PHILIPS SAA1310T

INTEGRATED CIRCUITS
DATA SHEET
SAA1310
Control interface for VHS video
recorders
Product specification
File under Integrated Circuits, IC02
April 1995
Philips Semiconductors
Product specification
Control interface for VHS video
recorders
SAA1310
FEATURES
GENERAL DESCRIPTION
• Full support of VISS and VASS mode (VHS
Index/Address Search System)
The SAA1310 provides an interface between the tape
control head in the VHS deck-electronics.
The circuit also includes an interface between sensors in
the deck mechanics and the microprocessor.
• Read, write and overwrite of Tape Control/head signal
(CTL)
• Power-ON and power-failure indicator
• 4 general purpose comparators for interface between
sensors and microprocessor
• 2 comparators have a 100 mA output driver
• PAL and NTSC compatible
ORDERING INFORMATION
PACKAGE
EXTENDED
TYPE NUMBER
PINS
PIN POSITION
MATERIAL
CODE
SAA1310
18
DIL
plastic
SOT102 (1)
SAA1310T
20
SO
plastic
SOT163A (2)
Note
1. SOT102-1; 1996 December 02.
2. SOT163-1; 1996 December 02.
April 1995
2
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
handbook, full pagewidth
write
current
capstan reverse
input
WRITE
AMPLIFIER
write/read
input
16
(18)
control head data
output
17
(19)
power on/failure
output
4
(4)
power on/failure
capacitor
18
(20)
control head
input/output
2
(2)
control head
feedback
1
(1)
reference voltage
output
3
(3)
AMPLIFIER
FILTER
DETECTOR
SAA1310
(SAA1310T)
VP
Vref
POWER-ON AND
POWER-FAILURE
DETECTOR
V ref
5
(6)
comparator 1
comparator 2
non - inverting input
6
(7)
comparator 2
comparator 3
inverting input
7
(8)
comparator 4
inverting input
8
(9)
comparator 1
non - inverting input
10
(11)
15
(17)
comparator 1
output
14
(15)
comparator 2
output
comparator 3
13
(14)
comparator 3
output
comparator 4
11
(12)
comparator 4
output
9 (10)
12 (13)
MEA082 - 1
VP
GND
Pin numbers in parenthesis refer to the SAA1310T.
Fig.1 Block diagram.
April 1995
3
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
PIN CONFIGURATION
handbook, halfpage
CTL FB 1
20 CAPREV
CTL I/O 2
19 PO/FAIL OUT
dbook, halfpage
CTL FB 1
18 CAPREV
CTL I/O 2
17 PO/FAIL OUT
Vref
18 CTL DATA
Vref 3
16 CTL DATA
3
CPO/FAIL 4
CPO/FAIL 4
CIN1 5
17 COUT1
15 COUT1
SAA1310
16 n.c.
n.c. 5
SAA1310T
14 COUT2
CIN2 6
13 COUT3
CIN3 7
12 GND
CIN4 8
11 COUT4
CIN1 6
15 COUT2
CIN2 7
14 COUT3
CIN3 8
13 GND
CIN4 9
12 COUT4
10 WRITE/READ
VP 9
VP 10
MEA083
11 WRITE/READ
MEA084
a. SAA1310.
b. SAA1310T.
Fig.2 Pin configurations.
PINNING (pins in parenthesis refer to SAA1310T)
SYMBOL
CTL FB
PIN
1
(1)
DESCRIPTION
control head feedback
CTL I/O
2
(2)
control head input/output
Vref
3
(3)
reference voltage output
CPO/FAIL
4
(4)
power on/failure capacitor
CIN1
5
(6)
comparator 1 input
CIN2
6
(7)
comparator 2 input
CIN3
7
(8)
comparator 3 input
CIN4
8
(9)
comparator 4 input
VP
9
(10)
supply voltage
WRITE/READ
10
(11)
write/read input
COUT4
11
(12)
comparator 4 output
GND
12
(13)
ground
COUT3
13
(14)
comparator 3 output
COUT2
14
(15)
comparator 2 output
COUT1
15
(17)
comparator 1 input
CTL DATA
16
(18)
control head data output
PO/FAIL OUT
17
(19)
power on/failure output
CAPREV
18
(20)
capstan reverse input
April 1995
4
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
VP
supply voltage range
VI/VO
voltage on all pins
VO
CONDITIONS
MIN.
