Data Sheet

BGA6489
MMIC wideband medium power amplifier
Rev. 02 — 15 June 2009
Product data sheet
1. Product profile
1.1 General description
The BGA6489 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband
medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic, low
thermal resistance, SMD package.
The BGA6x89 series of medium power gain blocks are resistive feedback Darlington
configured amplifiers. Resistive feedback provides large bandwidth with high accuracy.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
n
n
n
n
Broadband 50 Ω gain block
20 dBm output power
SOT89 package
Single supply voltage needed
1.3 Applications
n
n
n
n
n
n
n
n
Broadband medium power gain blocks
Small signal high linearity amplifiers
Variable gain and high output power in combination with the BGA2031
Cellular, PCS and CDPD
IF/RF buffer amplifier
Wireless data SONET
Oscillator amplifier, final PA
Drivers for CATV amplifier
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD
DC device voltage
on pin 1; IS = 78 mA
-
5.1
-
V
IS
DC supply current
VS = 8 V; R1 = 39 Ω;
Tj = 25 °C
-
78
-
mA
|s21|2
insertion power gain
f = 1950 MHz
-
16
-
dB
NF
noise figure
f = 1950 MHz
-
3.3
-
dB
PL1dB
load power at 1 dB
gain compression
f = 850 MHz
-
20
-
dBm
f = 1950 MHz
-
17
-
dBm
2. Pinning information
Table 2.
Pinning
Pin
Description
1
RF_OUT/BIAS
2
GND
3
RF_IN
Simplified outline
Graphic symbol
3
1
2
3
2
sym130
1
3. Ordering information
Table 3.
Ordering information
Type number
BGA6489
Package
Name
Description
Version
SC-62
plastic surface-mounted package; collector pad for
good heat transfer; 3 leads
SOT89
4. Marking
Table 4.
Marking codes
Type number
Marking code
BGA6489
4A
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
2 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min Max
Unit
VD
DC device voltage
on pin 1; RF input AC coupled
-
V
IS
DC supply current
Ptot
total power dissipation
Tstg
6
-
150
mA
-
800
mW
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
PD
maximum drive power
-
15
dBm
Typ
Unit
100
K/W
[1]
Tsp ≤ 70 °C
[1]
Tsp is the temperature at the solder point of the ground lead, pin 2.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from junction to solder point
Tsp ≤ 70 °C
Rth(j-sp)
[1]
[1]
Tsp is the temperature at the solder point of the ground lead, pin 2.
7. Characteristics
Table 7.
Static characteristics
VS = 8 V; Tj = 25 °C; Rbias = 39 Ω[1]
Symbol Parameter
VD
DC device voltage
IS
supply current
[1]
Conditions
Min
Typ
Max Unit
on pin 1; IS = 78 mA
-
5.1
-
V
70
78
86
mA
VS = DC operating supply voltage applied to Rbias; see Figure 10
Table 8.
Characteristics
VS = 8 V; IS = 78 mA; Tamb = 25 °C; IP3(out) tone spacing = 1 MHz; PL = 0 dB per tone, Rbias = 39 Ω;
ZL = ZS = 50 Ω; unless otherwise specified; see Figure 10.
Symbol Parameter
Conditions
Min
Typ
Max Unit
|s21|2
f = 850 MHz
-
20
-
dB
f = 1950 MHz
-
16
-
dB
f = 2500 MHz
-
15
-
dB
RLIN
RLOUT
Insertion power gain
return losses input
return losses output
BGA6489_2
Product data sheet
f = 850 MHz
-
14
-
dB
f = 1950 MHz
-
16
-
dB
f = 2500 MHz
-
19
-
dB
f = 850 MHz
-
16
-
dB
f = 1950 MHz
-
12
-
dB
f = 2500 MHz
-
10
-
dB
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
3 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
Table 8.
Characteristics …continued
VS = 8 V; IS = 78 mA; Tamb = 25 °C; IP3(out) tone spacing = 1 MHz; PL = 0 dB per tone, Rbias = 39 Ω;
ZL = ZS = 50 Ω; unless otherwise specified; see Figure 10.
Symbol Parameter
Conditions
Min
Typ
Max Unit
NF
f = 850 MHz
-
3.1
-
dB
f = 1950 MHz
-
3.3
-
dB
f = 2500 MHz
-
3.4
-
dB
f = 850 MHz
-
1.2
-
f = 2500 MHz
-
1.3
-
K
PL1dB
IP3(in)
IP3(out)
noise figure
stability factor
load power at 1 dB gain compression
input intercept point
output intercept point
f = 850 MHz
-
20
-
dBm
f = 1950 MHz
-
17
-
dBm
f = 850 MHz
-
13
-
dBm
f = 2500 MHz
-
12
-
dBm
f = 850 MHz
-
33
-
dBm
f = 2500 MHz
-
27
-
dBm
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
200 MHz
2
5
10
0°
0
2.6 GHz
−5
−0.2
−135°
−2
−0.5
−45°
−1
−90°
1.0
mgx400
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 1.
Input reflection coefficient (s11); typical values
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
4 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
2.6 GHz
0.2
180°
0
0.2
1
0.5
2
5
10
0°
0
200 MHz
−5
−0.2
−135°
−2
−0.5
−45°
−1
1.0
−90°
mgx401
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 2.
Output reflection coefficient (s22); typical values
mgx403
25
mgx402
0
|s21|2
(dB)
|s12|2
(dB)
20
−10
15
−20
10
−30
5
−40
0
0
500
1000
1500
2000
2500
f (MHz)
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 3.
(|s21|2)
Insertion power gain
frequency; typical values
as a function of
0
1000
1500
2000
2500
f (MHz)
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 4.
Isolation (|s12|2) as a function of frequency;
typical values
BGA6489_2
Product data sheet
500
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
5 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
mgx404
25
PL1dB
(dBm)
mgx405
40
IP3(out)
(dBm)
20
30
15
20
10
10
5
0
0
0
500
1000
1500
2000
2500
f (MHz)
0
IS = 78 mA; VS = 8 V; ZO = 50 Ω.
Fig 5.
Fig 6.
mgx407
K
1500
2000
2500
f (MHz)
Output intercept as a function of frequency;
typical values
mgx406
5
NF
(dB)
4
4
3
3
2
2
1
1
0
0
0
500
1000
1500
2000
2500
f (MHz)
0
IS = 78 mA; VS = 8 V; ZO = 50 Ω.
Fig 7.
1000
IS = 78 mA; VS = 8 V; ZO = 50 Ω.
Load power as a function of frequency; typical
values
5
500
1000
1500
2000
2500
f (MHz)
IS = 78 mA; VS = 8 V; ZO = 50 Ω.
Stability factor as a function of frequency;
typical values
Fig 8.
Noise figure as a function of frequency; typical
values
BGA6489_2
Product data sheet
500
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
6 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
mgx408
100
Is
(mA)
90
80
70
60
−40
−20
20
0
40
60
80
Tj (°C)
VS = 8 V; Rbias = 39 Ω.
Fig 9. Supply current as function of operating junction temperature; typical values
8. Application information
Figure 10 shows a typical application circuit for the BGA6489 MMIC. The device is
internally matched to 50 Ω and therefore does not require any external matching. The
value of the input and output DC blocking capacitors C1 and C2 depends on the operating
frequency; see Table 9. Capacitors C1 and C2 are used in conjunction with L1 and C3 to
fine tune the input and output impedance. Capacitor C4 is a supply decoupling capacitor.
A 1 µF capacitor (C5) can be added for optimum supply decoupling. The external
components should be placed as close as possible to the MMIC. When using via holes,
use multiple via holes per pin in order to limit ground path induction. Resistor R1 is a bias
resistor providing DC current stability with temperature.
R1(2)
VS
C3
C4
C5(1)
L1
50 Ω
microstrip
C1
3
1
VD C2
50 Ω
microstrip
2
mgx419
(1) Optional capacitor for optimum supply decoupling.
(2) R1 values at operating supply voltage:
VS = 6 V; R1 = 27 Ω.
VS = 8 V; R1 = 39 Ω.
VS = 11 V; R1 = 82 Ω.
Fig 10. Typical application circuit
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
7 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
Table 9.
List of components
See Figure 10 for circuit.
Component Description
Package
Value at operating frequency
500 MHz
800 MHz
1950 MHz 2400 MHz 3500 MHz
C1, C2
multilayer ceramic chip capacitor
0603
220 pF
100 pF
68 pF
56 pF
39 pF
C3
multilayer ceramic chip capacitor
0603
100 pF
68 pF
22 pF
22 pF
15 pF
C4
multilayer ceramic chip capacitor
0603
1 nF
1 nF
1 nF
1 nF
1 nF
C5[1]
electrolytic or tantalum capacitor
0603
1 µF
1 µF
1 µF
1 µF
1 µF
L1
SMD inductor
0603
68 nH
33 nH
22 nH
18 nH
15 nH
R1
SMD resistor 0.5 W; VS = 8 V
-
39 Ω
39 Ω
39 Ω
39 Ω
39 Ω
[1]
Optional.
