6 PIN DFN, 3x3

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Ç
ÇÇ
6 PIN DFN, 3x3x0.9
CASE 488AE−01
ISSUE B
DATE 30 NOV 2005
1
SCALE 2:1
EDGE OF PACKAGE
A
D
B
L1
DETAIL A
BOTTOM VIEW
E
PIN ONE
REFERENCE
ÇÇ
ÇÇ
ÇÇ
0.15 C
2X
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
EXPOSED Cu
MOLD COMPOUND
0.15 C
2X
TOP VIEW
DETAIL B
A1
0.10 C
6X
0.08 C
A1
SEATING
PLANE
ÇÇÇ
ÇÇÇ
(A3)
DETAIL B
SIDE VIEW
A
GENERIC
MARKING DIAGRAM*
(A3)
C
SIDE VIEW
Ç
Ç
Ç
ÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
XXXX
XXXX
ALYW
D2
1
6X
L
6X
K
3
ÇÇÇ
ÇÇÇ
6
e
DETAIL A
E2
XXXX
A
L
Y
W
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
4
BOTTOM VIEW
DOCUMENT NUMBER:
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20
0.25
0.18
0.30
3.00 BSC
2.25
2.55
3.00 BSC
1.55
1.85
0.65 BSC
0.20
−−−
0.30
0.50
0.00 0.021
6X
b
NOTE 3
0.10 C A B
0.05 C
98AON15231D
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
© Semiconductor Components Industries, LLC, 2004
versions are uncontrolled except
whenOrder
stamped
1
Publication
Number:
March, 2004 − Rev. P1
NCP623/D
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
6 PIN DFN, 3X3X0.9 MM, 0.65 MM
1 PITCH
DOCUMENT NUMBER:
98AON15231D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
13 APR 2004
A
ADDED NOTE 5, ADDED DETAIL VIEWS AND DIMENSION L1. REQ. BY B. LOFTS
26 JAN 2005
B
CHANGED DESCRIPTION FROM QFN TO DFN. REQ. BY B. LOFTS.
30 NOV 2005
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2005
November, 2005 − Rev. 01B
Case Outline Number:
488AE
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