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a
204-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-204)
Dimensions shown in millimeters
12.10
12.00 SQ
11.90
PIN 1
INDICATOR
A1 CORNER
INDEX AREA
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
11.05
BSC SQ
TOP VIEW
0.65
BSC
BOTTOM VIEW
DETAIL A
*1.40 MAX
DETAIL A
0.91 MIN
0.25 MIN
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
012006-0
SEATING
PLANE
0.45
COPLANARITY
0.40
0.10 MAX
0.35
BALL DIAMETER