48L SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

48L - SSOP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
SP
B1: 650.0000 mg
B2: 610.0198 mg
B3: 648.5799 mg
B1: 650.0000 mg
B2: 610.0198 mg
B3: 606.5351 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mil
746.9799 mg
Package Weight – Site 4
B1: 634.3493 mg
B2: 633.9041 mg
SUMMARY
The 48L-SSOP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the requirements of Directive 2002/95/EC (RoHS).
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report #s 023606 / 022102 / 063103/125201 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP48CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 1 of 18
48L - SSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
NiPdAu with Standard Molding Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Fe
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Carbon Black
Fused Silica
Crystalline
Silica
CAS Number
Weight by
mg
% weight of
substance per
Homogeneous
PPM
% Weight
of
Substance
per
package
7440-95-4
7440-21-3
7739-95-4
7440-02-0
7439-89-6
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
110.0896
1.1693
0.7600
3.5079
0.2339
1.1693
0.1875
0.0095
0.0030
0.3500
0.0400
94.1500%
1.0000%
0.6500%
3.0000%
0.2000%
1.0000%
93.7400%
4.7500%
1.5200%
77.7800%
8.8800%
169,369
1,799
1,169
5,397
360
1,799
288
15
5
538
61
16.9369%
0.1799%
0.1169%
0.5397%
0.0360%
0.1799%
0.0288%
0.0015%
0.0005%
0.0538%
0.0061%
Trade Secret
0.0300
6.6700%
46
0.0046%
Trade Secret
Trade Secret
Trade Secret
0.0100
0.0100
0.0100
2.2200%
2.2200%
2.2200%
15
15
15
0.0015%
0.0015%
0.0015%
7440-21-3
7440-57-5
Trade Secret
6.2600
2.1700
41.9192
100.0000%
100.0000%
8.0000%
9,631
3,338
64,491
0.9631%
0.3338%
6.4491%
Trade Secret
1309-64-4
41.9192
5.2399
8.0000%
1.0000%
64,491
8,061
6.4491%
0.8061%
5.2399
419.1920
10.4798
1.0000%
80.0000%
2.0000%
8,061
644,911
16,123
0.8061%
64.4911%
1.6123%
% Total:
100.0000
1333-86-4
60676-86-0
14808-60-7
Package Weight (mg):
650.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 2 of 18
48L - SSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
NiPdAu using Green Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Si
Au
Silica
Phenol Resin
Epoxy Resin
CAS
Number
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-57-5
60676-86-0
Trade
Secret
Trade
Secret
Package Weight (mg):
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
133.2947
0.9006
0.2078
4.1568
1.3995
0.0252
0.0252
0.2000
96.2000%
0.6500%
0.1500%
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
218,509
1,476
341
6,814
2,294
41
41
328
21.8509%
0.1476%
0.0341%
0.6814%
0.2294%
0.0041%
0.0041%
0.0328%
0.0225
9.0000%
37
0.0037%
0.0125
5.0000%
20
0.0020%
0.0050
2.0000%
8
0.0008%
0.0050
2.0000%
8
0.0008%
0.0050
3.3000
2.3700
413.0401
2.0000%
100.0000%
100.0000%
89.0000%
8
5,410
3,885
677,093
0.0008%
0.5410%
0.3885%
67.7093%
23.2045
5.0000%
38,039
3.8039%
27.8454
6.0000%
45,647
4.5647%
%Total:
100.0000
610.0198
% Weight
of
Substance
per
package
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 3 of 18
48L - SSOP
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Wire with NiPdAu using Kyocera Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Si
Cu
SiO2
Phenol Resin
Epoxy Resin
Carbon Black
CAS
Number
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-50-8
60676-86-0
Trade
Secret
Trade
Secret
1333-86-4
Package Weight (mg):
143.8171
3.5434
0.1033
0.1772
1.4911
0.0269
0.0269
0.2131
% Weight of
Substance
per
Homogeneo
us
Material
97.4100
2.4000
0.0700
0.1200
96.5200
1.7400
1.7400
80.0000
221,742
5,463
159
273
2,299
41
41
329
22.1742
0.5463
0.0159
0.0273
0.2299
0.0041
0.0041
0.0329
0.0240
9.0000
37
0.0037
0.0133
5.0000
21
0.0021
0.0053
2.0000
8
0.0008
0.0053
2.0000
8
0.0008
0.0053
3.5163
1.1052
440.1105
2.0000
100.0000
100.0000
89.0000
8
5,422
1,704
678,576
0.0008
0.5422
0.1704
67.8576
24.7253
5.0000
38,122
3.8122
28.4341
1.2363
5.7500
0.2500
43,841
1,906
4.3841
0.1906
%Total:
100.0000
Weight by
mg
648.5799
% Weight
of
Substance
per
package
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 4 of 18
48L - SSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
Plastic Tube
End Plug
Carrier Tape
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 5 of 18
48L - SSOP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report #s 071101 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP48Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 6 of 18
48L - SSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS
Number
Weight by
mg
% weight of
substance per
Homogeneous
% Weight
of
Substance
per
package
PPM
Cu
Ni
Si
Mg
Ag
7440-95-4
7440-02-0
7440-21-3
7739-95-4
7440-22-4
224.7444
7.0027
1.5274
0.3525
1.3629
95.6400%
2.9800%
0.6500%
0.1500%
0.5800%
300,871
9,375
2,045
472
1,825
30.0871%
0.9375%
0.2045%
0.0472%
0.1825%
Sn
7440-31-5
12.0300
100.0000%
16,105
1.6105%
Resin
Ag
Metal Oxide
Amine
Gamma
Butyrolactone
Si
Trade Secret
7440-22-0
Trade Secret
Trade Secret
96-48-0
1.3818
4.6060
0.1974
0.1974
0.1974
21.0000%
70.0000%
3.0000%
3.0000%
3.0000%
1,850
6,166
264
264
264
0.1850%
0.6166%
0.0264%
0.0264%
0.0264%
7440-21-3
23.0600
100.0000%
30,871
3.0871%
Au
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
7440-57-5
Trade Secret
1.1200
35.1900
100.0000%
7.5000%
1,499
47,110
0.1499%
4.7110%
60676-86-0
1333-86-4
403.5120
2.3460
86.0000%
0.5000%
540,191
3,141
54.0191%
0.3141%
Epoxy Cresol
Novolac
Phenol Resin
29690-82-2
9.3840
2.0000%
12,563
1.2563%
18.7680
4.0000%
25,125
2.5125%
% Total:
100.0000
Trade Secret
Package Weight (mg):
746.9799
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 7 of 18
48L - SSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
Plastic Tube
End Plug
Carrier Tape
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 8 of 18
48L - SSOP
Pb-Free Package
ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET)
Package Qualification Report #s 104810/ 104802, 143702 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP48JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 9 of 18
48L - SSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
NiPdAu with Standard Molding Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
% weight of
substance per
Homogeneous
PPM
% Weight
of
Substanc
e per
package
94.1500%
1.0000%
0.6500%
3.0000%
0.2000%
1.0000%
93.7400%
4.7500%
1.5200%
77.7800%
8.8800%
169,369
1,799
1,169
5,397
360
1,799
288
15
5
538
61
16.9369%
0.1799%
0.1169%
0.5397%
0.0360%
0.1799%
0.0288%
0.0015%
0.0005%
0.0538%
0.0061%
0.0300
6.6700%
46
0.0046%
Trade Secret
Trade Secret
Trade Secret
0.0100
0.0100
0.0100
2.2200%
2.2200%
2.2200%
15
15
15
0.0015%
0.0015%
0.0015%
7440-21-3
7440-57-5
Trade Secret
6.2600
2.1700
41.9192
100.0000%
100.0000%
8.0000%
9,631
3,338
64,491
0.9631%
0.3338%
6.4491%
Trade Secret
1309-64-4
41.9192
5.2399
8.0000%
1.0000%
64,491
8,061
6.4491%
0.8061%
5.2399
419.1920
10.4798
1.0000%
80.0000%
2.0000%
8,061
644,911
16,123
0.8061%
64.4911%
1.6123%
Substance
Composition
CAS
Number
Cu
Si
Mg
Ni
Fe
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Carbon Black
Fused Silica
Crystalline Silica
7440-95-4
7440-21-3
7739-95-4
7440-02-0
7439-89-6
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
110.0896
1.1693
0.7600
3.5079
0.2339
1.1693
0.1875
0.0095
0.0030
0.3500
0.0400
Trade Secret
1333-86-4
60676-86-0
14808-60-7
Package Weight (mg):
Weight by
mg
650.0000
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 10 of 18
48L - SSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
NiPdAu using Green Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-57-5
60676-86-0
Trade
Secret
Trade
Secret
133.2947
0.9006
0.2078
4.1568
1.3995
0.0252
0.0252
0.2000
96.2000%
0.6500%
0.1500%
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
218,509
1,476
341
6,814
2,294
41
41
328
21.8509%
0.1476%
0.0341%
0.6814%
0.2294%
0.0041%
0.0041%
0.0328%
0.0225
9.0000%
37
0.0037%
0.0125
5.0000%
20
0.0020%
0.0050
2.0000%
8
0.0008%
0.0050
2.0000%
8
0.0008%
0.0050
3.3000
2.3700
413.0401
2.0000%
100.0000%
100.0000%
89.0000%
8
5,410
3,885
677,093
0.0008%
0.5410%
0.3885%
67.7093%
23.2045
5.0000%
38,039
3.8039%
27.8454
6.0000%
45,647
4.5647%
Package Weight(mg):
610.0198
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Si
Au
Silica
Phenol Resin
Epoxy Resin
CAS
Number
% Weight of
Substance
per package
PPM
%Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 11 of 18
48L - SSOP
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Palladium Wire
Material
Leadframe
Lead Finish
Die Attach
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
Nickel
Silicon
Magnesium
7440-02-0
7440-21-3
7439-95-4
Silver
7440-22-4
3.0800
0.6300
0.2100
3.2200
Copper
7440-50-8
132.8600
Tin
7440-31-5
% weight of
substance
per
Homogeneou
s
0.0220
0.0045
0.0015
1.8850
0.0230
5,078
1,039
346
5,309
%%
Weight of
Substance
per
package
0.5078%
0.1039%
0.0346%
0.5309%
0.9490
219,048
21.9048%
3,108
0.3108%
330
0.0330%
37
0.0037%
21
0.0021%
1.0000
0.2000
Silver
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
7440-22-4
Trade Secret
Trade Secret
0.0050
0.0200
8
0.0008%
Acrylate Ester
Organic Peroxide
Silicon
Copper
Palladium
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
Trade Secret
0.0050
0.0050
3.3000
1.0808
0.0193
13.8000
13.8000
23.0000
408.0200
1.3800
0.0200
0.0200
1.0000
0.9825
0.0175
0.0300
0.0300
0.0500
0.8870
0.0030
8
8
5,441
1,782
32
22,752
22,752
37,920
672,706
2,275
0.0008%
0.0008%
0.5441%
0.1782%
0.0032%
2.2752%
2.2752%
3.7920%
67.2706%
0.2275%
% Total:
100.0000
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
60676-86-0
1333-86-4
Package Weight (mg):
0.8000
PPM
0.0225
0.0900
0.0125
0.0500
606.5351
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 12 of 18
48L - SSOP
Pb-Free Package
ASSEMBLY Site 4: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report #s 053502, 120410 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP48OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 13 of 18
48L - SSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Leadframe
Lead Finish
Purpose of
Use
Base Material
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Ni
Pd
Au
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Epoxy resin
Acrylate
Peroxide
Additive
Silver
Si
Au
Epoxy Resin(1)
Epoxy Resin(2)
Phenol Resin
Carbon black
Silica
Others
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
Weight by
mg
% weight of
substance per
Homogeneous
% Weight
of
Substance
per
package
PPM
124.2759
2.9717
0.1938
0.1292
0.0194
0.1209
0.0202
0.0202
97.2665%
2.3258%
0.1517%
0.1011%
0.0152%
0.0946%
0.0158%
0.0158%
195,911
4,685
306
204
31
191
32
32
19.5911%
0.4685%
0.0306%
0.0204%
0.0031%
0.0191%
0.0032%
0.0032%
0.0173
1.2920
0.1292
0.0129
0.0263
0.0135%
90.0903%
9.0088%
0.9009%
8.5000%
27
2,037
204
20
41
0.0027%
0.2037%
0.0204%
0.0020%
0.0041%
0.0170
5.5000%
27
0.0027%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-22-4
7440-21-3
0.0062
0.0170
0.0077
0.0031
0.0062
0.2255
2.0000%
5.5000%
2.5000%
1.0000%
2.0000%
73.0000%
10
27
12
5
10
355
0.0010%
0.0027%
0.0012%
0.0005%
0.0010%
0.0355%
12.7009
7440-57-5
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Trade Secret
0.8342
12.2826
12.2826
24.5651
0.9826
431.3635
9.8261
100.0000%
100.0000%
2.5000%
2.5000%
5.0000%
0.2000%
87.8000%
2.0000%
20,022
1,315
19,362
19,362
38,725
1,549
680,010
15,490
2.0022%
0.1315%
1.9362%
1.9362%
3.8725%
0.1549%
68.0010%
1.5490%
Package Weight (mg):
634.3493
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 14 of 18
48L - SSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper wire material
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Substance
Composition
% weight of
substance per
Homogeneous
% Weight of
Substance
per package
CAS Number
Weight
by mg
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Ni
Pd
Au
Silver
Epoxy resin A
Epoxy resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic
peroxide
