PHILIPS SAA3049AP

INTEGRATED CIRCUITS
DATA SHEET
SAA3049A
Infrared remote control decoder
Product specification
Supersedes data of 1996 Apr 15
File under Integrated Circuits, IC02
1996 Sep 13
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
FEATURES
GENERAL DESCRIPTION
• Decodes 64 remote control commands with a maximum
of 32 subaddresses
The main function of the SAA3049A is to check and
convert the received coded data (RECS80/RC5) into
latched binary outputs. The device address can be
hard-wired for a particular address, allowing several
devices in one location. Alternatively, received data with
any address can be accepted; the received data and
address are then outputs.
• Accepts RECS80 codes with pulse position modulation
(SAA3004, SAA3007, SAA3008) or RC5 codes with
bi-phase transmission (SAA3006, SAA3010)
• Suitable for low voltage and low SAA3049A supply
current applications
• Adding circuitry for binary decoding allows a maximum
of 2048 commands to be used, for example 1-of-16
decoder (HEF4515).
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
SAA3049AP
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SAA3049AT
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
1996 Sep 13
DESCRIPTION
2
VERSION
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
SYSTEM DIAGRAM
command acknowledge
handbook, full pagewidth
+5 V
VBatt
VCC
CA
bits
A
B
REMOTE
CONTROL
TRANSMITTER
SAA3004
SAA3007
SAA3008
or
SAA3006
SAA3010
REMOTE
CONTROL
DECODER
C
data
D
E
F
CQW89A
CQY89A
IR
BPW50
IR
PREAMPLIFIER
IN
T0
SAA3049A
toggle
A0 (S0)
A1 (S1)
A2 (S2)
A3 (S3)
A4
4 MHz
Remote control transmitters (see individual data sheet for full specification):
SAA3004: VBatt = 4 to 11 V (max.); 7 × 64 = 448 commands (RECS80 code).
SAA3007: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).
SAA3008: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).
SAA3006: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).
SAA3010: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).
Fig.1 System diagram.
1996 Sep 13
3
MGE374
address
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
PINNING
SYMBOL
PIN
DESCRIPTION
A
1
data output
B
2
data output
C
3
data output
D
4
data output
E
5
F
A0 (S0)
handbook, halfpage
A 1
20 VCC
data output
B 2
19 CRI
6
data output
C 3
18 T0
7
data/address output/input
D 4
17 A2 (S2)
E 5
A1 (S1)
8
data/address output/input
IN
9
digital input
GND
10
ground
MODE
11
RC5/RECS80 mode selection
XTAL1
12
XTAL2
16 A3 (S3)
SAA3049A
F 6
15 A4
A0 (S0) 7
14 RESET
crystal oscillator
A1 (S1) 8
13 XTAL2
13
crystal oscillator
IN 9
12 XTAL1
RESET
14
reset input
GND 10
11 MODE
A4
15
address output/input
A3 (S3)
16
address output/input
A2 (S2)
17
address output/input
T0
18
T0 bit
CRI
19
command received indicator
VCC
20
supply voltage
1996 Sep 13
MGD347
Fig.2 Pin configuration.
4
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
−0.5
+7
V
VI
input voltage
any pin
−0.5
VCC + 0.5
V
II
DC input current
any pin
−
−10
mA
IO
DC output current
any pin
−
10
mA
Ptot
total power dissipation
−
125
mW
Po
power dissipation per output
−
30
mW
IDD
positive supply current
−50
+50
mA
ISS
negative supply current
−100
+50
mA
Tamb
operating ambient temperature
−40
+85
°C
Tstg
storage temperature
−65
+150
°C
HANDLING
Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
1996 Sep 13
5
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
CHARACTERISTICS
VCC = 2.5 to 5.5 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VCC
supply voltage
ICC
supply current
VDD = 3 V,
fxtal = 4 MHz
2.5
−
5.5
V
−
0.3
0.7
mA
Input signals (pin 9)
VIH
HIGH level input voltage
0.7VCC
−
VCC
V
VIL
LOW level input voltage
0
−
0.3VCC
V
Mode selection (pin 11)
VIH
HIGH level input voltage
0.7VCC
−
VCC
V
VIL
LOW level input voltage
0
−
0.3VCC
V
Command received indicator and mode control (pin 19); note 1
VIH
HIGH level input voltage
0.7VCC
−
VCC
V
VIL
LOW level input voltage
0
−
0.3VCC
V
−
4
−
MHz
−1.6
−12
−
mA
Crystal oscillator
fosc
oscillator frequency
note 2
Outputs
OPEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3
IOL(sink)
LOW level output sink current
VCC = 5 V;
VOL = 0.4 V
Notes
1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs.
With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs.
a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series
resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is
acknowledged, can be used to activate (flash) an LED indicator.
2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application.
3. Application as output requires connection of an external pull-up resistor.
1996 Sep 13
6
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
Reset
The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power
supply transients by generating a reset.
