
HW Design
Guide
Best practices and recommendations to design a board with the product,
Including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance
matching, using a power amplifier etc), SPI/UART protocol between Wi-Fi SoC and the Host
MCU.
SW Design
Guide
Integration guide with clear description of: High level Arch, overview on how to write a networking
application, list all API, parameters and structures.
Features of the device, SPI/handshake protocol between device and host MCU, with flow/sequence/state diagram, timing.
SW Programmer Guide
Explain in details the flow chart and how to use each API to implement all generic use cases (e.g.
start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage & sample App note
For a complete listing of development-support tools & documentation, visit http://www.atmel.com/, or contact
the nearest Atmel field representative.
28
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12
Revision History
Doc Rev.
Date
Comments
42353D
02/2015
New sections added, replaced text in most sections, new and updated drawings.
42353C
01/2015
Datasheet status changed from “Preliminary” to “Complete”. Updated “Ordering Information” on page 3. Major editing updates.
42353B
11/2014
Major document update, new sections added, replaced text in most sections, new and
updated drawings.
42353A
09/2014
Initial document release.
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