Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish Ball Size (mm) RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant CSP BGA 12 X 12 196 SnAgCu Yes Yes Yes Yes 0.45 Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other organic materials Other inorganic materials Other inorganic materials Subtotal Silica Epoxy Resin Phenol Resin Phenol Novolac Metal Hydroxide Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary 9003-35-4 Proprietary 1333-86-4 1.44 E-01 8.48 E-03 3.38 E-03 3.38 E-03 8.48 E-03 5.05 E-04 1.68 E-01 Percentage (%) PPM Percentage (%) 85.60 5.04 2.01 2.01 5.04 0.3 100.0 856000 50400 20100 20100 50400 3000 1000000 35.47 2.09 0.83 0.83 2.09 0.12 41.44 PPM 354730 20886 8330 8330 20886 1243 414404 Laminate Homogeneous Material Level Substance Description Copper & its alloys Other inorganic materials Thermoset Others Other inorganic materials Other inorganic materials Other inorganic materials Other inorganic materials Other organic materials Other inorganic materials Other inorganic materials Other organic materials Other organic materials Other inorganic materials Thermoset Other inorganic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals S bt t l Subtotal Copper Foil Silica Epoxy resin Proprietary Calcium oxide Magnesium oxide Aluminum oxide Boron oxide Dicyaniamide Zinc Chromium N,N-dimethylformamide Laminate Core Subtotal Acrylate resin Barium Sulfate Epoxy resin Dipropylene gylcol monomethyl ether Solvent naphtha (petroleum), Heavy arom Diethylene glycol monoethyl ether acetate Acrylic ester monomer Talc Morpholine derivative Urethane resin Silane Triazine derivative Pigment green Silica Pigment yellow Soldermask Subtotal Copper Nickel Gold CAS# Component Level Weight (g) 1.27 E-02 1.89 E-02 1.94 E-02 1.29 E-02 4.50 E-03 4.50 E-03 4.44 E-03 2.24 E-03 7.19 E-04 4.11 E-05 6.16 E-06 4.11 E-06 8.04 E-02 5.40 E-03 4.79 E-03 2.75 E-03 2.01 E-03 1.93 E-03 1.58 E-03 8.01 E-04 5.55 E-04 5.34 E-04 2.67 E-04 1.85 E-04 6.16 E-05 6.16 E-05 6.16 E-05 6.16 E-06 1.56 E-02 9.99 E-02 3.57 E-03 5.14 E-04 2.05 2 05 E E-01 01 7440-50-8 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 7440-66-6 7440-47-3 Proprietary 7727-43-7 85954-11-6 34590-94-8 64742-94-5 112-15-2 Proprietary 14807-96-6 Proprietary Proprietary Proprietary Proprietary Proprietary 7440-50-8 Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 6.17 9.21 9.45 6.29 2.19 2.19 2.16 1.09 0.35 0.02 0.003 0.002 39.13 2.63 2.33 1.34 0.98 0.94 0.77 0.39 0.27 0.26 0.13 0.09 0.03 0.03 0.03 0.003 10.22 48.66 1.74 0.25 100.0 100 0 61700 92120 94500 62900 21900 21900 21600 10900 3500 200 30 20 391270 26300 23300 13400 9800 9400 7700 3900 2700 2600 1300 900 300 300 300 30 102230 486600 17400 2500 1000000 3.12 4.66 4.78 3.18 1.11 1.11 1.09 0.55 0.18 0.01 0.002 0.001 19.79 1.33 1.18 0.68 0.50 0.48 0.39 0.20 0.14 0.13 0.07 0.05 0.02 0.02 0.02 0.002 5.17 24.61 0.88 0.13 51 PPM 31207 46593 47797 31814 11077 11077 10925 5513 1770 101 15 10 197900 13302 11785 6778 4957 4754 3895 1973 1366 1315 658 455 152 152 152 15 51707 246117 8801 1264 505788 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance CAS# 7440-31-5 7440-22-4 7440-50-8 Tin Silver Copper Component Level Weight (g) 1.54 E-02 4.80 E-04 8.00 E-05 1.60 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 3.80 0.12 0.02 3.94 PPM 38020 1182 197 39399 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 4.95 E-05 5.00 E-07 5.00 E-05 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.01 0.0001 0.01 PPM 122 1 123 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Component Level Weight (g) 7440-21-3 1.53 E-02 Percentage (%) PPM