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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
Ball Size (mm)
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
CSP BGA
10 X 10
144
SnAgCu
Yes
Yes
Yes
Yes
0.45
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.83 E-02
1.27 E-03
1.27 E-03
3.18 E-04
6.37 E-05
2.12 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
9.66
0.67
0.67
0.17
0.03
11.20
PPM
96577
6722
6722
1681
336
112039
Laminate
Homogeneous Material Level
Description
Copper & its alloys
Thermoset
Other inorganic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Thermoset
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Substance
Copper Foil
Epoxy resin
Silica
Calcium oxide
Magnesium oxide
Aluminum oxide
Boron oxide
Zinc
Chromium
CAS#
7440-50-8
26265-08-7
14808-60-7
1305-78-8
1309-48-8
1344-28-1
Proprietary
7440-66-6
7440-47-3
Laminate Core Subtotal
Acrylic resin
Barium Sulfate, Silica, Talc
3-Methoxy-3-Methyl Butyl-Acetate
Epoxy resin
Dipropylene Glycol Monomethyl Ether
Barium Sulfate
Aromatic Carbonyl Compound
High Boiling Point Petroleum Solvent
Acrylic Monomer
Levelling agent & others
Organic filler
Amine compound
Phthalocyanine Green, Organic Pigment
Soldermask Subtotal
Copper
Nickel
Gold
Component Level
Weight (g)
1.93 E-02
6.32 E-03
3.27 E-03
7.70 E-04
7.70 E-04
7.57 E-04
3.83 E-04
7.92 E-05
1.27 E-05
3.17 E-02
3.28 E-03
2.50 E-03
1.84 E-03
1.72 E-03
1.18 E-03
8.42 E-04
3.24 E-04
3.11 E-04
5.05 E-04
2.07 E-04
1.68 E-04
5.18 E-05
2.59 E-05
1.30 E-02
2.59 E-02
7.20 E-04
7.20 E-04
7.20 E-02
Proprietary
Proprietary
Proprietary
Proprietary
34590-94-8
7727-43-7
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
26.83
8.78
4.54
1.07
1.07
1.05
0.53
0.11
0.02
44.00
4.55
3.47
2.56
2.39
1.64
1.17
0.45
0.43
0.70
0.29
0.23
0.07
0.04
18.00
36.00
1.00
1.00
100.0
268312
87824
45364
10692
10692
10516
5324
1100
176
440000
45540
34740
25560
23940
16380
11700
4500
4320
7020
2880
2340
720
360
180000
360000
10000
10000
1000000
10.20
3.34
1.72
0.41
0.41
0.40
0.20
0.04
0.01
16.73
1.73
1.32
0.97
0.91
0.62
0.44
0.17
0.16
0.27
0.11
0.09
0.03
0.01
6.84
13.68
0.38
0.38
38.01
PPM
101993
33384
17244
4064
4064
3997
2024
418
67
167257
17311
13206
9716
9100
6227
4448
1711
1642
2669
1095
890
274
137
68423
136846
3801
3801
380129
Solder Ball
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Substance
CAS#
Weight (g)
7440-31-5
7440-22-4
7440-50-8
Tin
Silver
Copper
4.91 E-02
1.53 E-03
2.54 E-04
5.09 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
25.91
0.81
0.13
26.85
PPM
259138
8056
1343
268537
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
1.15 E-03
1.17 E-05
1.17 E-03
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.61
0.01
0.62
PPM
6091
62
6152
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
3.95 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
20.88
PPM
208772
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Thermoset
Subtotal
Substance
Silver
Polymeric materia
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
CAS#
Weight (g)
3.05 E-03
7.63 E-04
2.86 E-04
2.86 E-04
1.14 E-04
1.14 E-04
4.62 E-03
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
1.89 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
66.11
16.53
6.20
6.20
2.48
2.48
100.00
661100
165300
62000
62000
24800
24800
1000000
1.61
0.40
0.15
0.15
0.06
0.06
2.44
Percentage (%)
100.00
PPM
16112
4029
1511
1511
604
604
24372
PPM
1000000