INTEGRATED CIRCUITS DATA SHEET PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers Product specification Supersedes data of 1996 Apr 04 File under Integrated Circuits, IC14 1996 Nov 20 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 5.2 Pinning Pin description 6 INSTRUCTION SET 7 ROM MASK OPTIONS 8 HANDLING 9 LIMITING VALUES 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 12 PACKAGE OUTLINES 13 SOLDERING 13.1 13.2 13.2.1 13.2.2 13.3 13.3.1 13.3.2 13.3.3 Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS 1996 Nov 20 2 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 1 FEATURES 2 • Manufactured in silicon gate CMOS process GENERAL DESCRIPTION This data sheet details the specific properties of the PCF84C12A, PCF84C22A and PCF84C42A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the “PCF84CxxxA family” data sheet, which should be read in conjunction with this publication. Note that the devices described in this data sheet do not feature I2C-bus compatibility or derivative logic, so the information given in the family data sheet about these features can be ignored. • 8-bit CPU, ROM, RAM, I/O in a 20-lead package • 1 kbyte ROM (PCF84C12A) • 2 kbyte ROM (PCF84C22A) • 4 kbyte ROM (PCF84C42A) • 64 byte RAM • Over 100 instructions (based on MAB8048) all of 1 or 2 cycles The PCF84C12A, PCF84C22A and PCF84C42A are general purpose CMOS microcontrollers with 1 kbyte, 2 kbytes and 4 kbytes of program memory, respectively. They include 64 bytes of RAM and 13 I/O port lines. The instruction set is based on the MAB8048 and is a sub-set of that listed in the “PCF84CxxxA family” data sheet. • 13 quasi-bidirectional I/O port lines • 8-bit programmable timer/event counter 1 • Two single-level vectored interrupts: – external – 8-bit programmable timer/event counter 1 • Two test inputs, one of which also serves as the external interrupt input • Stop and Idle modes • Supply voltage: 2.5 to 5.5 V • Clock frequency: 1 to 16 MHz • Operating temperature: −40 to +85 °C. 3 ORDERING INFORMATION (see note 1) PACKAGE TYPE NUMBER NAME PCF84C12AP DESCRIPTION VERSION DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 PCF84C22AP PCF84C42AP PCF84C12AT PCF84C22AT PCF84C42AT Note 1. Please refer to the Order Entry Form (OEF) for these devices for the full type number to use when ordering. This type number will also specify the required program and ROM mask options. 1996 Nov 20 3 1996 Nov 20 INTERRUPT LOGIC 4 IDLE STOP INITIALIZE RESET XTAL 2 OSCILLATOR XTAL 1 CONTROL & TIMING DECIMAL ADJUST (8) ARITHMETIC LOGIC UNIT 8 8 5 CONDITIONAL BRANCH LOGIC INSTRUCTION REGISTER & DECODER 8 LOWER PROGRAM COUNTER HIGHER PROGRAM COUNTER 8 8 ACC BIT TEST ACC CARRY TIMER FLAG TEST 1 INT / T0 RAM ADDRESS REGISTER 8 PROGRAM STATUS WORD Fig.1 Block diagram of PCF84C12A, PCF84C22A and PCF84C42A. INTERRUPT INT / T0 8 TEMPORARY REGISTER 2 5 MEMORY BANK FLIP-FLOPS DATA STORE OPTIONAL SECOND REGISTER BANK 8 LEVEL STACK (VARIABLE LENGTH) REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 MBC951 RESIDENT RAM ARRAY 64 bytes D E C O D E 8 8 MULTIPLEXER PORT 0 FLIP-FLOPS PORT 0 BUFFER P0.7 to P0.0 8-bit microcontrollers external interrupt timer interrupt TEST 1 TEMPORARY REGISTER 1 TIMER/ EVENT COUNTER ACCUMULATOR 8 32 INTERNAL CLOCK FREQ. 30 PORT 1 FLIP-FLOPS PORT 1 BUFFER 3 RESIDENT ROM 1 kbyte (PCF84C12A) 2 kbytes (PCF84C22A) 4 kbytes (PCF84C42A) DECODE 4 handbook, full pagewidth P1.0 to P1.4 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A BLOCK DIAGRAM Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 5 5.1 PINNING INFORMATION 5.2 Pinning Pin description Table 1 P0.0 1 20 V DD P0.1 2 19 P1.4 P0.2 3 18 P1.3 P0.3 4 17 P1.2 P0.4 5 P1.1 P0.5 6 PCF84C12A 16 PCF84C22A PCF84C42A 15 P0.6 7 14 RESET P0.7 8 13 XTAL2 INT/T0 9 12 XTAL1 VSS 10 11 T1 DIP20 and SO20 packages SYMBOL PIN TYPE P0.0 to P0.7 1 to 8 I/O 9 I Interrupt/Test 0 VSS 10 P ground T1 11 I Test 1/count input of 8-bit timer/event counter 1 XTAL1 12 I crystal oscillator input or external clock input XTAL2 13 O crystal oscillator output RESET P1.0 to P1.4 14 I 15 to 19 I/O 20 P Fig.2 Pin configuration. VDD 6 INSTRUCTION SET Since the I2C-bus interface, Port 2 and derivative logic are not provided, instructions associated with these functions are not available. ROM space is restricted to 1 kbyte for the PCF84C12A, 2 kbytes for the PCF84C22A and 4 kbytes for the PCF84C42A. Therefore, the instructions SEL MB1/2/3 for the PCF84C12A and PCF84C22A, and the instructions SEL MB2/3 for PCF84C42A should be avoided as they would define non-existing program memory banks. As RAM space is limited to 64 bytes, care should be taken to avoid accesses to non-existing RAM locations. Refer to the “PCF84CxxxA family” data sheet, for a complete description of the instruction set. 1996 Nov 20 5 8 bits of Port 0: 8-bit quasi-bidirectional I/O port INT/T0 P1.0 MBC952 DESCRIPTION Reset input 4 bits of Port 1: 4-bit quasi-bidirectional I/O port positive supply Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 7 ROM MASK OPTIONS ROM CODE OPTION Program/data Any mix of instructions and data up to ROM size of 1 kbyte for the PCF84C12A, 2 kbytes for the PCF84C22A and 4 kbytes for the PCF84C42A. Port Output P0.0 to P0.7 standard open-drain push-pull P1.0 to P1.4 standard open-drain push-pull P0.0 to P0.7 set reset − P1.0 to P1.4 set reset − LOW (gmL) MEDIUM (gmM) HIGH (gmH) Port State after reset Oscillator Transconductance 8 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See “Data Handbook IC14, Section: Handling MOS devices”. 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage −0.5 +7 V VI all input voltages −0.5 VDD + 0.5 V II DC input current −10 +10 mA IO DC output current except Port 1 output LOW −10 +10 mA Ptot total power dissipation − 125 mW PO power dissipation per output − 30 mW IDD supply current −50 +50 mA ISS ground supply current −100 +50 mA Tstg storage temperature range −55 +150 °C Tj operating junction temperature − 90 °C 1996 Nov 20 6 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 10 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS V VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.3 0.6 mA VDD = 5 V; fxtal = 10 MHz (gmL) − 1.1 3.0 mA VDD = 5 V; fxtal = 16 MHz (gmM) − 1.7 5.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) − 2.5 6.0 mA VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.2 0.4 mA VDD = 5 V; fxtal = 10 MHz (gmL) − 0.8 1.6 mA VDD = 5 V; fxtal = 16 MHz (gmM) − 1.2 4.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) − 1.7 5.0 mA − 1.2 10 µA − IDD operating supply current note 1; see Figs 4 and 5 supply current (Stop mode) UNIT 5.5 see Fig.3 IDD(stp) MAX. − operating supply voltage supply current (Idle mode) TYP. 2.5 VDD IDD(idle) MIN. note 1; see Figs 6 and 7 VDD = 2.5 V; notes 1 and 2; see Fig.8 Inputs VIL LOW level input voltage 0 VIH HIGH level input voltage 0.7VDD − VDD 0.3VDD V V ILI input leakage VSS ≤ VI ≤ VDD −1 − +1 µA IOL LOW level output sink current VDD = 5 V; VO = 0.4 V; see Fig.9 1.6 12 − mA IOH HIGH level pull-up output source current VDD = 5 V; VO = 3.5 V; see Fig.10 40 100 − µA VDD = 5 V; VO = 0 V; see Fig.10 − −140 −400 µA HIGH level push-pull output source current VDD = 5 V; VO = 4.6 V; see Fig.11 −1.6 −7 − mA Outputs IOH1 Oscillator (see Fig.12) gmL LOW transconductance VDD = 5 V 0.2 0.4 1.0 mS gmM MEDIUM transconductance VDD = 5 V 0.9 1.6 3.2 mS gmH HIGH transconductance VDD = 5 V 3.0 4.5 9.0 mS RF feedback resistor 0.3 1.0 3.0 MΩ Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 °C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open. 1996 Nov 20 7 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers MBC953 - 1 MBC955 3 18 handbook, halfpage I DD (mA) f xtal (MHz) 2 12 16 MHz 10 MHz guaranteed operating range 6 3.58 MHz 1 0 0 1 3 5 V DD (V) 1 7 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.3 Maximum clock frequency as a function of operating supply voltage (VDD). Fig.4 Typical operating supply current (IDD) as a function of operating supply voltage (VDD). MBC956 3 MBC957 3 handbook, halfpage I DD (mA) IDD(idle) (mA) 2 2 5V 16 MHz 1 1 10 MHz 3V 0 0.1 1 3.58 MHz 0 100 10 1 3 5 7 V DD (V) fxtal(MHz) Supply current based on optimal oscillator selection. Supply current based on optimal oscillator selection. Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal). 1996 Nov 20 8 Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD). Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers MBC958 3 MBC954 3 handbook, halfpage handbook, halfpage IDD(idle) (mA) IDD(stp) 2 2 (µA) o 85 C o 5V 1 25 C 1 3V 0 0.1 1 0 100 10 1 fxtal(MHz) 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.8 Fig.7 Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD). Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal). MBC959 16 MBC960 300 I OL (mA) I OH (µA) 200 12 VO = VSS VO = 0.7 V DD 100 8 4 0 1 3 5 V DD (V) 7 1 3 5 V DD (V) 7 VO = 0.4 V. Fig.9 Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD). 1996 Nov 20 Fig.10 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD). 9 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers MBC961 12 MBC962 6 handbook, halfpage handbook, halfpage g mH gm I OH1 (mA) (mS) 8 4 4 2 0 0 g mM g mL 3 1 5 V DD (V) 1 7 3 5 V DD (V) 7 VO = VDD − 0.4 V. Fig.11 Typical HIGH level push-pull output source current (IOH1) as a function of operating supply voltage (VDD). Fig.12 Typical transconductance values (gm) as a function of operating supply voltage (VDD) for the options gvmL, gmM and gmH. 11 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT tr rise time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns tf fall time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns fxtal clock frequency see Fig.3 1 − 16 MHz 1996 Nov 20 10 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 12 PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D (1) e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1996 Nov 20 REFERENCES IEC JEDEC EIAJ SC603 11 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1996 Nov 20 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-24 12 o 8 0o Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. 13 SOLDERING 13.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 13.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). 13.2 13.2.1 Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 13.3 13.3.1 13.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Nov 20 WAVE SOLDERING 13 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers 14 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Nov 20 14 Philips Semiconductors Product specification PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers NOTES 1996 Nov 20 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 457021/1200/04/pp16 Date of release: 1996 Nov 20 Document order number: 9397 750 01086