Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA - Stacked Die 9X9 128 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size (mm) 0.40 Yes Yes No Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.05 E-01 5.54 E-03 5.54 E-03 1.85 E-03 3.54 E-04 1.18 E-01 Percentage (%) PPM Percentage (%) 88.73 4.70 4.70 1.57 0.30 100.00 887300 47000 47000 15700 3000 1000000 51.23 2.71 2.71 0.91 0.17 57.74 PPM 512291 27136 27136 9065 1732 577359 Laminate Homogeneous Material Level Substance Description Thermoset Copper & its alloys Composite Other inorganic materials Composite Thermoset Other inorganic materials Other organic materials Other inorganic materials Other inorganic materials Other organic materials Other organic materials Other inorganic materials Copper & its alloys Nickel & its alloys Precious Metals Subtotal Pre-preg Resin Copper Foil Pre-preg Glass Cloth Pre-preg Filler Core Glass Cloth Core Resin Core Filler Laminate Core Subtotal Solvent Naphtha, Heavy Arom Barium Sulfate Silica Acetophenone Derivatives Dipropylene glycol monomethyl ether Talc Soldermask Subtotal Copper Nickel Gold CAS# Component Level Weight (g) 68541-56-0 / 29690-82-2 /25068-38-6 7440-50-8 65997-17-3 Proprietary 65997-17-3 68541-56-0 / 29690-82-2 /25068-38-6 Proprietary 4.85 E-03 4.62 E-03 3.47 E-03 1.85 E-03 1.94 E-03 1.71 E-03 7.86 E-04 1.92 E-02 2.77 E-03 2.34 E-03 1.70 E-03 1.28 E-03 8.51 E-04 8.51 E-04 9.80 E-03 4.56 E-03 4.08 E-04 3.40 E-05 3.40 E-02 64742-94-5 7727-43-7 14808-60-7 Proprietary 34590-94-8 14807-96-6 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 14.26 13.58 10.19 5.43 5.70 5.03 2.31 56.50 8.14 6.89 5.01 3.76 2.50 2.50 28.80 13.40 1.20 0.10 100.00 142600 135800 101900 54300 57000 50300 23100 565000 81400 68900 50100 37600 25000 25000 288000 134000 12000 1000 1000000 2.37 2.26 1.70 0.90 0.95 0.84 0.38 9.41 1.36 1.15 0.83 0.63 0.42 0.42 4.80 2.23 0.20 0.02 16.7 PPM 23748 22616 16970 9043 9493 8377 3847 94094 13556 11474 8344 6262 4163 4163 47963 22316 1998 167 166538 Solder Ball Component Level Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance Tin Silver Copper CAS# Weight (g) 7440-31-5 7440-22-4 7440-50-8 3.06 E-02 9.53 E-04 1.59 E-04 3.18 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 15.00 0.47 0.08 15.54 PPM 150003 4663 777 155444 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# Component Level Weight (g) E-03 3.51 E 03 7440-57-5 7440 57 5 Percentage (%) PPM Percentage (%) 100 1000000 1.72 PPM 17179 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 1.58 E-02 Percentage (%) PPM Percentage (%) 100 1000000 7.71 PPM 77146 Die Attach 1 Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Subtotal Substance Silver Bismaleimide monomer Acrylate monomer CAS# Weight (g) 7440-22-4 TS#10049 TS #10055 5.02 E-04 1.00 E-04 5.02 E-05 6.52 E-04 Percentage (%) PPM Percentage (%) 76.93 15.38 7.69 100.00 769300 153800 76900 1000000 0.25 0.05 0.02 0.32 PPM 2457 491 246 3193 Die Attach 2 Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Substance Silica Di-ester resin Functionalized ester Epoxy resin Polymeric material CAS# Component Level Weight (g) 60676-86-0 / 7631-86-9 Proprietary Proprietary Proprietary Proprietary 8.45 E-05 5.16 E-05 3.75 E-05 1.41 E-05 1.41 E-05 2.02 E-04 Percentage (%) PPM Percentage (%) 41.86 25.58 18.60 6.98 6.98 100.00 418600 255800 186000 69800 69800 1000000 0.04 0.03 0.02 0.01 0.01 0.10 PPM 414 253 184 69 69 988 Die Attach 3 Homogeneous Material Level Description Other organic materials Thermoset Other organic materials Subtotal Substance Acrylic co-polymer Epoxy resin Phenol resin CAS# Component Level Weight (g) 60676-86-0/ 7631-86-9 Proprietary Proprietary 3.07 E-04 8.97 E-05 4.38 E-05 4.40 E-04 Weight (g) 2.04 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 69.66 20.39 9.95 100.00 696600 203900 99500 1000000 0.15 0.04 0.02 0.22 Percentage (%) 100.00 PPM 1500 439 214 2154 PPM 1000000