plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad

P6
4
HT
QF
SOT855-1
plastic thermal enhanced thin quad flat package; 64 leads;
body 10 x 10 x 1 mm; exposed die pad
8 February 2016
Package information
1. Package summary
Terminal position code
Q (quad)
Package type descriptive code
HTQFP64
Package type industry code
HTQFP64
Package style descriptive code
HTQFP (thermal enhanced thin quad flat
package)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
JEDEC package outline code
MS-026
Mounting method type
S (surface mount)
Issue date
11-5-2005
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
9.9
-
[tbd]
10.1
mm
E
package width
9.9
-
[tbd]
10.1
mm
A
seated height
[tbd]
-
[tbd]
1.2
mm
A2
package height
0.95
-
[tbd]
1.05
mm
e
nominal pitch
-
-
0.5
-
mm
n2
actual quantity of termination
-
-
64
-
SOT855-1
NXP Semiconductors
plastic thermal enhanced thin quad flat package;
64 leads; body 10 x 10 x 1 mm; exposed die pad
2. Package outline
HTQFP64: plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad
SOT855-1
c
y
exposed die pad
X
Dh
A
48
33
49
ZE
32
e
Eh
E
w
HE
(A 3)
A A2
M
θ
A1
bp
Lp
L
detail X
pin 1
index
64
17
1
16
w
bp
e
v
ZD
M
D
M
A
B
HD
v
0
M
B
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
A3
bp
c
D (1)
Dh
E (1)
Eh
e
mm
1.2
0.12
0.05
1.05
0.95
0.25
0.27
0.17
0.18
0.12
10.1
9.9
4.7
4.5
10.1
9.9
4.7
4.5
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.1
ZD(1) ZE(1)
θ
1.45
1.05
7°
0°
1.45
1.05
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
OUTLINE
VERSION
SOT855-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-05-18
05-05-11
MS-026
Fig. 1. Package outline HTQFP64 (SOT855-1)
SOT855-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT855-1
NXP Semiconductors
plastic thermal enhanced thin quad flat package;
64 leads; body 10 x 10 x 1 mm; exposed die pad
3. Soldering
Hx
Gx
P2
(0.125)
P1
SPx
nSPx
Hy
SLy
Gy
SPy tot
SPy
By
Ay
nSPy
SPx tot
SLx
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste
occupied area
nSPx
nSPy
4
4
DIMENSIONS in mm
P1
P2
Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
SLx
SLy
SPx tot SPy tot
0.500 0.560 13.300 13.300 10.300 10.300 1.500 0.280 0.400 10.500 10.500 13.550 13.550 4.900 4.900
4.800
4.800
SPx
SPy
0.800 0.800
sot855-1_fr
Fig. 2. Reflow soldering footprint for HTQFP64 (SOT855-1)
SOT855-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT855-1
NXP Semiconductors
plastic thermal enhanced thin quad flat package;
64 leads; body 10 x 10 x 1 mm; exposed die pad
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT855-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT855-1
NXP Semiconductors
plastic thermal enhanced thin quad flat package;
64 leads; body 10 x 10 x 1 mm; exposed die pad
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOT855-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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