MAX.
UNIT
0
6.0
V
0
VP
V
output voltage on pins 11 (12) and 13 (14)
0
18
V
Tstg
storage temperature range
−65
+150
°C
Tamb
ambient temperature range
0
+70
°C
except pins 11 (12) and 13 (14)
THERMAL RESISTANCE
SYMBOL
PARAMETER
TYP.
MAX.
UNIT
Rth
thermal resistance (SAA1310)
75
−
K/W
Rth
thermal resistance (SAA1310T)
90
−
K/W
April 1995
5
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)
VP = 5 V; Tamb = 25 °C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise
specified
SYMBOL
Pd
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
−
85
−
mW
4.5
5.0
5.5
V
read mode
10
15
20
mA
write mode; duty factor = 50%
13
18
24
mA
input voltage (peak-to-
f = 500 Hz
0.35
−
−
mV
peak value)
f = 30 kHz; non-linear operation −
−
200
mV
−
3
−
kHz
read mode
−
0.1
−
µA
ICTL I/O = 3 mA;
−
−
0.4
V
4.6
−
−
V
power dissipation
note 1
Supply pin 9 (10)
VP
supply voltage
IP
supply current
CTL I/O pin 2 (2)
READ MODE PIN 10 (11) < 0.5 V
VI
B
bandwidth low-pass filter
Ib
input bias current
WRITE MODE PIN 10 (11) > 3.5 V
VO
output voltage LOW
pin CTL DATA = HIGH
VO
output voltage HIGH
ICTL I/O = − 3 mA;
pin CTL DATA = LOW
WRITE/READ pin 10 (11)
VI
II
input voltage
input current
read mode
−
−
0.5
V
write mode; analog
1.6
−
3.3
V
read mode
−
− 1.5 −
µA
write mode
−
0.1
−
µA
2.4
2.5
2.6
V
−4
−
+4
mA
−
0.4
0.6
Ω
2.0
−
−
V
Vref pin 3 (3); note 2
VO
output voltage
Itot
total current
RO
output resistance
including write current
CAPREV pin 18 (20)
VIH
input voltage HIGH
VIL
input voltage LOW
−
−
0.8
V
IIH
input current HIGH
VCAPREV = 5 V
−
−
10
µA
IIH
input current LOW
VCAPREV = 0 V
−10
−
−
µA
April 1995
6
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SYMBOL
PARAMETER
SAA1310
CONDITION
MIN.
TYP.
MAX.
UNIT
CTL DATA pin 16 (18)
WRITE MODE
VIH
input voltage HIGH
2.0
−
−
V
VIL
input voltage LOW
−
−
0.8
V
IIH
input current HIGH
VCTL DATA = 5 V
−
−
10
µA
IIL
input current LOW
VCTL DATA = 0 V
−10
−
−
µA
READ MODE
VOL
output voltage LOW
IOL = 0.5 mA
−
−
0.4
V
VOH
output voltage HIGH
IOH = − 50 µA
2.4
−
−
V
1.5
−
5.5
V
CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3
VO
operating voltage range
at decreasing VP
VOL
output voltage LOW
IOL = 1 mA
−
−
0.4
V
VOH
output voltage HIGH
IOH = 1 mA
VP − 0.9
−
−
V
td
delay time
CCAPREV = 68 nF
−
50
−
ms
VTL1
threshold level 1
4.5
−
4.8
V
VTL2
threshold level 2
−
3.5
−
V
IO
source current pin 4
−
−3
−
µA
IO
sink current pin 4
−
300
−
µA
VO(min.)
minimum output voltage
−
20
−
mV
VO(max.)
maximum output voltage
−
2.1
−
V
High output current type comparators
CIN3 and CIN4 pins 7 (8) and 8 (9)
Vhys
input hysteresis
−
10
−
mV
VIL
input voltage LOW
−
−
Vref − 10 mV
V
VIH
input voltage HIGH
Vref + 10 mV
−
−
V
IIL
input current LOW
CIN3 = CIN4 = 0 V
−1
−
−
µA
IIH
input current HIGH
CIN3 = CIN4 = VP
−
−
+1
µA
IOL = 100 mA
−
−
1.0
V
IOL = 2 mA
−
−
0.4
V
COUT3 and COUT4 pins 13 (14) and 11 (12)
VOL
output voltage LOW
±IOL
leakage current
output voltage HIGH;
COUT3 = COUT4 = 17 V
−
−
1
µA
ttr
transient time
note 3
−
0.5
−
µs
Tj
thermal protection
−
130
−
°C
April 1995
7
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SYMBOL
PARAMETER
SAA1310
CONDITION
MIN.
TYP.
MAX.
UNIT
Low output current type comparators
CIN1 AND CIN2 pins 5 (6) and 6 (7)
Vhys
input hysteresis
−
10
−
mV
VIL
input voltage LOW
−
−
Vref − 10 mV
V
VIH
input voltage HIGH
II
input current
Vref + 10 mV
−
−
V
CIN1 = CIN2 = 0 V
−1
−
−
µA
CIN1 = CIN2 = VP
−
−
+1
µA
COUT1 AND COUT2 pins 15 (17) and 14 (15)
VOL
output voltage HIGH
IOH = −100 µA
4.5
−
−
V
VOH
output voltage LOW
IOL = 2 mA
−
−
1
V
ttr
transient time
note 4
−
0.5
−
µs
Notes to the characteristics
1. Without the sink current of the comparators; in write mode.
2. Minimum value of capacitor connected to this pin is 4.7 µF.
3. Vi = 100 mV p-p. Inputs connected to Vref via a 10 kΩ resistor; outputs connected to VP via a 250 Ω resistor.
4. Vi = 100 mV p-p. Inputs connected to Vref via a 10 kΩ resistor; outputs connected to VP via a 2.5 kΩ resistor.
April 1995
8
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
VP
td
100
VTL1
VTL2
1.5 V
t
V17 (19)
td
td
td
td
100
t
Fig.3 Power-ON and power-failure detector.
April 1995
9
MEA085
April 1995
82 nF
V
V
I
I
650 Ω
10
I
I
10 µF
I
V
V
V
8
(9)
7
(8)
6
(7)
5
(6)
3
(3)
1
(1)
2
(2)
18
I (20)
write
current
−
+
−
+
−
+
−
+
VP
Vref
GND
12(13)
SAA1310
(SAA1310T)
POWER-ON AND
POWER-FAILURE
DETECTOR
+
−
MEA086 - 1
11
(12)
13
(14)
14
(15)
15
(17)
4
(4)
17
(19)
16
(18)
10
(11)
Fig.4 Test circuit diagram.
VP
9(10)
comparator 4
comparator 3
comparator 2
comparator 1
V ref
AMPLIFIER
FILTER
DETECTOR
WRITE
AMPLIFIER
V
V
V
I
I
I
I
I
W
R
V
V
I
I
Control interface for VHS video recorders
Pin numbers in parenthesis refer to the SAA1310T.
Vi
I
handbook, full pagewidth
Philips Semiconductors
Product specification
SAA1310
APPLICATION INFORAMTION
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
handbook, full pagewidth
1
(1)
18
(20)
CAPREV
2
(2)
17
(19)
PO/FAIL OUT
3
(3)
16
(18)
CTL DATA
4
(4)
15
(17)
COUT1
5
(6)
14
(15)
COUT2
47 µF
CTL head
4.7 nF
47
µF
VI
68
nF
VI
SAA1310
(SAA1310T)
VI
VI
VI
+5 V
6
(7)
13
(14)
7
(8)
12
(13)
8
(9)
11
(12)
9
(10)
10
(11)
47
µF
COUT3
COUT4
47 kΩ
WRITE/READ
100
nF
MEA087
Pin numbers in parenthesis refer to the SAA1310T.
Fig.5 Application diagram.
April 1995
11
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
PACKAGE OUTLINES
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
10
18
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
0.85
inches
0.19
0.020
0.15
0.055
0.044
0.021
0.015
0.055
0.044
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
93-10-14
95-01-23
SOT102-1
April 1995
EUROPEAN
PROJECTION
12
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
April 1995
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
13
Philips Semiconductors
Product specification
Control interface for VHS video recorders
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
April 1995
SAA1310
14
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 1995
15