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-02-0
7440-05-3
7440-57-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
124.2759
2.9717
0.1938
0.1292
0.0194
0.1209
0.0202
0.0202
0.0173
1.2920
0.1292
0.0129
0.2287
0.0124
0.0185
0.0124
0.0185
97.2665%
2.3258%
0.1517%
0.1011%
0.0152%
0.0946%
0.0158%
0.0158%
0.0135%
90.0903%
9.0088%
0.9009%
74.0000%
4.0000%
6.0000%
4.0000%
6.0000%
196,048
4,688
306
204
31
191
32
32
27
2,038
204
20
361
19
29
19
29
19.6048%
0.4688%
0.0306%
0.0204%
0.0031%
0.0191%
0.0032%
0.0032%
0.0027%
0.2038%
0.0204%
0.0020%
0.0361%
0.0019%
0.0029%
0.0019%
0.0029%
Trade Secret
0.0155
5.0000%
24
0.0024%
461-58-5
0.0015
0.5000%
2
0.0002%
Trade Secret
0.0015
0.5000%
2
0.0002%
12.7009
100.0000%
20,036
2.0036%
PPM
Die
Circuit
Si
7440-21-3
Wire
Interconnect
Copper
Silica Fused
Epoxy,Cresol
Novolac
Phenol resin
Metal Hydroxide
Carbon Black
Epoxy resin A
Silica Fused
Silica,crystalline
7440-50-8
60676-86-0
0.3890
363.5639
100.0000%
74.0000%
614
573,531
0.0614%
57.3531%
29690-82-2
19.6521
4.0000%
31,002
3.1002%
Trade Secret
Trade Secret
1333-86-4
Trade Secret
7631-86-9
14808-60-7
29.4782
19.6521
29.4782
24.5651
2.4565
2.4565
6.0000%
4.0000%
6.0000%
5.0000%
0.5000%
0.5000%
46,503
31,002
46,503
38,752
3,875
3,875
4.6503%
3.1002%
4.6503%
3.8752%
0.3875%
0.3875%
Mold
Compound
Encapsulation
Package Weight (mg):
633.9041
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 15 of 18
48L - SSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
Plastic Tube
End Plug
Carrier Tape
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 16 of 18
48L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
48L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03011
**
*A
ECN No. Orig. of
Change
385294
EML
1521764 MRB
*B
2147487 MAHA
*C
*D
*E
DCon
2702846 HLR
2771951 MAHA
2902139 MAHA
*F
*G
*H
*I
3055777
3218994
3289531
3616106
*J
*K
3645909 UDR
4075211 YUM
MAHA
REYD
MAHA
HLR
Description of Change
New document
1. Updated Cypress Logo
2. Added on the material composition the percent weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials.
4. Added note 4: the package were based on
Engineering calculation and performed on a package
family basis.
Added the following:
1. CoA-SP48-R1
2. B2: 610 mg
3. QTP Reference 063103
4. B2. NiPdAu using Green Molding Compound
Changed the following in Table B1:
1. CAS number of Antimony trioxide
2. CAS number of Fused Silica
3. CAS number of Crystalline Silica
4. CAS number of Carbon black
Replaced CML with WEB in distribution list.
Changed the % weight of substance of NiPdAu.
Added data for assembly site 2.
Revised the lead frame data on Table B2 for assembly
site 1. Recalculated PPM and % Weight of Substance
per package data on Table B2 for assembly site 1.
Added the CAS number of Sn on assembly site 2.
Added Assembly Site 3 – JCET.
Added Assembly Site 4.
Updated the material composition of Assembly Sites 1 to
3 to reflect 4 decimal places on values.
Added B2 on Site 4 with reference QTP # 120410.
Added Assembly Site Name in the Assembly heading in
site 1, 2, 3 and 4.
Changed Assembly code to Assembly Site Name in site
1, 2, 3 and 4.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 17 of 18
48L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
*L
*M
*N
*O
48L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03011
ECN No. Orig. of
Description of Change
Change
4081278 UDR/YUM Added B3 on Package Weight – Site 1.
Added QTP # 125201 on Assembly Site 1.
Added B3 on Assembly Site 1 Material Composition.
4498384 REYD
Added B3 in Package Weight and QTP# 143702 under
Site 3.
Updated Material Composition Table under Assembly
Site 3-B3.
4800162 HLR
Sunset Due – No Change.
5320102 HLR
Changed Cypress Logo.
Changed the substances with “------------- “ and
Proprietary to “Trade Secret".
MQJ
Removed Distribution: WEB and Posting: None in the
document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03011 Rev.*O
Page 18 of 18