INFINEON PTF180101M

PTF180101M
High Power RF LDMOS Field Effect Transistor
10 W, 1.0 – 2.0 GHz
Description
The PTF180101M is an unmatched 10-watt GOLDMOS ® FET intended for
class AB base station applications in the 1 to 2 GHz band. This LDMOS
device offers excellent gain, efficiency and linearity performance in a small
footprint.
PTF180101M
Package PG-RFP-10
Features
EDGE Performance
VDD = 28v, I DQ = 180 mA, ƒ = 1960 MHz
Typical EDGE performance
- Average output power = 4.0 W
- Gain = 17 dB
- Efficiency = 31%
- EVM = 1.3 %
•
Typical CW performance
- Output Power at P–1dB = 10 W
- Gain = 16 dB
- Efficiency = 50%
•
Integrated ESD protection:
Human Body Model Class 1 (minimum)
•
Excellent thermal stability
•
Low HCI drift
•
Capable of handling 10:1 VSWR @ 28 V,
10 W (CW) output power
•
Pb-free and RoHS compliant
40
1.25
30
1.00
20
Efficiency
0.75
10
Drain Efficiency (%) .
EVM RMS (Average %)
1.50
•
EVM
0.50
0
29
30
31
32
33
34
35
36
37
Output Power (dBm)
RF Characteristics
Two-Tone Measurements (not subject to production test—verified by design/characterization in Infineon test fixture)
VDD = 28 V, IDQ = 180 mA, POUT = 10 W PEP, ƒ = 1990 MHz, tone spacing = 1 MHz
Characteristic
Symbol
Min
Typ
Max
Unit
Gain
Gps
16.5
—
—
dB
Drain Efficiency
ηD
35
—
—
%
Intermodulation Distortion
IMD
—
—
–28
dBc
All published data at TCASE = 25°C unless otherwise indicated
*See Infineon distributor for future availability.
ESD: Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet
1 of 8
Rev. 05, 2005-12-06
PTF180101M
DC Characteristics
Characteristic
Conditions
Symbol
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
VGS = 0 V, IDS = 10 µA
V(BR)DSS
65
—
—
V
Drain Leakage Current
VDS = 28 V, V GS = 0 V
IDSS
—
—
1.0
µA
On-State Resistance
VGS = 10 V, V DS = 0.1 A
RDS(on)
—
0.83
—
Ω
Operating Gate Voltage
VDS = 28 V, IDQ = 180 mA
VGS
2.5
3.2
4.0
V
Gate Leakage Current
VGS = 10 V, V DS = 0 V
IGSS
—
—
1.0
µA
Maximum Ratings
Parameter
Symbol
Value
Unit
Drain-Source Voltage
VDSS
65
V
Gate-Source Voltage
VGS
–0.5 to +12
V
Junction Temperature
TJ
150
°C
Total Device Dissipation
PD
18.8
W
0.15
W/°C
Above 25°C derate by
Storage Temperature Range
TSTG
–40 to +150
°C
Thermal Resistance (TCASE = 70°C, 10 W DC )
RθJC
6.5
°C/W
Ordering Information
Type
Package Outline
Package Description
Marking
PTF180101M
PG-RFP-10
Molded plastic, SMD
0181
*See Infineon distributor for future availability.
Data Sheet
2 of 8
Rev. 05, 2005-12-06
PTF180101M
CW Performance
Two-Tone Performance
VDD = 28 V, I DQ = 180 mA, ƒ = 1960 MHz
VDD = 28 V, I DQ = 180 mA, ƒ = 1960/1961 MHz
19
50
18
40
Gain
-20
-30
16
20
15
10
-80
0
-90
15
20
25
30
35
40
5th order
40
-60
7th order
30
-70
Efficiency
20
10
0
25
45
30
40
45
P–1dB Broadband Performance
EDGE Performance
VDD = 28 V, I DQ = 180 mA
VDD = 28 V, I DQ = 180 mA, ƒ = 1960 MHz
20
Offset f = 200 kHz
60
Gain
10
Efficiency
5
50
0
-5
-10
Input Return Loss
-15
40
Modulation Spectrum (dBc)
-30
15
Drain Efficiency (%).
