Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 3 X 3 X 0.75 (1.6EP) 16 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Carbon Black CAS# 60676-86-0 Proprietary Proprietary 1333-86-4 Component Level Weight (g) 9.50E-03 3.04E-04 3.04E-04 3.04E-05 1.01E-02 Percentage (%) PPM Percentage (%) 93.7 3.0 3.0 0.3 100.00 937000 30000 30000 3000 1000000 45.90 1.47 1.47 0.15 48.99 PPM 458995 14696 14696 1470 489856 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Weight (g) 9.47 E-03 2.28 E-04 1.17 E-05 2.91 E-06 9.71 E-03 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 45.74 1.10 0.06 0.01 46.92 PPM 457445 11026 563 141 469174 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 9.81 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.47 PPM 4739 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) 1.10 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.53 PPM 5314 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# 7440-57-5 7440-05-3 Weight (g) 1.98 E-04 2.00 E-06 2.00 E-04 Percentage (%) PPM Percentage (%) 99.00 1.0 100.0 990000 10000 1000000 0.96 0.010 0.97 PPM 9564 97 9661 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 4.10 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.98 PPM 19807 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 2.33 E-05 9.33 E-07 9.33 E-07 9.33 E-07 9.33 E-07 9.33 E-07 9.33 E-07 9.33 E-07 1.56 E-07 3.00 E-05 Weight (g) 2.07 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.11 0.00 0.005 0.005 0.005 0.005 0.005 0.005 0.001 0.14 Percentage (%) 100 PPM 1126 45 45 45 45 45 45 45 8 1449 PPM 1000000