44L TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

44L -TQFP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
AZ
B1: 180.0023 mg
B2: 329.9900 mg
B3: 335.5330 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 3
B1: 260.0379 mg
B2: 260.5300 mg
B: 342.2580 mg
Page Weight – Site 4
Package Weight – Site 5
10 x 10 mm
B1: 343.9689 mg
B2: 265.0051 mg
B3: 351.5650 mg
B4: 464.6297 mg
B4: 465.1001 mg
B1: 329.9900 mg
B2: 328.4354 mg
SUMMARY
The 44L-TQFP package is qualified at three assembly sites. Packages from different assembly sites are likely to
have different materials composition. Cypress ordering part numbers containing an “X” (e.g. CY7C1328G-133AXI,
CY2308SXC-1HT) meet the Directive of 2002/95/ EC (Rohs) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 040806, 062603, 133102 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ44CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 1 of 24
44L -TQFP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
NiPdAu Using Standard Mold Compound
Material
Purpose of
Use
Base Material
Leadframe
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
40.1483
93.9800%
223,043
22.3043%
Mg
7439-95-4
0.0598
0.1400%
332
0.0332%
Si
7440-21-3
0.4699
1.1000%
2,611
0.2611%
Ni
Fe
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Epoxy Resin
Phenol Resin
Brominated Epoxy
Resin
Antimony Trioxide
Others
7440-02-0
7439-89-6
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1.5208
0.0897
0.4315
0.193
0.0035
0.0035
0.3465
0.0495
0.0297
0.0099
0.0099
0.0045
6.22
6.32
109.2028
6.204
6.204
0.9926
3.5600%
0.2100%
1.0100%
96.5200%
1.7400%
1.7400%
77.0100%
11.0000%
6.6000%
2.2000%
2.2000%
0.9900%
100.0000%
100.0000%
88.0100%
5.0000%
5.0000%
0.8000%
8,449
498
2,397
1,072
19
19
1,925
275
165
55
55
25
34,555
35,111
606,674
34,466
34,466
5,515
0.8449%
0.0498%
0.2397%
0.1072%
0.0019%
0.0019%
0.1925%
0.0275%
0.0165%
0.0055%
0.0055%
0.0025%
3.4555%
3.5111%
60.6674%
3.4466%
3.4466%
0.5515%
1309-64-4
Trade Secret
0.4963
0.9926
0.4000%
0.8000%
2,757
5,515
0.2757%
0.5515%
Package Weight (mg):
180.0023
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 2 of 24
44L -TQFP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
NiPdAu Using Green Mold Compound
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
92.9100
96.2000%
281,554
28.1554%
Si
7440-21-3
0.6278
0.6500%
1,902
0.1902%
Mg
7439-95-4
0.1449
0.1500%
439
0.0439%
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
2.8974
2.3261
0.0419
0.0419
0.4160
0.0468
0.0260
0.0104
0.0104
0.0104
7.1900
6.7800
192.6939
10.8255
12.9906
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
8,780
7,049
127
127
1,261
142
79
32
32
32
21,789
20,546
583,939
32,806
39,367
0.8780%
0.7049%
0.0127%
0.0127%
0.1261%
0.0142%
0.0079%
0.0032%
0.0032%
0.0032%
2.1789%
2.0546%
58.3939%
3.2806%
3.9367%
Package Weight (mg):
329.9900
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 3 of 24
44L -TQFP
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
NiPdAu Using Green Mold Compound with Copper-Palladium (Cu-Pd) wire
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substanc
e per
Package
Cu
7440-50-8
93.5017
95.8613%
278,666
27.8666%
Si
7440-21-3
0.8795
0.9017%
2,621
0.2621%
Mg
7439-95-4
0.1678
0.1720%
500
0.0500%
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
2.9895
2.4549
0.0655
0.0624
0.6984
0.0768
0.0378
0.0208
0.0208
0.0208
8.2540
7.9957
0.5195
193.9535
10.9430
12.8706
3.0649%
95.0480%
2.5360%
2.4160%
79.7807%
8.7731%
4.3180%
2.3761%
2.3761%
2.3761%
100.0000%
93.8991%
6.1009%
89.0646%
5.0251%
5.9103%
8,910
7,316
195
186
2,081
229
113
62
62
62
24,600
23,830
1,548
578,046
32,614
38,359
0.8910%
0.7316%
0.0195%
0.0186%
0.2081%
0.0229%
0.0113%
0.0062%
0.0062%
0.0062%
2.4600%
2.3830%
0.1548%
57.8046%
3.2614%
3.8359%
Package Weight (mg):
335.5330
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Cu
Pd
SiO2
Phenol Resin
Epoxy Resin
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 4 of 24
44L -TQFP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 5 of 24
44L -TQFP
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 034101, 120201, 123808, 141404 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ44ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 6 of 24
44L -TQFP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Gold Wire Material
Material
Base Material
Leadframe
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Substance
Composition
Purpose of Use
Circuit
Interconnect
Encapsulation
Mold Compound
CAS Number
Weight
by mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
83.4169
91.9600%
242,513
24.2513%
Ni
7440-02-0
2.6124
2.8800%
7,595
0.7595%
Si
7440-21-3
0.5533
0.6100%
1,609
0.1609%
Mg
Ag
Sn
Ag
Epoxy Resin
Gamma
Butyrolactone
Phenolic Resin
Aromatic
Hydrocarbons
Si
Au
Silica Fused
7439-95-4
7440-22-4
7440-31-5
7440-22-4
9003-36-5
96-48-0
0.1361
3.9912
12.2100
2.5099
0.6899
0.1001
0.1500%
4.4000%
100.0000%
71.7100%
19.7100%
2.8600%
396
11,603
35,497
7,297
2,006
291
0.0396%
1.1603%
3.5497%
0.7297%
0.2006%
0.0291%
0.1001
0.1001
2.8600%
2.8600%
291
291
0.0291%
0.0291%
100.0000%
100.0000%
88.5100%
71,198
5,814
543,151
7.1198%
0.5814%
54.3151%
Epoxy Resin
Phenol Resin
Aromatic
Phosphate
Others
85954-11-6
26834-02-6
1333-86-4
24.4900
2.0000
186.826
9
10.5540
8.4221
3.1662
5.0000%
3.9900%
1.5000%
30,683
24,485
9,205
3.0683%
2.4485%
0.9205%
2.0897
0.9900%
6,075
0.6075%
9003-35-5
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Package Weight (mg):
343.9689
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 7 of 24
44L -TQFP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
1.0 mm thick package using Cu wire
Material
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold Compound
Substance
Composition
Purpose of Use
Circuit
Interconnect
Encapsulation
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
92.2254
94.3000%
348,014
34.8014%
Ni
7440-02-0
2.4450
2.5000%
9,226
0.9226%
Si
7440-21-3
0.4890
0.5000%
1,845
0.1845%
7439-95-4
7440-22-4
7440-31-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
0.0978
2.5428
5.3550
0.3515
0.0180
0.0180
0.0180
0.0180
0.1000%
2.6000%
100.0000%
78.1000%
4.0000%
4.0000%
4.0000%
4.0000%
369
9,595
20,207
1,326
68
68
68
68
0.0369%
0.9595%
2.0207%
0.1326%
0.0068%
0.0068%
0.0068%
0.0068%
Trade Secret
0.0225
5.0000%
85
0.0085%
461-58-5
Trade secret
7440-21-3
7440-50-8
Trade secret
0.0014
0.0027
3.1200
0.2800
7.9000
0.3000%
0.6000%
100.0000%
100.0000%
5.0000%
5
10
11,773
1,057
29,811
0.0005%
0.0010%
1.1773%
0.1057%
2.9811%
29690-82-2
7.9000
5.0000%
29,811
2.9811%
Trade secret
Trade secret
1333-86-4
14808-60-7
7631-86-9
60676-86-0
7.9000
7.9000
0.4740
109.6520
15.8000
0.4740
5.0000%
5.0000%
0.3000%
69.4000%
10.0000%
0.3000%
29,811
29,811
1,789
413,772
59,622
1,789
2.9811%
2.9811%
0.1789%
41.3772%
5.9622%
0.1789%
% Total:
100.0000
Mg
Ag
Sn
Silver
Epoxy Resin A
Epoxy Resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic peroxide
Si
Copper (Cu)
Epoxy Resin A
Epoxy, Cresol
Novolac
Phenol Resin
Metal Hydroxide
Carbon Black
Silica, Crystalline
Silica Fused B
Silica Fused A
Package Weight (mg):
265.0051
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 8 of 24
44L -TQFP
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
1.4mm thick package using Cu wire
Material
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold Compound
Substance
Composition
Purpose of Use
Circuit
Interconnect
Encapsulation
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
59.8805
94.3000%
170,326
17.0326%
Ni
7440-02-0
1.5875
2.5000%
4,516
0.4516%
Si
7440-21-3
0.3175
0.5000%
903
0.0903%
7439-95-4
7440-22-4
7440-31-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
0.0635
1.6510
5.3550
0.5311
0.0272
0.0272
0.0272
0.0272
0.1000%
2.6000%
100.0000%
78.1000%
4.0000%
4.0000%
4.0000%
4.0000%
181
4,696
15,232
1,511
77
77
77
77
0.0181%
0.4696%
1.5232%
0.1511%
0.0077%
0.0077%
0.0077%
0.0077%
Trade Secret
0.0340
5.0000%
97
0.0097%
461-58-5
Trade secret
7440-21-3
7440-50-8
Trade secret
0.0020
0.0041
5.0100
0.2200
13.8400
0.3000%
0.6000%
100.0000%
100.0000%
5.0000%
6
12
14,251
626
39,367
0.0006%
0.0012%
1.4251%
0.0626%
3.9367%
29690-82-2
13.8400
5.0000%
39,367
3.9367%
Trade secret
Trade secret
1333-86-4
14808-60-7
7631-86-9
60676-86-0
13.8400
13.8400
0.8304
192.0992
27.6800
0.8304
5.0000%
5.0000%
0.3000%
69.4000%
10.0000%
0.3000%
39,367
39,367
2,362
546,409
78,734
2,362
3.9367%
3.9367%
0.2362%
54.6409%
7.8734%
0.2362%
Package Weight (mg):
351.5650
% Total:
100.0000
Mg
Ag
Sn
Silver
Epoxy Resin A
Epoxy Resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic peroxide
Si
Copper (Cu)
Epoxy Resin A
Epoxy, Cresol
Novolac
Phenol Resin
Metal Hydroxide
Carbon Black
Silica, Crystalline
Silica Fused B
Silica Fused A
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 9 of 24
44L -TQFP
Pb-Free Package
B4. MATERIAL COMPOSITION (Note 3)
1.4mm thick package using Die Attach Film and Cu wire
Material
Leadframe
Lead Finish
Die Attach
Substance
Composition
Purpose of Use
Base Material
External Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
125.5410
96.2000
270,196
27.0196
Ni
7440-02-0
3.9150
3.0000
8,426
0.8426
Si
7440-21-3
0.8483
0.6500
1,826
0.1826
Mg
Sn
Novolak Epoxy
Resin
Phenol Resin
Amorphous
Silica
Acrylic
Copolymer
Si
Copper
Epoxy Resin-1
Epoxy Resin-2
Phenol Resin
Carbon Black
Silica (SiO2)
7439-95-4
7440-31-5
0.1958
13.8000
0.1500
100.0000
421
29,701
0.0421
2.9701
Trade Secret
0.1296
12.0000
279
0.0279
Trade Secret
0.1296
12.0000
279
0.0279
68611-44-9
0.0540
5.0000
116
0.0116
Trade Secret
0.7668
71.0000
1,650
0.1650
7440-21-3
7440-50-8
Trade secret
Trade secret
Trade secret
1333-86-4
60676-86-0
5.6000
1.8496
14.0310
9.3540
20.5788
1.5590
266.2772
100.0000
100.0000
4.5000
3.0000
6.6000
0.5000
85.4000
12,053
2,982
30,198
20,132
44,291
3,355
573,095
1.2053
0.3982
3.0198
2.0132
4.4291
0.3355
57.3095
Package Weight (mg):
464.6297
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 10 of 24
44L -TQFP
Pb-Free Package
B5. MATERIAL COMPOSITION (Note 3)
1.4mm thick package using CuPd Bonding Wire
Material
Leadframe
Lead Finish
Die Attach
Die
Wire
Mold Compound
Substance
Composition
Purpose of Use
Base Material
External Plating
Adhesive
Circuit
Interconnect
Encapsulation
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
127.0802
96.2000
273,232
27.3232
Ni
7440-02-0
3.9630
3.0000
8,521
0.8521
Si
7440-21-3
0.6500
0.1500
100.0000
0.1846
7439-95-4
7440-31-5
0.8587
0.1982
13.8000
1,846
Mg
Sn
Novolak Epoxy
Resin
Phenol Resin
Amorphous
Silica
Acrylic
Copolymer
Si
Copper
Palladium
Epoxy Resin-1
Epoxy Resin-2
Phenol Resin
Carbon Black
Silica (SiO2)
426
29,671
0.0426
2.9671
0.1296
0.1296
12.0000
12.0000
279
0.0279
279
0.0279
0.0540
5.0000
116
0.0116
71.0000
100.0000
99.9800
0.0200
4.5000
3.0000
6.6000
0.5000
85.4000
1,649
0.1649
Trade secret
Trade secret
Trade secret
1333-86-4
60676-86-0
0.7668
5.6000
1.9196
0.0004
13.9770
9.3180
20.4996
1.5530
265.2524
12,040
4,127
0.83
30,052
20,034
44,076
3,339
570,313
1.2040
0.4127
0.0001
3.0052
2.0034
4.4076
0.3339
57.0313
Package Weight (mg):
465.1001
% Total:
100.0000
Trade Secret
Trade Secret
68611-44-9
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 11 of 24
44L -TQFP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 12 of 24
44L -TQFP
Pb-Free Package
ASSEMBLY Site 3: Amkor Technology Seoul Korea
Package Qualification Report # 034602 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-AZ44Amkor Seoul
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 13 of 24
44L -TQFP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using C151 Leadframe Copper Alloy
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Cr
Sn
Zn
Ag
Pure Sn
Ag
Epoxy Resin
Anhydride
Si
Au
Phenol Resin
Epoxy Resin
Silica Fused
Carbon Black
CAS Number
Weight by
mg
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-31-5
7440-22-4
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
60676-86-0
1333-86-4
75.6081
0.2307
0.1923
0.1538
0.7229
3.49
0.67
0.19
0.1
3.46
1.27
9.7934
10.4022
152.8847
0.8698
Package Weight (mg):
% Weight of
Substance per
Homogeneous
Material
PPM
98.3200%
0.3000%
0.2500%
0.2000%
0.9400%
100.0000%
69.7900%
19.7900%
10.4200%
100.0000%
100.0000%
5.6300%
5.9800%
87.8900%
0.5000%
260.0379
290,758
887
739
591
2,780
13,421
2,576
731
385
13,306
4,884
37,661
40,003
587,933
3,345
% Total:
% Weight
of
Substance
per
Package
29.0758%
0.0887%
0.0739%
0.0591%
0.2780%
1.3421%
0.2576%
0.0731%
0.0385%
1.3306%
0.4884%
3.7661%
4.0003%
58.7933%
0.3345%
100.0000
B2. MATERIAL COMPOSITION (Note 3)
Using C194 Leadframe Copper Alloy
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ag
Pure Sn
Ag
Epoxy Resin
Anhydride
Si
Au
Epoxy Resin
Silica Fused
Carbon Black
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
7440-22-4
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
1333-86-4
Weight by
mg
74.5270
1.7960
0.0230
0.0920
1.0400
3.5020
0.6710
0.1920
0.0960
3.4600
1.2740
19.9940
152.9940
0.8690
% Weight of
Substance per
Homogeneous
Material
96.1912%
2.3181%
0.0297%
0.1187%
1.3423%
100.0000%
69.9687%
20.0209%
10.0104%
100.0000%
100.0000%
11.5003%
87.9999%
0.4998%
PPM
286,059
6,894
88
353
3,992
13,442
2,576
737
368
13,281
4,890
76,744
587,241
3,335
% Weight
of
Substance
per
Package
28.6059%
0.6894%
0.0088%
0.0353%
0.3992%
1.3442%
0.2576%
0.0737%
0.0368%
1.3281%
0.4890%
7.6744%
58.7241%
0.3335%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 14 of 24
44L -TQFP
Pb-Free Package
Package Weight (mg):
260.5300
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
PBB
PPM
PBDE
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
<5.0
--------<5.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 15 of 24
44L -TQFP
Pb-Free Package
ASSEMBLY Site 4: Jiangsu Changjiang Electronics Technology (JCET)
Package Qualification Report # 110901, 141302 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ44- JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 16 of 24
44L -TQFP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1.USING GOLD WIRE
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
92.9100
96.2000%
281,554
28.1554%
Si
7440-21-3
0.6278
0.6500%
1,902
0.1902%
Mg
7439-95-4
0.1449
0.1500%
439
0.0439%
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
2.8974
2.3261
0.0419
0.0419
0.4160
0.0468
0.0260
0.0104
0.0104
0.0104
7.1900
6.7800
192.6939
10.8255
12.9906
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
8,780
7,049
127
127
1,261
142
79
32
32
32
21,789
20,546
583,939
32,806
39,367
0.8780%
0.7049%
0.0127%
0.0127%
0.1261%
0.0142%
0.0079%
0.0032%
0.0032%
0.0032%
2.1789%
2.0546%
58.3939%
3.2806%
3.9367%
Package Weight (mg):
329.9900
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 17 of 24
44L -TQFP
Pb-Free Package
B2.USING COPPER PALLADIUM WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Nickel
Silicon
Magnesium
Silver
Copper
CAS Number
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-50-8
Tin
Silver
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
Acrylate Ester
Organic Peroxide
Silicon
Copper
Palladium
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
7440-31-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
60676-86-0
1333-86-4
Package Weight (mg):
Weight
by mg
1.9800
0.4050
0.1350
2.0700
85.4100
12.2102
0.4160
0.0468
0.0260
0.0104
0.0104
0.0104
7.1900
1.4888
0.0264
6.5100
6.5100
10.8500
192.4790
0.6510
328.4354
% weight of
substance per
Homogeneous
2.2000%
0.4500%
0.1500%
2.3000%
94.9000%
100.0000%
80.0000%
PPM
6,029
1,233
411
6,303
260,051
0.6029%
0.1233%
0.0411%
0.6303%
26.0051%
37,177
3.7177%
1,267
0.1267%
142
0.0142%
79
0.0079%
32
32
32
21,892
4,533
80
19,821
19,821
33,035
586,048
1,982
0.0032%
0.0032%
0.0032%
2.1892%
0.4533%
0.0080%
1.9821%
1.9821%
3.3035%
58.6048%
0.1982%
% Total:
100.000
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
98.2600%
1.7400%
3.0000%
3.0000%
5.0000%
88.7000%
0.3000%
%% Weight of
Substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 18 of 24
44L -TQFP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 19 of 24
44L -TQFP
Pb-Free Package
ASSEMBLY Site 5: Amkor Technology Philippines (ATP1)
Package Qualification Report # 150202 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ44- ATP1
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 20 of 24
44L -TQFP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Base Material
Leadframe
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight
of
Substance
per
Package
Cu
7440-50-8
73.9229
96.1619%
215,986
21.5986%
Fe
7439-89-6
1.8206
2.3683%
5,319
0.5319%
Zn
7440-66-6
0.0910
0.1184%
266
0.0266%
P
Ag
Sn
7723-14-0
7440-22-4
7440-31-5
0.0228
1.0161
3.5024
0.0296%
1.3218%
100.0000%
66
2,969
10,233
0.0066%
0.2969%
1.0233%
Polymer
1,4Butanedioldiglycidyl
Ether
Phenolic Resin
Ethylene glycol
monobutyl ether
acetate
Silver
Silicon
Cu
Pd
Epoxy Resin A
Epoxy Resin B
Silica Fused
Carbon Black
Phenol Resin
9003-36-5
2425-79-8
0.2115
0.0385
11.0000%
2.0000%
618
112
0.0618%
0.0112%
9003-35-4
112-07-2
0.0385
0.0962
2.0000%
5.0000%
112
284
0.0112%
0.0284%
1.5384
8.9964
0.3488
0.0075
20.0485
5.0121
210.5094
1.2530
13.7834
80.0000%
100.0000%
97.8970%
2.1030%
8.0000%
2.0000%
84.0000%
0.5000%
5.5000%
4,495
26,285
1,019
22
58,577
14,644
615,060
3,661
40,272
0.4495%
2.6285%
0.1019%
0.0022%
5.8577%
1.4644%
61.5060%
0.3661%
4.0272%
7440-22-4
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
60676-86-0
1333-86-4
Trade Secret
Package Weight (mg):
342.2580
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 21 of 24
44L -TQFP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 22 of 24
44L -TQFP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
44L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04267
**
*A
*B
*C
ECN No. Orig. of
Change
390185
GFJ
391439
GFJ
399136
GFJ
401531
GFJ
*D
2247127 MAHA
*E
2677622 HLR
*F
2767274 MAHA
*G
2882692 HLR
*H
3375125 HLR
*I
3561356 EBZ
*J
3657419 COPI
Description of Change
New document
Changed of material composition (updating the leadframe used).