Gain & Return Loss (dB)
35
Output Power (dBm), PEP
Power Output (dBm)
-20
-25
1920
1940
1960
1980
30
2000
-35
-40
-45
-50
-55
Offset ƒ = 400 kHz
-60
-65
Offset ƒ = 600 kHz
-70
-75
29
Frequency (MHz)
Data Sheet
50
-50
30
14
60
-40
17
Efficiency
70
3rd order
Drain Efficiency (%)
60
IMD (dBc)
20
Drain Efficiency (%)
Gain (dB)
Typical Performance (data taken in production test fixture)
30
31
32
33
34
35
36
37
Output Power (dBm)
3 of 8
Rev. 05, 2005-12-06
PTF180101M
Typical Performance (cont.)
Gate-Source Voltage vs. Temperature
Normalized Bias Voltage
Voltage normalized to typical gate voltage,
series show current.
1.04
0.05
1.03
0.28
0.51
1.02
0.74
1.01
0.97
1.00
1.2
0.99
0.98
0.97
0.96
-20
0
20
40
60
80
100
Case Temperature (ºC)
WA
Broadband Circuit Impedance
Z Source
Z0 = 50 Ω
0. 1
D
Z Load
G
R
jX
R
jX
1900
0.80
-3.71
2.89
-1.38
1910
0.79
-3.66
2.88
-1.30
1920
0.79
-3.61
2.87
-1.21
1930
0.78
-3.56
2.85
-1.13
1940
0.77
-3.51
2.84
-1.05
1950
0.77
-3.47
2.82
-0.97
1960
0.76
-3.42
2.81
-0.89
1970
0.75
-3.37
2.80
-0.81
1980
0.75
-3.33
2.78
-0.73
1990
0.74
-3.28
2.77
-0.65
2000
0.74
-3.24
2.76
-0.57
Data Sheet
4 of 8
0.1
1900 MHz
Z Source
2000 MHz
1900 MHz
0. 1
A
MHz
2000 MHz
W
<---
Z Load Ω
DT OW ARD L OA
GT HS
N
E
L
VE
Z Source Ω
Frequency
0 .0
Z Load
S
0. 2
Rev. 05, 2005-12-06
PTF180101M
Reference Circuit
C1
0.001µF
R2
1.3K V
R1
1.2K V
QQ1
LM7805
V DD
Q1
B C P56
C2
0.001µF
R3
2KV
C3
0.001µF
R4
2KV
R5
10V
+ C4
10µF
35V
R9
1V
R6
10V
L1
C5
0.1µF
C6 +
10pF
R7
1K V
C7
10µF
35V
C8
10pF
C13
10pF
l7
+
C14
10µF
50V
C15
10pF
C16
0.1µF
+
VDD
C17
10µF
50V
R8
220V
l 10
l6
C12
4.7pF
C10
10pF
RF_IN
l1
l2
C9
0.9pF
l3
C18
10pF
DUT
l4
l5
W1
½ TURN
l8
l9
l 11
RF_OUT
C11
4.7pF
180101m_sch
Reference circuit schematic for ƒ = 1990 MHz
Circuit Assembly Information
DUT
PCB
Microstrip
l1
l2
l3
l4
l5
l6
l7
l8
l9
l10
l11
PTF180101M
0.76 mm [.030"] thick, εr = 4.5
Electrical Characteristics at 1990 MHz 1
0.059
0.093
0.016
0.129
0.026
0.153
0.194
0.014
0.236
0.187
0.077
LDMOS Transistor
Rogers RO4320
2 oz. copper
Dimensions: L x W (mm)
Dimensions: L x W (in.)
