Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Resin Carbon black Subtotal Item Cu Ni Si Mg Subtotal Ag Item Sn TQFP_EP 7 x 7 x 1.0 (5.1 mm exposed pad) 48 Pb-free Molding Compound % of Compound Weight (g) 86.91 7.61 E-02 12.78 1.12 E-02 0.31 2.72 E-04 8.76 E-02 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Molding Compound PPM 524680 77153 1875 603708 Weight (g) 3.22 E-02 1.00 E-03 2.17 E-04 5.00 E-05 3.34 E-02 PPM 221803 6914 1496 345 230557 Internal Leadframe Plating % of Plating Weight (g) 3.31 E-04 100.0 PPM 2282 External Leadframe Plating Weight (g) % of Plating 100.0 5.26 E-03 PPM 36230 Au Bond Wires % of Wire 99.99 Si % of Chip 100.0 Weight (g) 1.10 E-03 PPM 7610 Weight (g) 1.47 E-02 PPM 101589 Weight (g) 1.89 E-03 4.73 E-04 1.78 E-04 7.10 E-05 2.62 E-03 PPM 13048 3260 1227 489 18025 Package Totals Weight (g) 1.45 E-01 PPM 1000000 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Chip Item Ag Epoxy compound Anhydrides Polymeric material Subtotal Die Attach % of Die Attach 72.4 18.1 6.8 2.7 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary