Control Chemicals and Materials Specification

Semiconductor
Operations
TI Customer Material Specification
(Controlled Chemicals and Materials)
Originator: Tim Yeakley
Designer:
Checker:
Code Ident
01295
Date: 07/21/03
Date:
Date:
Engineer: Tim Yeakley
Approved: WDM
Released: WDM
Document number
6453792
Rev
T
Date: 07/21/03
Date: 11/19/03
Date: 11/19/03
Sheet 1 of 7
Texas Instruments
Semiconductor Operations
1.0 PURPOSE
This specification sets forth requirements controlling the content of TI Customer Materials procured by Texas
Instruments Incorporated (“TI”) for use in semiconductor operations.
2.0 SCOPE
These controls are based on regulatory and TI customer requirements. The requirements of this specification should
be viewed as a minimum expectation for suppliers to TI’s semiconductor operations. Suppliers shall strive to eliminate
the listed chemicals and materials from products sold to TI.
2.1
2.2
2.3
2.4
2.5
2.6
This document applies to all suppliers of goods and services defined in Section 4.9 as TI Customer Products.
This document does not apply to Evaluation Modules, Product Modules or finished TI Education Technology
Products, except as provided by Section 6.
TI generally follows JIG-101, Joint Industry Guide (JIG), Material Composition Declaration for Electrotechnical
Products.
This document is not intended to be a comprehensive list of all environmental product requirements that may
be established by TI or by law. Supplier’s compliance with this document does not relieve or diminish
supplier’s obligation to comply with any other TI product specification or its obligation to comply with all
applicable laws.
TI expects any supplier providing chemicals or materials to TI operations in the European Union to register
those substances in accordance with the provisions of Title II of REACH if the supplier manufactures or
imports the substance in quantities of one tonne or more per year.
TI Customer Materials used in TI manufacturing operations located in the United States shall contain only
substances listed in the TSCA Inventory. This requirement concerns the introduction of new chemical
substances into materials used in TI products. The primary focus is on new organic compounds. Naturally
occurring substances and substances commonly used in commerce can be assumed to be on the TSCA
Inventory. The TSCA Inventory can be obtained from the Superintendent of Documents, Government Printing
Office, Washington, D.C. 20402.
2.6.1
Substances subject to TSCA low volume or R&D exemptions may be used only if specifically
approved in advance by TI.
3.0 REFERENCES
3.1
(EU) Directive 94/62/EC on Packaging and Packaging Waste
3.2
3.3
(EU) Directive 2000/53/EC on End-of-life Vehicles
(EU) Directives 2002/95/EC and 2011/65/EU on Restriction of Certain Hazardous Substances in Electrical
and Electronic Equipment
(EU) Directive 2002/96/EC on Waste Electrical and Electronic Equipment
(Germany) ChemVerbotsV
(Japan) The Law Concerning the Examination and Regulation of the Manufacture etc. of Chemicals
Substances
(Netherlands) Act on Substances Harmful to the Environment (WMS)
The Montreal Protocol on Substances that Deplete the Ozone Layer
(US) Clean Air Act, Title VI and 40CFR 82
(US) Toxic Substances Control Act, Inventory, and 40CFR 700-799
3.10.1 PFAS SNURs, March 11, 2002, December 9, 2002 and October 9, 2007
(UN) International Standards for Phytosanitary Measures (ISPM) 15, Guidelines for Regulating Wood
Packaging Material in International Trade
(China) Management Methods for Controlling Pollution by Electronic Information Products and supporting
standards (China RoHS)
(EU) Directive 2006/122/EC amending Council Directive 76/769/EEC … relating to the restriction on the
marketing and use of certain dangerous substances and preparations (Perfluorooctane sulfonates)
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
Code Ident
01295
Document number
6453792
Rev
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Texas Instruments
Semiconductor Operations
3.14 (EU) Regulation (EC) No 1907/2006 concerning the Registration, Evaluation, Authorisation and Restriction of
Chemicals (REACH)
3.15 (EU) Commission Decision 2009/251/EC requiring member States to ensure that products containing the
biocide dimethylfumarate are not placed or made available on the market.
3.16 IEC 61249-2-21, International Electrotechnical Commission’s Definition of Halogen-Free
3.17 Edge Spec # 6494169 TI Restricted Chemicals and Materials List
4.0 DEFINITIONS
4.1
Analytical Report – Data generated by laboratory analysis using defined test methodologies to quantify
concentration values of the RoHS six substances and Halogens. Analysis must be done at the
Homogeneous Level. Commonly called the ICP Report, but may include testing techniques other than ICP to
test for the RoHS six substances of Cadmium, Mercury, Hexavalent Chromium, Lead, Polybrominated
biphenyls and Polybrominated diphenylethers.
4.2
CAC - Compliance and Analysis Certificate – A web-based certification required from all suppliers
furnishing TI Customer Material.
4.3
Halogens – For the purposes of this specification Halogens are defined as total Bromine and total Chlorine
as contained in brominated flame retardants (BFRs), chlorinated flame retardants (CFRs) and PVC.
4.4
Homogeneous Level - The level at which there is a uniform structure or composition throughout. A
semiconductor device is made up of many homogeneous materials. The Homogenous Level of a lead frame
semiconductor device generally includes the mold compound, die attach, bond wire, lead frame, lead finish
and integrated circuit. The Homogenous Level of a Ball Grid Array (BGA) device generally includes bond
wires, die attach, mold compound, substrate(s), solder balls and integrated circuit (die or wafer).
4.5
Material Declaration – Composition of Packaging Material.
4.6
Material Declaration Form – Format provided by TI to document the composition of packaging materials.
4.7
Packaging Materials - Any component, substances or products used to connect, contain, insulate, mark, and
protect the silicon device (e.g., external marking inks, lead frames, encapsulant, organic and ceramic
substrate, stress modifiers, underfill, solder, mold compound, die attach).
4.8
Packing Materials- The substance or product used to protect TI products during transportation to TI
customers (e.g., Trays, Moisture barrier bags, Carrier tapes, Cover tapes, Reels, Pins, Plugs, and tubes).
4.9
Product Modules - Integrated circuit-like products that typically integrate semiconductors and externally
procured passive and/or active components within a single plastic encapsulated package. These may also
include assembled printed circuit boards with or without enclosures using TI components or externally
procured passive and/or active components, power supplies and displaysand other electronic component
products intended for volume production end product sale.
4.10 Restricted Chemicals and Materials (RCM) – TI Customer Materials provided to TI by suppliers must not
contain the chemicals and materials on TI’s RCM list (EDGE 6494169 at http://wpl.ext.ti.com), except in
accordance with any exemptions, thresholds or other qualifiers contained in the list or in the case TI grants a
written exception based on full knowledge that the TI Customer Material contains a listed substance. Even if
a RCM is below a threshold or subject to an exception or exemption, in this specification TI is requiring
suppliers to report all concentrations of RCMs so that TI can adequately inform regulators and customers of
the actual content of TI products that contain such substances.
4.11 RoHS –Restriction on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment,
DIRECTIVE 2002/95/EC and DIRECTIVE 2011/65/EU OF THE EUROPEAN PARLIAMENT AND OF THE
COUNCIL. This term may also be used to describe similar laws of other jurisdictions as they are
promulgated, including China and California.
4.12 TI Customer Material – Chemicals, substances, parts, components, devices or items used to manufacture
semiconductors that become part of TI’s final product including Packaging Material and Packing Material. TI
Code Ident
01295
Document number
6453792
Rev
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Sheet 3 of 7
Texas Instruments
Semiconductor Operations
Customer Material may also include chemicals and materials that touch TI’s product during manufacturing
that are specifically identified by TI and communicated to suppliers from time to time. This definition does not
include Modules, Evaluation Modules and MEMS (MicroElectroMechanicalSystems) devices.
5.0
REPORTING REQUIREMENTS for TI CUSTOMER MATERIALS:
Suppliers which furnish a TI Customer Material are required to certify compliance with TI’s Restricted Chemicals and
Materials List, EDGE 6494169 and complete and submit to TI a CAC and the associated data to support the
certification in accordance with the following instructions. This certification is separate from other lot-related
certifications that may be required for quality control purposes.
5.1
Controlled Chemicals and Materials Compliance and Analysis Certificate (CAC) and Data:
Suppliers shall certify by submittal of a CAC:
5.1.1
Yes or No: Does the TI Customer Material provided to TI contain, at the Homogeneous Level,
any detectable amount of a Chemical or Material included on the RCM list located at TI’s website
http://wpl.ext.ti.com under Controlled Chemicals. If Yes, Supplier shall list such substances and
concentrations on the CAC. If there is a range or variance in the amount of the substance, the
maximum value shall be reported.
Concentrations of substances reported to TI must be at the Homogenous Level. For
example, if lead (Pb) is contained in an integrated circuit device sold to, assembled, or
manufactured for TI, supplier must report the concentration of Pb in the mold compound, not in
the integrated circuit device as a whole. Please see additional examples in the definition of
Homogenous Level above.
