Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal Ag Item Sn LFCSP 6 X 6 X 0.85 40 Pb-free Molding Compound % of Compound 85 10 5 Weight (g) 2.90 E-02 3.41 E-03 1.71 E-03 3.41 E-02 PPM 326220 38379 19189 383788 Weight (g) 4.49 E-02 1.08 E-03 1.38 E-05 5.52 E-05 4.60 E-02 PPM 504669 12164 155 621 517610 Internal Leadframe Plating % of Plating Weight (g) 9.25 E-04 100 PPM 10403 External Leadframe Plating Weight (g) % of Plating 2.76 E-04 100 PPM 3108 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Au Bond Wires % of Wire 99.99 Weight (g) 9.36 E-04 PPM 10529 Si Chip % of Chip 100 Weight (g) 5.68 E-03 PPM 63923 Weight (g) 7.09 E-04 2.36 E-04 9.46 E-04 PPM 7979 2660 10639 Item Ag Filler Resin Subtotal Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & &196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Package Totals PPM Weight (g) 1000000 8.89 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-CP-C Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal Ag Item Sn Pb Subtotal Au LFCSP 6 X 6 X0.85 40 Sn/Pb Molding Compound % of Compound 85 10 5 Weight (g) 2.90 E-02 3.41 E-03 1.71 E-03 3.41 E-02 PPM 326220 38379 19189 383788 Weight (g) 4.49 E-02 1.08 E-03 1.38 E-05 5.52 E-05 4.60 E-02 PPM 504669 12164 155 621 517610 Internal Leadframe Plating % of Plating Weight (g) 9.25 E-04 100 PPM 10403 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 External Leadframe Plating Weight (g) % of Plating 2.35 E-04 85 4.14 E-05 15 2.76 E-04 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. 3 EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. PPM 2642 466 3108 Bond Wires % of Wire 99.99 Weight (g) 9.36 E-04 PPM 10529 % of Chip 100 Weight (g) 5.68 E-03 PPM 63923 Weight (g) 7.09 E-04 2.36 E-04 9.46 E-04 PPM Chip Si Item Ag Filler Resin Die Attach % of Die Attach 75 25 7979 2660 10639 Package Totals PPM Weight (g) 1000000 8.89 E-02 AMK-CP-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary