INTEGRATED CIRCUITS P82B96 Dual bi-directional bus buffer Product data Supersedes data of 2003 Apr 02 2004 Mar 26 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 PIN CONFIGURATIONS 8-pin dual in-line, SO, TSSOP Sx 1 8 VCC Rx 2 7 Sy Tx 3 6 Ry GND 4 5 Ty FEATURES • Bi-directional data transfer of I2C-bus signals • Isolates capacitance allowing 400 pF on Sx/Sy side and SU01011 4000 pF on Tx/Ty side • Tx/Ty outputs have 60 mA sink capability for driving ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁ low impedance or high capacitive buses PINNING • 400 kHz operation over at least 20 meters of wire (see AN10148) • Supply voltage range of 2 V to 15 V with I2C logic levels on Sx/Sy SYMBOL side independent of supply voltage • Splits I2C signal into pairs of forward/reverse Tx/Rx, Ty/Ry signals for interface with opto-electrical isolators and similar devices that need uni-directional input and output signal paths. • Low power supply current • ESD protection exceeds 3500 V HBM per JESD22-A114, 250 V DIP package / 400 V SO package MM per JESD22-A115, and 1000 V CDM per JESD22-C101 • Latch-up free (bipolar process with no latching structures) • Packages offered: DIP, SO, and TSSOP DESCRIPTION Sx 1 I2C-bus Rx 2 Receive signal Tx 3 Transmit signal GND 4 Negative Supply Ty 5 Transmit signal Ry 6 Receive signal Sy 7 I2C-bus (SDA or SCL) VCC 8 Positive supply (SDA or SCL) SPECIAL NOTE: Two or more Sx or Sy I/Os must not be interconnected. The P82B96 design does not support this configuration. Bi-directional I2C signals do not allow any direction control pin so, instead, slightly different logic low voltage levels are used at Sx/Sy to avoid latching of this buffer. A “regular I2C low” applied at the Rx/Ry of a P82B96 will be propagated to Sx/Sy as a “buffered low” with a slightly higher voltage level. If this special “buffered low” is applied to the Sx/Sy of another P82B96 that second P82B96 will not recognize it as a “regular I2C-bus low” and will not propagate it to its Tx/Ty output. The Sx/Sy side of P82B96 may not be connected to similar buffers that rely on special logic thresholds for their operation, for example PCA9511, PCA9515, or PCA9518. The Sx/Sy side is only intended for, and compatible with, the normal I2C logic voltage levels of I2C master and slave chips—or even Tx/Rx signals of a second P82B96 if required. The Tx/Rx and Ty/Ry I/O pins use the standard I2C logic voltage levels of all I2C parts. There are NO restrictions on the interconnection of the Tx/Rx and Ty/Ry I/O pins to other P82B96s, for example in a star or multi-point configuration with the Tx/Rx and Ty/Ry I/O pins on the common bus and the Sx/Sy side connected to the line card slave devices. For more details see Application Note AN255. TYPICAL APPLICATIONS • Interface between I2C buses operating at different logic levels (e.g., 5 V and 3 V or 15 V) • Interface between I2C and SMB (350 µA) bus standard. • Simple conversion of I2C SDA or SCL signals to multi-drop differential bus hardware, e.g., via compatible PCA82C250. • Interfaces with Opto-couplers to provide Opto isolation between I2C-bus nodes up to 400 kHz. DESCRIPTION The P82B96 is a bipolar IC that creates a non-latching, bi-directional, logic interface between the normal I2C-bus and a range of other bus configurations. It can interface I2C-bus logic signals to similar buses having different voltage and current levels. For example it can interface to the 350 µA SMB bus, to 3.3 V logic devices, and to 15 V levels and/or low impedance lines to improve noise immunity on longer bus lengths. It achieves this interface without any restrictions on the normal I2C protocols or clock speed. The IC adds minimal loading to the I2C node, and loadings of the new bus or remote I2C nodes are not transmitted or transformed to the local node. Restrictions on the number of I2C devices in a system, or the physical separation between them, are virtually eliminated. Transmitting SDA/SCL signals via balanced transmission lines (twisted pairs) or with galvanic isolation (opto-coupling) is simple because separate directional Tx and Rx signals are provided. The Tx and Rx signals may be directly connected, without causing latching, to provide an alternative bi-directional signal line with I2C properties. 2004 Mar 26 PIN 2 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 ORDERING INFORMATION TEMPERATURE RANGE ORDER CODE TOPSIDE MARK DRAWING NUMBER 8-pin plastic dual In-line package PACKAGES –40 °C to +85 °C P82B96PN P82B96PN SOT97-1 8-pin plastic small outline package –40 °C to +85 °C P82B96TD P82B96T SOT96-1 8-pin plastic thin shrink small outline package –40 °C to +85 °C P82B96DP 82B96 SOT505-1 NOTE: 1. Standard packing quantities and other packaging data are available at www.philipslogic.com/packaging. BLOCK DIAGRAM +VCC (2–15 V) 8 Sx (SDA) 3 1 Tx (TxD, SDA) 2 Rx (RxD, SDA) Sy (SCL) 5 7 6 Ty (TxD, SCL) Ry (RxD, SCL) P82B96 4 GND SU01012 FUNCTIONAL DESCRIPTION The P82B96 has two identical buffers allowing buffering of both of the I2C (SDA and SCL) signals. Each buffer is made up of two logic signal paths, a forward path from the I2C interface pin which drives the buffered bus, and a reverse signal path from the buffered bus input to drive the I2C-bus interface. Tx is an open collector output without ESD protection diodes to VCC. It may be connected via a pull-up resistor to a supply voltage in excess of VCC, as long as the 15 V rating is not exceeded. It has a larger current sinking capability than a normal I2C device, being able to sink a static current of greater than 30 mA, and typical 100 mA dynamic pull-down capability as well. Thus these paths are: 1. Sense the voltage state of the I2C pin Sx (or Sy) and transmit this state to the pin Tx (Ty resp.), and A logic LOW is only transmitted to Tx when the voltage at the I2C pin (Sx) is below 0.6 V. A logic LOW at Rx will cause the I2C-bus (Sx) to be pulled to a logic LOW level in accordance with I2C requirements (max. 1.5 V in 5 V applications) but not low enough to be looped back to the Tx output and cause the buffer to latch LOW. 2. Sense the state of the pin Rx (Ry) and pull the I2C pin LOW whenever Rx (Ry) is LOW. The rest of this discussion will address only the “x” side of the buffer: the “y” side is identical. The minimum LOW level this chip can achieve on the I2C-bus by a LOW at Rx is typically 0.8 V. The I2C pin (Sx) is designed to interface with a normal I2C-bus. If the supply voltage VCC fails, then neither the I2C nor the Tx output will be held LOW. Their open collector configuration allows them to be pulled up to the rated maximum of 15 V even without VCC present. The input configuration on Sx and Rx also present no loading of external signals even when VCC is not present. I2C-bus are independent of The logic threshold voltage levels on the the IC supply VCC The maximum I2C-bus supply voltage is 15 V and the guaranteed static sink current is 3 mA. The logic level of Rx is determined from the power supply voltage VCC of the chip. Logic LOW is below 42 % of VCC, and logic HIGH is above 58 % of VCC: with a typical switching threshold of half VCC. 2004 Mar 26 The effective input capacitance of any signal pin, measured by its effect on bus rise times, is less than 7 pF for all bus voltages and supply voltages including VCC = 0 V. 3 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 MAXIMUM RATINGS In accordance with the Absolute Maximum Rating System (IEC 134). Voltages with respect to pin GND (pin 4). 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MAX. UNIT VCC to GND Supply voltage range VCC PARAMETER –0.3 +18 V Vbus Voltage range on I2C Bus, SDA or SCL –0.3 +18 V VTx Voltage range on buffered output –0.3 +18 V VRx Voltage range on receive input –0.3 +18 V I DC current (any pin) — 250 mA Rtot Power dissipation — 300 mW Tstg Storage temperature range –55 +125 °C Tamb Operating ambient temperature range –40 +85 °C CHARACTERISTICS At Tamb = 25 °C; Voltages are specified with respect to GND with VCC = 5 V unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Power Supply VCC Supply voltage (operating) 2.0 — 15 V ICC Supply current, buses HIGH — 0.9 1.8 mA ICC Supply current at VCC = 15 V, buses HIGH — 1.1 2.5 mA ICC Additional supply current per Tx or Ty LOW — 1.7 3.5 mA Bus pull-up (load) voltages and currents VSx, VSy Maximum input/output voltage level Open collector; I2C-bus and VRx, VRy = HIGH — — 15 V ISx, ISy Static output loading on I2C-bus (Note 1) VSx, VSy = 1.0 V; VRx, VRy = LOW 0.2 — 3 mA ISx, ISy Dynamic output sink capability on I2C-bus VSx, VSy > 2 V; VRx, VRy = LOW 7 18 — mA ISx, ISy Leakage current on I2C-bus VSx, VSy = 5 V; VRx, VRy = HIGH — — 1 µA ISx, ISy Leakage current on I2C-bus VSx, VSy = 15 V; VRx, VRy = HIGH — 1 — µA VTx, VTy Maximum output voltage level Open collector — — 15 V ITx, ITy Static output loading on buffered bus VTx, VTy = 0.4 V; VSx, VSy = LOW on I2C-bus = 0.4 V — — 30 mA ITx, ITy Dynamic output sink capability, buffered bus VTx, VTy > 1 V VSx, VSy = LOW on I2C-bus = 0.4 V 60 100 — mA ITx, ITy Leakage current on buffered bus VTx, VTy = VCC = 15 V; VSx, VSy = HIGH — 1 — µA ISx, ISy Input current from I2C-bus bus LOW VRx, VRy = HIGH — –1 — µA IRx, IRy Input current from buffered bus bus LOW VRx, VRy = 0.4 V — –1 — µA IRx, IRy Leakage current on buffered bus input VRx, VRy = VCC — 1 — µA Input Currents Output Logic LOW Levels VSx, VSy Output logic level LOW, on normal I2C bus (Note 2) ISx, ISy = 3 mA 0.8 0.88 1.0 V VSx, VSy Output logic level LOW, on normal I2C bus (Note 2) ISx, ISy = 0.2 mA 670 730 790 mV dVSx/dT, dVSy/dT Temperature coefficient of output LOW levels (Note 2) ISx, ISy = 0.2 mA — –1.8 — mV/K 2004 Mar 26 4 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT — 640 600 mV 700 650 — mV — –2 — mV/K Input logic switching threshold voltages VSx, VSy Input logic voltage LOW (Note 3) On normal I2C-bus On normal I2C-bus VSx, VSy Input logic level HIGH threshold (Note 3) dVSx/dT, dVSy/dT Temperature coefficient of input thresholds VRx, VRy Input logic HIGH level Fraction of applied VCC 0.58 — — V VRx, VRy Input threshold Fraction of applied VCC — 0.5 — V VRx, VRy Input logic LOW level Fraction of applied VCC — — 0.42 V VSX output LOW at 0.2 mA – VSX input HIGH max 50 85 — mV Logic level threshold difference VSx, VSy Input/Output logic level difference (Note 1) NOTES: 1. The minimum value requirement for pull-up current, 200 µA, guarantees that the minimum value for VSX output LOW will always exceed the minimum VSX input HIGH level to eliminate any possibility of latching. The specified difference is guaranteed by design within any IC. While the tolerances on absolute levels allow a small probability the LOW from one SX output is recognized by an SX input of another P82B96 this has no consequences for normal applications. In any design the SX pins of different ICs should never be linked because the resulting system would be very susceptible to induced noise and would not support all I2C operating modes. 2. The output logic LOW depends on the sink current. For scaling, see Application Note AN255. 3. The input logic threshold is independent of the supply voltage. ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ CHARACTERISTICS At Tamb = 25 °C; Voltages are specified with respect to GND with VCC = 5 V unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Bus Release on VCC Failure VSx, VSy, VTx, VTy VCC voltage at which all buses are guaranteed to be released — — 1 V dV/dT Temperature coefficient of guaranteed release voltage — –4 — mV/K Buffer response time Tfall delay VSx to VTx VSy to VTy Buffer time delay on FALLING input between VSx = input switching threshold, and VTx output falling 50%. RTx pull-up = 160 Ω, no capacitive load, VCC = 5 V — 70 — ns Trise delay VSx to VTx VSy to VTy Buffer time delay on RISING input between VSx = input switching threshold, and VTx output reaching 50% VCC RTx pull-up = 160 Ω, no capacitive load, VCC = 5 V — 90 — ns Tfall delay VRx to VSx VRy to VSy Buffer time delay on FALLING input between VRx = input switching threshold, and VSx output falling 50%. RSx pull-up = 1500 Ω, no capacitive load, VCC = 5 V — 250 — ns Trise delay VRx to VSx VRy to VSy Buffer time delay on RISING input between VRx = input switching threshold, and VSx output reaching 50% VCC RSx pull-up = 1500 Ω, no capacitive load, VCC = 5 V — 270 — ns — — 7 pF Input capacitance Cin Effective input capacitance of any signal pin measured by incremental bus rise times NOTES ON RESPONSE TIME The fall-time of VTX from 5 V to 2.5 V in the test is approximately 15 ns. The fall-time of VSX from 5 V to 2.5 V in the test is approximately 50 ns. The rise-time of VTX from 0 V to 2.5 V in the test is approximately 20 ns. The rise-time of VSX from 0.9 V to 2.5 V in the test is approximately 70 ns. 2004 Mar 26 5 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 TYPICAL APPLICATIONS See AN460 and AN255 for more application detail. +VCC (2–15 V) +5 V R1 I2C SDA ‘SDA’ (NEW LEVELS) Tx (SDA) Rx (SDA) 1/2 PB2B96 SU01013 Figure 1. Interfacing an ‘I2C’ type of bus with different logic levels. +VCC +VCC1 R4 R2 R5 R3 I2C SDA +5 V Rx (SDA) R1 I2C SDA Tx (SDA) 1/2 P82B96 SU01014 Figure 2. Galvanic isolation of I2C nodes via opto-couplers MAIN ENCLOSURE REMOTE CONTROL ENCLOSURE 12 V 12 V 3.3–5 V 3.3–5 V LONG CABLES SCL SCL 12 V 3.3–5 V 3.3–5 V SDA SDA P82B96 P82B96 SU01708 Figure 3. Long distance I2C communications 2004 Mar 26 6 Philips Semiconductors Product data Dual bi-directional bus buffer VCC1 P82B96 100 kΩ 100 nF +V CABLE DRIVE +V CABLE DRIVE VCC2 VCC VCC RX SCL SX BC 847B 3 – 20 m CABLES TX TX I2C/DDC MASTER RX SX I2C/DDC SLAVE RY I2C/DDC SCL RY 4K7 SY SDA TY TY SY SDA 470 kΩ BC 847B P82B96 P82B96 470 kΩ GND MONITOR/FLAT TV GND PC/TV RECEIVER/DECODER BOX R G B su01785 VIDEO SIGNALS Figure 4. Extending a DCC bus Figure 4 shows how a master I2C-bus can be protected against short circuits or failures in applications that involve plug/socket connections and long cables that may become damaged. A simple circuit is added to monitor the SDA bus and if its LOW time exceeds the design value then the master bus is disconnected. P82B96 will free all its I/Os if its supply is removed, so one option is to connect its VCC to the output of a logic gate from, say, the 74LVC family. The SDA and SCL lines could be timed and VCC disabled via the gate if one or other lines exceeds a design value of ‘LOW’ period as in Figure 28 of AN255. If the supply voltage of logic gates restricts the choice of VCC supply then the low-cost discrete circuit in Figure 4 can be used. If the SDA line is held LOW, the 100 nF capacitor will charge and the Ry input will be pulled towards VCC. When it exceeds VCC/2 the Ry input will set the Sy input HIGH, which in practice means simply releasing it. is better treated using transmission line theory. Flat ribbon cables connected as shown, with the bus signals on the outer edge, will have a characteristic impedance in the range 100 – 200 Ω. For simplicity they cannot be terminated in their characteristic impedance but a practical compromise is to use the minimum pull-up allowed for P82B96 and place half this termination at each end of the cable. When each pull-up is below 330 Ω, the rising edge waveforms have their first voltage ‘step’ level above the logic threshold at Rx and cable timing calculations can be based on the fast rise/fall times of resistive loading plus simple one-way propagation delays. When the pull-up is larger, but below 750 Ω, the threshold at Rx will be crossed after one signal reflection. So at the sending end it is crossed after 2 times the one-way propagation delay and at the receiving end after 3 times that propagation delay. For flat cables with partial plastic dielectric insulation (by using outer cores) the one-way propagation delays will be about 5 ns/meter. The 10% to 90% rise and fall times on the cable will be between 20 ns and 50 ns, so their delay contributions are small. There will be ringing on falling edges that can be damped, if required, using Schottky diodes as shown. In this example the SCL line is made uni-directional by tying the Rx pin to VCC. The state of the buffered SCL line cannot affect the master clock line which is allowed when clock-stretching is not required. It is simple to add an additional transistor or diode to control the Rx input in the same way as Ry when necessary. The +V cable drive can be any voltage up to 15 V and the bus may be run at a lower impedance by selecting pull-up resistors for a static sink current up to 30 mA. VCC1 and VCC2 may be chosen to suit the connected devices. Because DDC uses relatively low speeds (<100 kHz), the cable length is not restricted to 20 m by the I2C signalling, but it may be limited by the video signalling. When the Master SCL HIGH and LOW periods can be programmed separately, e.g. using control registers I2SCLH and I2SCLL of 89LPC932, the timings can allow for bus delays. The LOW period should be programmed to achieve the minimum 1300 ns plus the net delay in the slave’s response data signal caused by bus and buffer delays. The longest data delay is the sum of the delay of the falling edge of SCL from master to slave and the delay of the rising edge of SDA from slave data to master. Because the buffer will ‘stretch’ the programmed SCL LOW period, the actual SCL Figure 5 shows that P82B96 can achieve high clock rates over long cables. While calculating with lumped wiring capacitance yields reasonable approximations to actual timing, even 25 meters of cable 2004 Mar 26 7 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 Note that in both the 100-meter and 250-meter examples the capacitive loading on the I2C-buses at each end is within the maximum allowed Standard mode loading of 400 pF, but exceeds the Fast mode limit. This is an example of a ‘hybrid’ mode because it relies on the response delays of Fast mode parts but uses (allowable) Standard mode bus loadings with rise times that contribute significantly to the system delays. The cables cause large propagation delays so these systems need to operate well below the 400 kHz limit but illustrate how they can still exceed the 100 kHz limit provided all parts are capable of Fast mode operation. The fastest example illustrates how the 400 kHz limit can be exceeded provided master and slave parts have delay specifications smaller than the maximum allowed. Many Philips slaves have delays shorter than 600 ns, but none have that guaranteed. frequency will be lower than calculated from the programmed clock periods. In the example for 25 meters the clock is stretched 400 ns, the falling edge of SCL is delayed 490 ns and the SDA rising edge is delayed 570 ns. The required additional LOW period is (490 + 570) = 1060 ns and the I2C-bus specifications already include an allowance for a worst case bus risetime 0 to 70% of 425 ns. (The bus risetime can be 300 ns 30% to 70%, which means it can be 425 ns 0–70%. The 25-meter cable delay times as quoted already include all rise/fall times.) Therefore, the micro only needs to be programmed with an addtional (1060 – 400 – 425) = 235 ns, making a total programmed LOW period 1535 ns. The programmed LOW will the be stretched by 400 ns to yield an actual bus LOW time of 1935 ns, which, allowing the minimum HIGH period of 600 ns, yields a cycle period of 2535 ns or 394 kHz. +V CABLE DRIVE VCC1 VCC2 R2 R2 VCC VCC R2 SCL R1 SX I2C MASTER SDA SY R1 R1 R1 R2 RX RX TX TX RY RY TY TY SX SCL I2C SLAVE(S) SY SDA CABLE P82B96 C2 P82B96 PROPAGATION DELAY ' 5 ns/m C2 C2 GND C2 GND BAT54A BAT54A su01786 Figure 5. Driving ribbon or flat telephone cables EXAMPLES OF BUS CAPABILITY (refer to Figure 5) +VCC1 CC +V CABLE +VCC2 CC R1 5V 12 V 5V 5V 12 V 3.3 V 3.3 V HIGH PERIOD LOW PERIOD 1.25 µs 600 ns 4000 ns 120 kHz Normal spec. 400 kHz parts Not applicable (delay based) 500 ns 600 ns 2600 ns 185 kHz Normal spec. 400 kHz parts 25 m 1 nF 125 ns 600 ns 1500 ns 390 kHz Normal spec. 400 kHz parts 3m 120 pF 15 ns 600 ns 1000 ns 500 kHz 600 ns R2 CABLE LENGTH CABLE CAPACITANCE CABLE DELAY 750 2.2 k 400 250 m Not applicable (delay based) 5V 750 2.2 k 220 100 m 5V 3.3 V 330 1k 220 5V 3.3 V 330 1k 100 2004 Mar 26 SET MASTER NOMINAL SCL EFFECTIVE BUS CLOCK SPEED C2 (pF) 8 MAXIMUM SLAVE RESPONSE DELAY Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 CALCULATING SYSTEM DELAYS AND BUS CLOCK FREQUENCY FOR A FAST MODE SYSTEM LOCAL MASTER BUS BUFFERED EXPANSION BUS VCCM REMOTE SLAVE BUS VCCB VCCS Rm MASTER Rb Rs SCL SCL SLAVE Sx P82B96 Tx/Rx Tx/Rx P82B96 Sx I2C I2C Cm = MASTER BUS CAPACITANCE Cb = BUFFERED BUS WIRING CAPACITANCE Cs = SLAVE BUS CAPACITANCE GND/0 V A) FALLING EDGE OF SCL AT MASTER IS DELAYED BY THE BUFFERS AND BUS FALL TIMES EFFECTIVE DELAY OF SCL AT SLAVE = 255 + 17 VCCM + (2.5 + 4 × 109 Cb) VCCB (ns) C = F, V = VOLTS su01787 Figure 6. LOCAL MASTER BUS BUFFERED EXPANSION BUS VCCM VCCB Rb Rm SCL MASTER Sx Tx/Rx P82B96 Tx/Rx I2C Cm = MASTER BUS CAPACITANCE Cb = BUFFERED BUS WIRING CAPACITANCE GND/0 V B) RISING EDGE OF SCL AT MASTER IS DELAYED (CLOCK STRETCH) BY BUFFER AND BUS RISE TIMES EFFECTIVE DELAY OF SCL AT MASTER = 270 + RmCm + 0.7RbCb (ns), Figure 7. 