Additional assembly site with different materials used.
Added Package weight in site 3 and word “PMDD”. Change the
word from two to three in summary of qualified assembly sites.
Deleted error existing link in assembly site 1 & 2 under section 1-A
– Analysis report. Added assembly site 3
1. Updated Cypress logo.
2. Changed QTP# 034101 to 034602 for assembly site 3.
3. Added “% weight of substance per Homogenous Material” and
“% Weight of Substance per Package” on the Material
Composition table.
4. Completed the RoHS Substances namely: Lead, Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table.
5. Deleted inactive bookset CML and change it to WEB in the
distribution list.
Added CAS Number of Antimony Trioxide. Changed CAS
Number of Gold.
Added the following for assembly site 1:
a. Added package weight for B2.
b. CoA-AZ44-R1
c. Added reference QTP 062603.
d. Added material composition table for NiPdAu using green mold
compound.
Added CAS Number for Silica Fused and Carbon Black on
Assembly Site 3.
Added Assembly Site 4 – JCET
Updated the material composition table to reflect 4 decimal places
on values.
Added package weight B2 for Site 2. Added Material Composition
table B2 using copper wire material for Site 2. Added reference
QTP #120103 for Site 2.
Changed QTP reference # 120103 to QTP # 120201 in Assembly
Site 2.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 23 of 24
44L -TQFP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
44L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04267
ECN No. Orig. of
Change
*K
*L
3978911 HLR
4031297 YUM
*M
4102877 AWP
HLR
*N
4340124 HLR
*O
4399451 HLR
*P
4404991 REYD
*Q
4632520
ZJL
*R
4677869
VFR
*S
4897115
MRB
*T
5268684
Description of Change
Added 1.0mm thick package using cu wire in B2 and Added B3
1.4mm thick package using cu wire.
Removed Tube specification on Indirect Materials tables.
Added Assembly site name in the Assembly heading.
Changed Assembly Code to Assembly Site Name.
Added on Site 1- CML:B3 – 335.5330 gm and QTP 133102 on the
topmost table and added new Table B3. Using Green Mold
Compound with Copper-Palladium (Cu-Pd) wire at Autoline
(reference QTP#133102)
Changed/corrected the Total Package Weight for Assembly Site 1.
B1 and Assembly Site 3.
Added B4 Material Composition for Assembly Site 2 in reference
to QTP No. 123808.
Added B5 Material Composition for Assembly Site 2 in reference
to QTP No. 141404 (CuPd Bonding Wire)
Added B2 on Package Weight and QTP # 141302 under Site 4.
Added subsections B1.USING GOLD WIRE and B2.USING
COPPER PALLADIUM WIRE under Assembly Site 4
Added item B2 Material Composition for Site 3 Amkor Korea using
C194 leadframe.
Added PMDD for Assembly Site 5 – Amkor Technology
Philippines under QTP # 150202
Added reference Package QTP # 141404 for CuPd wire on
Assembly site 2_B5
MEL
Removed Distribution: WEB and Posting: None from the
document history page
HLR
Changed the substances with “------------- “and Proprietary to
“Trade Secret.
Changed Cypress Logo.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04267 Rev. *T
Page 24 of 24
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