λ, 50.0 Ω
λ, 50.0 Ω
λ, 50.0 Ω
λ, 9.6 Ω
λ, 9.6 Ω
λ, 78.0 Ω
λ, 78.0 Ω
λ, 12.9 Ω
λ, 12.9 Ω
λ, 66.0 Ω
λ, 50.0 Ω
5.69 x 1.60
8.48 x 1.60
1.09 x 1.60
10.77 x 14.22
2.13 x 14.22
14.48 x 0.71
18.39 x 0.71
1.27 x 10.16
19.91 x 10.16
17.40 x 0.99
6.99 x 1.60
0.224
0.334
0.043
0.424
0.084
0.570
0.724
0.050
0.784
0.685
0.275
x
x
x
x
x
x
x
x
x
x
x
0.063
0.063
0.063
0.560
0.560
0.028
0.028
0.400
0.400
0.039
0.063
1Electrical characteristics are rounded.
Data Sheet
5 of 8
Rev. 05, 2005-12-06
PTF180101M
Reference Circuit (cont.)
R5
R3 C3 R1
C6
10
35V
C8
C7
SHIM
QQ1
C2
Q1
+
R6 R7
10
35V
LM
+
C4
C1
R4
C5
SHIM
R9
C13
C17
R2
C15 C16
R8
C10
RF_IN
C9
C14
VDD
L1
C12
C18
C11
RF_OUT
W1
180101M_C_01
180101m_assy
Reference circuit assembly diagram (not to scale)*
Component
Description
Suggested Manufacturer
P/N or Comment
C1, C2, C3
C4, C7
C5, C16
C6, C8, C10, C13,
C15, C18
C9
C11, C12
C14, C17
L1
Q1
QQ1
R1
R2
R3
R4
R5, R6
R7
R8
W1
Capacitor, 0.001 µF
Tantalum capacitor, 10 µF, 35 V
Capacitor, 0.1µF
Ceramic capacitor, 10 pF
Digi-Key
Digi-Key
Digi-Key
ATC
PCC1772CT-ND
PCS6106TR-ND
PCC104BCT-ND
100B 100
Ceramic capacitor, 0.9 pF
Ceramic capacitor, 4.7pF
Tantalum capacitor, 10 µF, 50 V
Ferrite, 4mm
Transistor
Voltage regulator
Chip Resistor 1.2 k-ohms
Chip Resistor 1.3 k-ohms
Chip Resistor 2 k-ohms
Potentiometer 2 k-ohms
Chip Resistor 10 ohms
Chip Resistor 1 k-ohms
Chip Resistor 220 ohms
Wire 0.250”
ATC
ATC
Digi-Key
Elna Magnetics
Infinion Technologies
National Semiconductor
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
N/A
100B 0R9
100B 4R7
TPSE106K050R0400
BDS3/3/4.6-4S2
BCP56
LM7805
P1.2KGCT-ND
P1.3KGCT-ND
P2KECT-ND
3224W-202ETR-ND
P10ECT-ND
P1KECT-ND
P221ECT-ND
AUG22, SOLID
*Gerber Files for this circuit available on request
Data Sheet
6 of 8
Rev. 05, 2005-12-06
PTF180101M
Package Outline Specifications
0.1 A
A
0.22 ±0.05
0.09
0.5
0.08
M
C
6° MAX.
3 ±0.1
H
+0.08
0.125–0
.05
1.1 MAX.
0.85 ±0.1
0.15 MAX.
Package PG-RFP-10 (TSSOP-10 Outline)
+0.15
0.42 –0.10
A B C
4.9
0.25
M
A B C
PG-RFP-10
10
6
1
5
3 ±0.1
B
Index marking
Notes: Unless otherwise specified
1. Dimensions are mm
2.
Lead thickness: 0.09
3. Pins: 1 – 5 = gate, underside = source, 6 – 10 = drain
Find the latest and most complete information about products and packaging at the Infineon Internet page
http://www.infineon.com/products
Data Sheet
7 of 8
Rev. 05, 2005-12-06
PTF180101M
Confidential—Limited Distribution
Revision History:
2005-12-06
2005-11-14, Preliminary Data Sheet
Previous version:
Page
all
Data Sheet
Subjects (major changes since last revision)
Remove Preliminary designation
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Please send your proposal (including a reference to this document) to:
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GOLDMOS ® is a registered trademark of Infineon Technologies AG.
Edition 2005-12-06
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office (www.infineon.com/rfpower).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it
is reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet
8 of 8
Rev. 05, 2005-12-06