The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS,
a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (±500 mV accuracy).
handbook, full pagewidth
VCC
20
390 Ω
1 µF
1.8 kΩ
SAA3049A
1N4148
zener diode
3.6 V
14
BC548
1N4148
68 kΩ
1 kΩ
MGE375
Fig.3 Proposed improved reset circuit.
Infrared signal input (pin 9)
APPLICATION INFORMATION
This pin is sensitive to a negative-going edge.
In Fig.5, the circuit shown is for use with transmitters
SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for
RECS80 code.
Command received indicator (pin 19)
In Fig.6, the circuit shown is for use with transmitter types
SAA3006 or SAA3010; pin 11 is LOW for RC5 code.
In Fig.7, the decoder is set for the required subaddress by
holding the address pins HIGH or LOW. Pin 11 is HIGH for
use with transmitter types SAA3004, SAA3007 or
SAA3008 (RECS80 code). Pin 11 is LOW for use with
transmitter types SAA3006 or SAA3010 (RC5 code).
The remote control decoder is for up to 32 subaddresses
with 6 + 1-bit parallel outputs (RC5 code).
handbook, halfpage
signal at
pin 19
≈15 ms
≈120 ms
MGE376
Fig.4 Output diagram of command acknowledge.
1996 Sep 13
7
1996 Sep 13
BC548
5.6 kΩ
D1
CQW24
8
19
2
B
20
1
A
33
kΩ
VCC
(+5 V)
C
3
18
D
4
17
data outputs
5.6
kΩ
15
F
6
7
14
8
13
IN
input
9
12
4 MHz
1N4148
10
11
S0-bit
S1-bit
S3-bit
S2-bit
(1)
MGE377
address
outputs
address
outputs
Fig.5 Remote control decoder with latched 11 (10) -bit parallel outputs [10 (9) -bits inverted].
E
5
SAA3049A
16
subaddress
range (2)
1 µF
68 kΩ
T0-bit
Infrared remote control decoder
(1) Only for subaddress 8 to 20.
(2) subaddress range:
when LOW (subaddress 8 to 20) pin 15 is connected to ground
when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.
BC548
220 Ω
command
acknowledge
handbook, full pagewidth
Philips Semiconductors
Product specification
SAA3049A
1996 Sep 13
BC548
9
19
2
B
20
1
A
33
kΩ
VCC
(+5 V)
C
3
18
D
4
17
data outputs
5.6
kΩ
15
E
5
F
6
SAA3049A
16
1 µF
7
14
8
13
IN
input
9
12
4 MHz
1N4148
68 kΩ
10
11
A0-bit
A1-bit
A4-bit
A3-bit
A2-bit
T0-bit
MGE378
address
outputs
address
outputs
Infrared remote control decoder
Fig.6 Remote control decoder with latched 12 -bit parallel outputs (11 bits inverted).
5.6 kΩ
D1
CQW24
BC548
220 Ω
command
acknowledge
handbook, full pagewidth
Philips Semiconductors
Product specification
SAA3049A
1996 Sep 13
BC548
T0
5.6 kΩ
D1
CQW24
10
B
2
1
A
19
20
68 kΩ
VCC
(+5 V)
33
kΩ
D
4
17
data outputs
C
3
18
5.6
kΩ
15
F
6
7
14
8
13
IN
input
9
12
4 MHz
1N4148
10
11
MGE379
for address see
data sheets of
transmitter ICs
S0 (A0)
S1 (A1)
(A4) (2)
S3 (A3)
S2 (A2)
set subaddresses
H or L (1)
H selects RECS80 code
L selects RC5 CODE
Fig.7 Remote control decoder for up to 20 subaddresses with 6 + 1-bit parallel outputs (RECS80 code).
E
5
SAA3049A
16
1 µF
68 kΩ
mode
Infrared remote control decoder
(1) Address inputs:
when LOW address input pin is connected to ground
when HIGH address input pin is connected via pull-up resistor to VCC.
(2) subaddress range RECS80 code:
when LOW (subaddress 8 to 20) pin 15 is connected to ground
when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.
BC548
220 Ω
command
acknowledge
handbook, full pagewidth
Philips Semiconductors
Product specification
SAA3049A
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
PACKAGE OUTLINES
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
11
20
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
inches
0.17
0.020
0.13
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
D
(1)
e
e1
L
ME
MH
w
Z (1)
max.
6.40
6.22
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.0
0.25
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.078
E
(1)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT146-1
1996 Sep 13
REFERENCES
IEC
JEDEC
EIAJ
SC603
11
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-05-24
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.42
0.39
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
1996 Sep 13
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
12
o
8
0o
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt.
Dwell times vary between 50 and 300 seconds depending
on heating method. Typical reflow temperatures range
from 215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Sep 13
13
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Sep 13
14
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
NOTES
1996 Sep 13
15
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Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1996
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
537021/25/02/pp16
Date of release: 1996 Sep 13
Document order number:
9397 750 01145