Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 10 X 10 X 0.85 72 Pb-free Molding Compound % of Compound 86.9 12.8 0.3 Weight (g) 1.43 E-01 2.10 E-02 5.09 E-04 1.64 E-01 PPM 510965 75137 1823 587925 Weight (g) 9.76 E-02 2.19 E-03 1.13 E-04 7.30 E-05 1.00 E-01 PPM 349500 7846 405 261 358013 Internal Leadframe Plating Weight (g) % of Plating 9.83 E-04 100 PPM 3520 External Leadframe Plating % of Plating Weight (g) 100 3.18 E-03 PPM 11388 Leadframe % of Leadframe 97.62 2.19 0.11 0.07 Au Bond Wires % of Wire 99.99 Weight (g) 1.71 E-03 PPM 6131 Si Chip % of Chip 100 Weight (g) 8.17 E-03 PPM 29268 Weight (g) 7.70 E-04 1.92 E-04 2.90 E-05 2.90 E-05 2.90 E-05 1.05 E-03 PPM 2757 688 104 104 104 3756 Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Die Attach % of Die Attach 73 18 3 3 3 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Molding Compound Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Die Attach Paste Package Totals PPM Weight (g) 1000000 2.79 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS.