PDF

Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
9X9
100
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size (mm)
0.45
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
7.90 E-02
5.50 E-03
5.50 E-03
1.37 E-03
2.75 E-04
9.16 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
41.27
2.87
2.87
0.72
0.14
47.88
PPM
412719
28728
28728
7182
1436
478793
Laminate
Homogeneous Material Level
Description
Copper & its alloys
Composite
Thermoset
Thermoset
Thermoset
Other inorganic materials
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Other organic materials
Other inorganic materials
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Substance
Copper Foil
Glass Cloth
Epoxy resin
Bismaleimide
Triazine
Inorganic filler
CAS#
1.01 E-02
1.22 E-02
2.43 E-03
2.43 E-03
2.43 E-03
4.86 E-03
3.44 E-02
1.71 E-03
1.74 E-03
9.61 E-04
6.16 E-04
8.98 E-04
2.62 E-04
1.70 E-04
1.60 E-04
1.07 E-04
8.73 E-05
2.91 E-05
1.46 E-05
6.75 E-03
5.88 E-03
1.35 E-03
1.60 E-04
4.85 E-02
7440-50-8
65997-17-3
7238-97-4
13676-54-5
25722-66-1
Proprietary
Laminate Core Subtotal
Modified resin
Barium Sulfate
Aromatic hydrocarbon
Diethylene Glycol Monomethyl Ether Acetate
Epoxy resin
Acrylic ester monomer
Aromatic Carbonyl Compound
Dipropylene gylcol monomethyl ether
Levelling Agents & Others
Organic Filler
Amine Compound
Phthalocyanine Green
Soldermask Subtotal
Copper
Nickel
Gold
Component Level
Weight (g)
Proprietary
7727-43-7
Proprietary
112-15-2
85954-11-6
Proprietary
Proprietary
34590-94-8
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
20.76
25.04
5.01
5.01
5.01
10.02
70.85
3.52
3.59
1.98
1.27
1.85
0.54
0.35
0.33
0.22
0.18
0.06
0.03
13.92
12.12
2.78
0.33
100.00
207600
250400
50100
50100
50100
100200
708500
35200
35900
19800
12700
18500
5400
3500
3300
2200
1800
600
300
139200
121200
27800
3300
1000000
5.26
6.35
1.27
1.27
1.27
2.54
17.96
0.89
0.91
0.50
0.32
0.47
0.14
0.09
0.08
0.06
0.05
0.02
0.01
3.53
3.07
0.70
0.08
25.35
PPM
52630
63481
12701
12701
12701
25403
179618
8924
9101
5020
3220
4690
1369
887
837
558
456
152
76
35290
30726
7048
837
253519
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Silver
Copper
CAS#
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
3.41 E-02
1.06 E-03
1.77 E-04
3.53 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
17.80
0.55
0.09
18.45
PPM
178008
5534
922
184464
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
7.74 E-04
7.82 E-06
7.82 E-04
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.40
0.004
0.41
PPM
4046
41
4087
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Component Level
Weight (g)
7440-21-3
1.41 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
7.39
PPM
73894
Die Attach
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Component Level
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
4.85 E-04
3.14 E-04
8.55 E-05
8.55 E-05
3.42 E-05
1.00 E-03
Weight (g)
1.91 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
48.30
31.25
8.52
8.52
3.41
100.00
483000
312500
85200
85200
34100
1000000
0.25
0.16
0.04
0.04
0.02
0.52
Percentage (%)
100.00
PPM
2533
1639
447
447
179
5244
PPM
1000000