2004 Mar 26 9 C = F, R = Ω su01788 Philips Semiconductors Product data Dual bi-directional bus buffer LOCAL MASTER BUS P82B96 BUFFERED EXPANSION BUS VCCM REMOTE SLAVE BUS VCCB VCCS Rm MASTER Rb Rs SDA SDA SLAVE Sx P82B96 Tx/Rx Tx/Rx P82B96 Sx I2C I2C Cm = MASTER BUS CAPACITANCE Cb = BUFFERED BUS WIRING CAPACITANCE Cs = SLAVE BUS CAPACITANCE GND/0 V C) RISING EDGE OF SDA AT SLAVE IS DELAYED BY THE BUFFERS AND BUS RISE TIMES EFFECTIVE DELAY OF SDA AT MASTER = 270 + 0.2RsCs + 0.7 (RbCb + RmCm) (ns), C = F, R = Ω su01789 Figure 8. extend that minimum clock low period by any “effective” delay of the Slave’s response. The effective delay of the slaves response = total delays in SCL falling edge from the Master reaching the Slave (A) – the effective delay (stretch) of the SCL rising edge (B) + total delays in the Slave’s response data, carried on SDA, reaching the Master (C). Figures 6, 7, and 8 show the P82B96 used to drive extended bus wiring, with relatively large capacitance, linking two Fast mode I2C-bus nodes. It includes simplified expressions for making the relevant timing calculations for 3.3/5 V operation. Because the buffers and the wiring introduce timing delays, it may be necessary to decrease the nominal SCL frequency below 400 kHz. In most cases the actual bus frequency will be lower than the nominal Master timing due to bit-wise stretching of the clock periods. The Master microcontroller should be programmed to produce a nominal SCL LOW period = (1300 + A – B + C) ns, and should be programmed to produce the nominal minimum SCL HIGH period of 600 ns. Then a check should be made to ensure the cycle time is not shorter than the minimum 2500 ns. If found necessary, just increase either clock period. The delay factors involved in calculation of the allowed bus speed are: A) The propagation delay of the Master signal through the buffers and wiring to the Slave. The important delay is that of the falling edge of SCL because this edge ‘requests’ the data or Acknowledge from a Slave. Due to clock stretching, the SCL cycle time will always be longer than (600 + 1300 + A + C) ns. Example: B) The effective stretching of the nominal LOW period of SCL at the Master caused by the buffer and bus rise times The Master bus has an RmCm product of 100 ns and VCCM = 5 V. C) The propagation delay of the Slave’s response signal through the buffers and wiring back to the Master. The important delay is that of a rising edge in the SDA signal. Rising edges are always slower and are therefore delayed by a longer time than falling edges. (The rising edges are limited by the passive pull-up while falling edges are actively driven) The buffered bus has a capacitance of 1 nF and a pull-up resistor of 160 ohms to 5 V giving an RbCb product of 160 ns. The Slave bus also has an RsCs product of 100 ns. The microcontroller LOW period should be programmed to ≥ (1300 + 372.5 – 482 + 472) ns, that is ≥ 1662.5 ns. The timing requirement in any I2C system is that a Slave’s data response (which is provided in response to a falling edge of SCL) must be received at the Master before the end of the corresponding low period of SCL as appears on the bus wiring at the Master. Since all Slaves will, as a minimum, satisfy the worst case timing requirements of a 400 kHz part, they must provide their response within the minimum allowed clock LOW period of 1300 ns. Therefore in systems that introduce additional delays it is only necessary to 2004 Mar 26 Its HIGH period may be programmed to the minimum 600 ns. The nominal microcontroller clock period will be ≥ (1662.5 + 600) ns = 2262.5 ns, equivalent to a frequency of 442 kHz. The actual bus clock period, including the 482 ns clock stretch effect, will be below (nominal + stretch) = (2262.5 + 482) ns or ≥ 2745 ns, equivalent to an allowable frequency of 364 kHz. 10 Philips Semiconductors Product data Dual bi-directional bus buffer 12 V P82B96 12 V TWISTED-PAIR TELEPHONE