Percentage (%) 100 1000000 3.76 PPM 37577 Die Attach Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Diester resin Functionalized ester Epoxy resin Polymeric materia CAS# Component Level Weight (g) 4.60 E-04 2.81 E-04 2.05 E-04 7.68 E-05 7.68 E-05 1.10 E-03 Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) 4.06 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 41.86 25.58 18.60 6.98 6.98 100.00 418600 255800 186000 69800 69800 1000000 0.11 0.07 0.05 0.02 0.02 0.27 Percentage (%) 100.00 PPM 1134 693 504 189 189 2709 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size (mm) CSP BGA - Flip Chip 12 X 12 196 SnAgCu with RoHS exemption 0.45 Yes - with exemption Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 3.68 E-02 2.56 E-03 2.56 E-03 6.41 E-04 1.28 E-04 4.27 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 17.63 1.23 1.23 0.31 0.06 20.45 PPM 176272 12270 12270 3067 613 204492 Laminate Homogeneous Material Level Description Copper & its alloys Glass Thermoset Thermoset Other inorganic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious Metals Subtotal Substance Copper Foil Fiber Glass Bismaleimide Triazine Epoxy Resin Laminate Core Subtota Barium sulfate Dipropylene glyco monomethyl ethe Talc containing no asbestiform fibers Morpholine derivative Solvent naphta(petroleum), heavy arom Soldermask Subtota Copper Nickel Gold CAS# Component Level Weight (g) 7440-50-8 65997-17-3 Proprietary 7328-97-4 1.06 E-02 3.01 E-03 1.88 E-03 1.88 E-03 1.74 E-02 1.13 E-02 3.29 E-03 1.88 E-03 1.88 E-03 6.58 E-03 2.49 E-02 4.88 E-02 2.53 E-03 4.13 E-04 9.40 E-02 7727-43-7 Proprietary 14807-96-6 Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 11.27 3.20 2.00 2.00 18.47 12.00 3.50 2.00 2.00 7.00 26.50 51.90 2.69 0.44 100.0 112700 32000 20000 20000 184700 120000 35000 20000 20000 70000 265000 519000 26900 4400 1000000 5.07 1.44 0.90 0.90 8.31 5.40 1.57 0.90 0.90 3.15 11.92 23.35 1.21 0.20 45 PPM 50707 14398 8999 8999 83102 53992 15748 8999 8999 31495 87736 233514 12103 1980 449931 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance 7440-31-5 7440-22-4 7440-50-8 Tin Silver Copper Component Level Weight (g) CAS# 2.99 E-02 9.29 E-04 1.55 E-04 3 10 E 3.10 E-02 02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 14.31 0.44 0.07 14 83 14.83 PPM 143079 4448 741 148269 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 2.54 E-02 Component Level Percentage (%) PPM Percentage (%) 100 1000000 12.16 PPM 121642 Wafer Bumps Homogeneous Material Level Description Other inorganic materials Other organic materials Subtotal Substance Tin Lead CAS# Weight (g) 7440-31-5 7439-92-1 5.54 E-03 3.26 E-03 8.80 E-03 Component Level Percentage (%) PPM Percentage (%) 63.00 37.00 100.00 179070 105168 284238 2.66 1.56 4.21 PPM 26550 15593 42144 Underfill Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Other organic materials Other organic materials Other inorganic materials Subtotal Substance Silicon dioxide Bispenol F epoxy resin Phenolic resin Additive Bispenol A epoxy resin Amine accelerator Carbon Black CAS# Component Level Weight (g) 60676-86-0 9003-36-5 Proprietary Proprietary 25068-38-6 Proprietary 1333-86-4 3.71 E-03 1.40 E-03 1.05 E-03 3.50 E-04 2.10 E-04 2.10 E-04 7.00 E-05 7.00 E-03 Weight (g) 2.09 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledg ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary Percentage (%) PPM Percentage (%) 53.0 20.0 15.0 5.0 3.0 3.0 1.0 100.0 530000 200000 150000 50000 30000 30000 10000 1000000 1.78 0.67 0.50 0.17 0.10 0.10 0.03 3.35 Percentage (%) 100.00 PPM 17767 6705 5028 1676 1006 1006 335 33523 PPM 1000000