MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS Ç ÇÇ 6 PIN DFN, 3x3x0.9 CASE 488AE−01 ISSUE B DATE 30 NOV 2005 1 SCALE 2:1 EDGE OF PACKAGE A D B L1 DETAIL A BOTTOM VIEW E PIN ONE REFERENCE ÇÇ ÇÇ ÇÇ 0.15 C 2X NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS ONTO BOTTOM SURFACE OF TERMINAL b. DIM A A1 A3 b D D2 E E2 e K L L1 EXPOSED Cu MOLD COMPOUND 0.15 C 2X TOP VIEW DETAIL B A1 0.10 C 6X 0.08 C A1 SEATING PLANE ÇÇÇ ÇÇÇ (A3) DETAIL B SIDE VIEW A GENERIC MARKING DIAGRAM* (A3) C SIDE VIEW Ç Ç Ç ÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ XXXX XXXX ALYW D2 1 6X L 6X K 3 ÇÇÇ ÇÇÇ 6 e DETAIL A E2 XXXX A L Y W = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week 4 BOTTOM VIEW DOCUMENT NUMBER: MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 0.25 0.18 0.30 3.00 BSC 2.25 2.55 3.00 BSC 1.55 1.85 0.65 BSC 0.20 −−− 0.30 0.50 0.00 0.021 6X b NOTE 3 0.10 C A B 0.05 C 98AON15231D *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD © Semiconductor Components Industries, LLC, 2004 versions are uncontrolled except whenOrder stamped 1 Publication Number: March, 2004 − Rev. P1 NCP623/D “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 1 OFXXX 2 6 PIN DFN, 3X3X0.9 MM, 0.65 MM 1 PITCH DOCUMENT NUMBER: 98AON15231D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY B. LOFTS. 13 APR 2004 A ADDED NOTE 5, ADDED DETAIL VIEWS AND DIMENSION L1. REQ. BY B. LOFTS 26 JAN 2005 B CHANGED DESCRIPTION FROM QFN TO DFN. REQ. BY B. LOFTS. 30 NOV 2005 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2005 November, 2005 − Rev. 01B Case Outline Number: 488AE