5.1.2
That an ISO/IEC 17025 or equivalent independent accredited lab has performed the specified lab
analyses at the Homogenous Level using the below analytical test methods for the six RoHS
substances per IEC 62321 and the Halogens Chlorine (Cl) and Bromine (Br):
Substance
Required test method
Cadmium and Lead
ICP-AES or as defined in IEC 62321
Hexavalent Chromium
(1) UV-Vis method, or
(2) As defined by IEC 62321: USEPA Method 6020 (ICP/MS
Method) or USEPA Method 6010 (ICP method). If Chromium
is detected above the RCM list threshold, then supplier shall
test for Hexavalent Chromium using the UV-Vis test method.
Mercury
ICP-AES (OES) or as defined in IEC 62321
Polybrominated Biphenyl (PBB)
and Polybrominated Diphenyl
Ehter (PBDE)
GC/MS by EPA Method 8260B or as defined by IEC 62321
Bromine (Br) and Chlorine (Cl)
IPC-TM-650 2.3.41 or EN14582
5.1.2.1 Typical materials sets requiring Halogen testing are plastics and polymers including mold
compounds, encapsulant, underfill, lid attach, and die attach, substrates, protective overcoat,
solder flux and solder paste and plastics, polymers and inks used in shipping and Packing
Materials. Typical material sets not requiring halogen testing are lead frames, bond wires, solder
balls, target, virgin wafers, inks, and paper based materials (e.g. paper bags, cardboard ship
boxes).
5.1.3
Code Ident
01295
For all non-RoHS substances reported in accordance with this specification concentrations shall
be reported according to either or a combination of the actual measurement values, theoretical
Document number
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Rev
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Texas Instruments
Semiconductor Operations
values, calculated values, or designed values.
5.2
Analytical results
5.2.1
Suppliers shall provide an electronic copy of the Analytical Report together with the CAC as
follows:
5.2.1.1 Lead, Cadmium, Mercury and Hexavalent Chromium for all certifications
5.2.1.2 Cadmium, Lead, Hexavalent Chromium, Mercury, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and Halogens for certifications for plastics and
polymers as referenced in 3.1.2 of this specification.
5.2.1.2 The Analytical Report shall include the following information:
5.3
5.2.1.2.1
Name of the lab
5.2.1.2.2
5.2.1.2.3
Name of responsible person at lab including their signature
Lab certification
5.2.1.2.4
Date of the analysis
5.2.1.2.5
Clearly defined sample (e.g. Raw Material Mfr Part Number, Common Name,
etc.)
5.2.1.2.6
5.2.1.2.7
Test method used for each substance
RoHS substances analyzed and final concentration results
5.2.1.2.8
Detection limits of each constituent
5.2.1.2.9
Measurement flowchart
Material Declaration
5.3.1
Direct Material Suppliers shall provide the composition of all Packaging Materials to TI using the
Material Declaration Form located at http://wpl.ext.ti.com..
5.3.2
A Material Declaration shall be completed and loaded to the Compliance & Analysis Certificate
(CAC) for:
5.3.2.1 All Packaging materials for which TI has assigned a TI part number.
5.3.2.2 When new Packaging Materials are introduced for manufacturing at a TI site.
5.3.2.3 When a change notice has been provided indicating composition change has occurred
Note: Annual updates of this information are not required.
5.4
TI Website Submittal Process:
5.4.1
5.5
Frequency of Certification and Analysis Data:
5.5.1
Code Ident
Suppliers shall submit the Compliance & Analysis Certificate (CAC), analytical data and Material
Declaration Form by going to TI’s Website http://wpl.ext.ti.com click on Controlled Chemicals, and
entering the required information in the form labeled “Compliance and Analysis Certificate.”
Please note that there is a separate CAC for external manufacturing suppliers (subcon and
foundry) and material/chemical suppliers.
01295
Supplier shall complete and submit a CAC and supporting analytical data upon initial qualification
of chemical or material, annually, and any time there is a process change that potentially changes
the content of any TI Customer Material sold to TI by supplier. It is the supplier’s responsibility to
submit the certification based on the most current version of this specification. This revision
controlled specification can be found at http://wpl.ext.ti.com
Document number
6453792
Rev
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Sheet 5 of 7
Texas Instruments
Semiconductor Operations
5.5.1.1 The test date for Analytical Reports for initial qualifications of a chemical or material shall
not be older than nine months and must be reanalyzed and submitted to TI before the
Analytical Report is one year old.
5.6
Records Retention: Supplier shall retain copies of Analytical Reports and other documents or data
necessary to support any CAC submitted by supplier to TI for a minimum period of ten (10) years.
5.6.1
5.7
Because this requirement began at TI on November 1, 2006 TI understands that records prior to
this date may be unavailable.
Waiver of Confidentiality: The information required under this specification is based on regulatory
requirements (i.e., RoHS) and TI customer requirements. TI intends, and supplier expressly authorizes TI, to
provide such information to regulatory authorities and TI customers as necessary to show compliance with
applicable laws and customer requirements. Whether or not so marked, supplier waives all claims that such
information is confidential or covered by any confidentiality agreement.
6.0 REPORTING REQUIREMENTS FOR TI PRODUCT MODULES
6.1
Product Modules or components used in the manufacture of Product Modules shall comply with the
requirements of the RCM list located at TI’s website http://wpl.ext.ti.com under Controlled Chemicals
6.2
Suppliers of all Product Modules or components used in the manufacture of Product Modules shall provide a
declaration of content using IPC-1752 format or other formats upon request as agreed upon by TI or its
designated supplier or consultant consolidating information for the purposes of customer product information
sharing. .
7.0 ACCEPTANCE CRITERIA:
7.1
Conformance with this specification will be an important factor in TI’s future purchasing decisions. TI has the
right to reject TI Customer Material from suppliers that contain any Chemical or Material listed on TI’s website
http://wpl.ext.ti.com which is not in compliance with the qualifiers or does not meet the requirements set forth
in this specification unless otherwise agreed to in writing by TI.
7.2
The obligations under this specification are in addition to all other applicable quality and other specifications
and requirements.
7.3
Supplier shall not make any changes to processes or products in response to this specification without TI’s
prior written approval.
-End-
Code Ident
01295
Document number
6453792
Rev
T
Sheet 6 of 7
Texas Instruments
Revision
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B
C
D
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F
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Code Ident
Semiconductor Operations
Description
ECM #2041053, 11/18/03, M. Murray, Y. Shaw; Formal release.
ECM #2042672, 12/08/03, M. Murray, Y. Shaw; Correct email address from [email protected]
to [email protected]
ECM #2042788, 12/11/03, M. Murray, L. Foster; Correct spec number in Appendix B and C, Section 2 from
6543792 to 6453792.
ECO #2043923, 01/28/04, M. Murray, L. Foster: Multiple changes per LeRoy and banned material team.
ECM #2045091, 03/09/04, M. Murray, L. Foster; Removed Appendix B and C from specification.
ECM #2050158, 11/01/05, M. Murray, L. Foster; Update specification.
ECM #2054865, 02/21/05, M. Murray, L. Foster; Update 4.1
ECM #2062585, 10/04/05, S. Harmon, L. Foster; Update Paragraph 3
ECM #2068135, 03/28/06, S. Harmon, L. Foster; Update Paragraph 3
ECM #2071210, 07/18/06, J. Foster, L Foster; Update Paragraph 2.0 (Banned)
ECM #2074746, 10/31/06, S. Harmon, L Foster; 1) Added RoHS paragraph to DEFINITIONS section
2) Added Paragraphs 3.11 thru 3.14 & 3.21 thru 3.6
ECO #2078542, 03/30/07, M. Murray, Bing Shen; Corrected 3.5
ECO #2083371, 09/18/07, M. Murray, Bing Shen; Updates to spec.
ECO #2089414, 05/05/08, M. Murray, Tim Yeakley; Added 1) Halogen to DEFINITIONS section and 2)
Halogen reporting requirements to REPORTING section of the spec.
ECO #2092511, 08/27/08, M. Murray, Tim Yeakley; Corrected 3.1.2.1.1.5.2 to reflect removal of shipping
and packing materials.
ECO #2105180, 02/10/10, M. Murray, Tim Yeakley; Modified the Definition of Halogen
ECO #2126413, 07/31/12, M. Murray, Tim Yeakley, Chris Lee: Added a Reference section and several
clarifying requirements to align Silicon Valley Analog requirements into the specification.
ECO #2128746, 11/09/12, M. Murray, Tim Yeakley, Mark Frimann Added references to international testing
standards in 5.1 and Material Declaration definitions and form requirements section 5.3. The provisions for
5.3 Material Declaration becomes effective on January 1, 2013.
ECO #2143105, 07/09/14, M. Murray, Tim Yeakley, Mark Frimann and W. Nisperos; Added reference 3.17
and clarification of the definition of RCM in 4.10 and its application in 5.0.
ECO #2147152, 12/08/14, M. Murray, Tim Yeakley; Updated examples in definition 4.8 and added example
of inks and paper products to example in 5.1.2.1.
01295
Document number
6453792
Rev
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Sheet 7 of 7