WIRES, USB, OR FLAT RIBBON CABLES. UP TO 15 V LOGIC LEVELS, INCLUDE VCC AND GND. 3.3–5 V TX SX SCL RX 3.3–5 V 12 V TY SY SDA 3.3 V 3.3 V RY P82B96 P82B96 P82B96 P82B96 P82B96 SX SY SX SCL/SDA SY SCL/SDA SX SY SY SDA SCL/SDA SX SCL NO LIMIT TO THE NUMBER OF CONNECTED BUS DEVICES. su01709 Figure 9. I2C multi-point applications ch1: freq = 624 kHz ch1: freq = 624 kHz Tx Rx 10 V Sx Sx 5V 0V CH1!2.00V = AVG CH2!2.00V = BWL MTB 200 ns – 0.98dvch1+ CH1!2.00V = AVG CH2!2.00V = BWL MTB 200 ns – 0.98dvch1+ Horiz: 200 ns/div. VertL 2 V/div. SU01069 Horiz: 200 ns/div. VertL 2 V/div. Figure 10. Propagation Sx to Tx — Sx pull-up to 5V, Tx pull-up to VCC = 10 V 2004 Mar 26 SU01070 Figure 11. Propagation Rx to Sx — Sx pull-up to 5V, Rx pull-up to VCC = 10 V 11 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 SO8: plastic small outline package; 8 leads; body width 3.9 mm 2004 Mar 26 12 SOT96-1 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 DIP8: plastic dual in-line package; 8 leads (300 mil) 2004 Mar 26 13 SOT97-1 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm 2004 Mar 26 14 SOT505-1 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 REVISION HISTORY Rev Date Description _4 20040326 Product data (9397 750 12932). Supersedes data of 2003 Apr 02 (9397 750 11351). Modifications: • Page 2: – Features section re-written. – Add “TSSOP” to heading for pin configurations • Page 3, Ordering information table: correct description of TSSOP8 package. • Page 5, (continued) Characteristics table, Note 1, – third sentence: from “... the LOW from on SX output ...” to “... the LOW from one SX output ...” – fourth sentence: from “In any design the SX pins of different ICs because the resulting ...” to “In any design the SX pins of different ICs should never be linked because the resulting ...” • Figure 4: Change 2 transistors to bipolar type. Add dashed line between VCC1 and VCC, and between VCC2 and VCC to indicate optional/allowed links. • Figure 5: Add dashed line between VCC1 and VCC, and between VCC2 and VCC to indicate optional/allowed links. • Page 8, table “Examples of bus capability”: – cable capacitance 1 nF: change LOW period from “1600 ns” to “1500 ns” change Effective bus clock speed from “380 kHz” to “390 kHz” – change cable capacitance “120 nF” to “120 pF” • Add title “Calculating system delays and bus clock frequency for a Fast mode system” on page 9. • Add VCCB label to Figures 6, 7 and 8. • Page 10, “Example:” paragraphs 3, 5 and 6: values corrected in equations. • Add signal names to Figure 9. • Add package outline drawing SOT505-1. _3 20030402 Product data (9397 750 11351); ECN 853-2241 29602 dated 28 February 2003. Supersedes data of 2003 Jan 22 (9397 750 11093) _2 20030226 Product data (9397 750 11093); ECN 853-2241 29410 of 22 January 2003; supersedes data of 2001 Mar 06 (9397 750 08122) _1 20010306 Product data (9397 750 08122); ECN 853-2241 25758 of 2001 Mar 06. 2004 Mar 26 15 Philips Semiconductors Product data Dual bi-directional bus buffer P82B96 Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specifications defined by Philips. This specification can be ordered using the code 9398 393 40011. Data sheet status Level Data sheet status [1] Product status [2] [3] Definitions I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Koninklijke Philips Electronics N.V. 2004 All rights reserved. Printed in U.S.A. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 Date of release: 03-04 For sales offices addresses send e-mail to: [email protected]. Document order number: Philips Semiconductors 2004 Mar 26 16 9397 750 12932