Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 3 X 3 X 0.75 (1.5 EP) 12 100 Sn MS010587B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 7.22E-03 1.06E-03 2.57E-05 8.30E-03 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 35.55 5.23 0.13 40.91 PPM 355543 52282 1268 409094 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 9.61 E-03 2.49 E-04 5.98 E-05 4.98 E-05 9.97 E-03 Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 47.32 1.23 0.29 0.25 49.09 PPM 473234 12276 2947 2455 490912 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 2.49 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.12 PPM 1227 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 4.75 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 2.34 PPM 23377 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# 7440-57-5 7440-05-3 Component Level Weight (g) 4.70E-05 4.75E-07 4.75 E-05 Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.23 0.002 0.23 PPM 2314 23 2338 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.42 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 7.01 PPM 70130 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 4.61 E-05 1.84 E-06 1.84 E-06 1.84 E-06 1.84 E-06 1.84 E-06 1.84 E-06 1.84 E-06 3.08 E-07 5.93 E-05 Weight (g) 2.03 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.23 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.00 0.29 Percentage (%) 100 PPM 2271 91 91 91 91 91 91 91 15 2922 PPM 1000000