8.1 Scattering parameters
Table 10. Scattering parameters
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω; Tamb = 25 °C
f (MHz)
s11
s21
s12
s22
K
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
200
0.06
28.11
12.79
164.42
0.06
−0.30
0.12
−22.91
1.1
300
0.09
27.41
12.59
156.85
0.06
−0.39
0.13
−35.38
1.1
400
0.11
21.64
12.31
149.28
0.06
−0.35
0.14
−46.54
1.1
500
0.12
15.28
11.97
141.88
0.06
−0.32
0.14
−57.20
1.1
600
0.14
8.01
11.57
134.79
0.06
0.04
0.15
−61.41
1.1
700
0.16
0.34
11.18
127.97
0.06
0.63
0.16
−76.76
1.1
800
0.17
−7.27
10.75
121.56
0.05
1.57
0.16
−85.75
1.2
900
0.18
−14.78
10.24
115.06
0.05
1.85
0.17
−94.28
1.2
1000
0.19
−22.18
9.80
109.18
0.05
3.16
0.17
−102.4
1.2
1100
0.20
−29.33
9.40
103.40
0.05
4.29
0.17
−110.3
1.2
1200
0.21
−36.41
8.96
98.12
0.05
5.64
0.17
−118.5
1.2
1300
0.21
−42.47
8.53
92.76
0.05
7.03
0.17
−126.7
1.2
1400
0.22
−49.06
8.16
87.50
0.06
7.74
0.17
−134.8
1.2
1500
0.22
−55.46
7.85
82.76
0.06
9.08
0.17
−143.5
1.3
1600
0.22
−61.20
7.51
78.52
0.06
10.76
0.16
−152.7
1.3
1700
0.22
−67.02
7.16
74.16
0.06
11.89
0.16
−161.8
1.3
1800
0.21
−73.40
6.90
69.37
0.06
12.34
0.16
−171.9
1.3
1900
0.21
−78.99
6.69
65.14
0.06
13.16
0.16
177.4
1.3
2000
0.20
−84.54
6.42
61.15
0.06
14.33
0.16
166.81
1.3
2100
0.19
−91.32
6.16
56.80
0.07
14.84
0.17
156.07
1.3
2200
0.18
−97.58
5.99
52.55
0.07
15.05
0.17
145.29
1.3
2300
0.17
−103.60
5.83
49.08
0.07
15.72
0.19
135.65
1.3
2400
0.16
−111.90
5.58
45.43
0.07
15.96
0.20
126.23
1.3
2500
0.14
−120.80
5.39
40.67
0.08
15.27
0.22
117.16
1.3
2600
0.13
−129.80
5.30
36.66
0.08
14.68
0.24
110.35
1.3
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
8 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
Table 10. Scattering parameters
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω; Tamb = 25 °C
f (MHz)
s11
s21
s12
s22
K
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
2700
0.13
−143.80
5.18
33.88
0.08
15.64
0.28
104.05
1.3
2800
0.12
−154.47
5.08
30.28
0.08
15.56
0.31
97.10
1.3
2900
0.11
−164.40
4.71
22.43
0.09
11.60
0.28
91.75
1.3
3000
0.11
178.65
4.66
18.90
0.09
11.05
0.31
84.80
1.3
3100
0.12
160.01
4.45
18.63
0.10
10.63
0.33
80.37
1.3
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
9 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
9. Package outline
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads
SOT89
B
D
A
bp3
E
HE
Lp
1
2
3
c
bp2
w M B
bp1
e1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp1
bp2
bp3
c
D
E
e
e1
HE
Lp
w
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.23
4.6
4.4
2.6
2.4
3.0
1.5
4.25
3.75
1.2
0.8
0.13
OUTLINE
VERSION
REFERENCES
IEC
SOT89
JEDEC
JEITA
TO-243
SC-62
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16
06-08-29
Fig 11. Package outline SOT89 (SC-62)
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
10 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
10. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDPD
Cellular Digital Packet Data
IF
Intermediate Frequency
PCS
Personal Communication Service
SMD
Surface Mount Device
SONET
Synchronous Optical NETwork
11. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA6489_2
20090615
Product data sheet
-
BGA6489_1
Modifications:
BGA6489_1
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Changed IS from 74 mA to 78 mA throughout.
Table 1: changed symbol VS to VD.
Table 5: changed symbol VS to VD and added “on pin 1;” to Conditions.
Table 7: added row for VD DC device voltage.
Section 8: added sentence.
Table 9: added 39 Ω to all value columns for resistor R1.
Table 9: amended values of C3 and C4.
20030918
Product data sheet
BGA6489_2
Product data sheet
-
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
11 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGA6489_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 15 June 2009
12 of 13
BGA6489
NXP Semiconductors
MMIC wideband medium power amplifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 7
Scattering parameters . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 June 2009
Document identifier: BGA6489_2
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