INTEGRATED CIRCUITS DATA SHEET TDA1023/T Proportional-control triac triggering circuit Product specification Supersedes data of August 1982 File under Integrated Circuits, IC02 May 1991 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T FEATURES APPLICATIONS • Adjustable width of proportional range • Panel heaters • Adjustable hysteresis • Temperature control • Adjustable width of trigger pulse • Adjustable repetition timing of firing burst GENERAL DESCRIPTION • Control range translation facility The TDA1023 is a bipolar integrated circuit for controlling triacs in a proportional time or burst firing mode. Permitting precise temperature control of heating equipment it is especially suited to the control of panel heaters. It generates positive-going trigger pulses but complies with regulations regarding mains waveform distortion and RF interference. • Fail safe operation • Supplied from the mains • Provides supply for external temperature bridge QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC supply voltage (derived from mains voltage) − 13.7 − V VZ stabilized supply voltage for temperature bridge − 8 − V I16(AV) supply current (average value) − 10 − mA tw trigger pulse width − 200 − µs Tb firing burst repetition time at CT = 68 µF − 41 − s -IOH(1) output current − − 150 mA Tamb operating ambient temperature range −20 − +75 °C Note 1. Negative current is defined as conventional current flow out of a device. A negative output current is suited for positive triac triggering. ORDERING INFORMATION EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE TDA1023 16 DIL plastic SOT38(1) TDA1023T 16 mini-pack plastic SO16; SOT109A(2) Note 1. TDA1023: 16 DIL; plastic (SOT38); SOT38-1; 1996 November 27. 2. TDA1023T: 16 mini-pack; plastic (SO16; SOT109A); SOT109-1; 1996 November 27. May 1991 2 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T Fig.1 Block diagram. PINNING SYMBOL Rpd 1 DESCRIPTION internal pull-down resistor n.c. 2 not connected Rpd 1 16 RX Q 3 output n.c. 2 15 n.c. HYS 4 hysteresis control input PR 5 proportional range control input CI 6 control input UR 7 unbuffered reference input handbook, halfpage Q 3 14 VCC HYS 4 TDA1023 13 VEE PR 5 12 TB QR 8 output of reference buffer CI 6 11 VZ BR 9 buffered reference input UR 7 10 PW PW 10 pulse width control input QR 8 9 BR VZ 11 reference supply output TB 12 firing burst repetition time control input VEE 13 ground VCC 14 positive supply MBA484 Fig.2 Pin configuration. May 1991 PIN 3 n.c. 15 not connected RX 16 external resistor connection Philips Semiconductors Product specification Proportional-control triac triggering circuit FUNCTIONAL DESCRIPTION Control and reference inputs CI, BR and UR (pins 6, 9 and 7) The TDA1023 generates pulses to trigger a triac. These pulses coincide with the zero excursions of the mains voltage, thus minimizing RF interference and mains supply transients. In order to gate the load on and off, the trigger pulses occur in bursts thus further reducing mains supply pollution. The average power in the load is varied by modifying the duration of the trigger pulse burst in accordance with the voltage difference between the control input CI and the reference input, either UR or BR. For the control of room temperature (5 °C to 30 °C) optimum performance is obtained by using the translation circuit. The buffered reference input BR (pin 9) is used as a reference input whilst the output reference buffer QR (pin 8) is connected to the unbuffered reference input UR (pin 7). This ensures that the range of room temperature is encompassed in most of the rotation of the potentiometer to give a linear temperature scale with accurate setting. Should the translation circuit not be required, the unbuffered reference input UR (pin 7) is used as a reference input. The buffered reference input BR (pin 9) must then be connected to the reference supply output VZ (pin 11). Power supply: VCC, RX and Vz (pins 14, 16 and 11) The TDA1023 is supplied from the AC mains via a resistor RD to the RX connection (pin 16); the VEE connection (pin 13) is linked to the neutral line (see Fig.4a). A smoothing capacitor CS should be coupled between the VCC and VEE connections. For proportional power control the unbuffered reference input UR (pin 7) must be connected to the firing burst repetition time control input TB (pin 12).The buffered reference input BR (pin 9), which is in this instance inactive, must then be connected to the reference supply output VZ (pin 11). A rectifier diode is included between the RX and VCC connections whilst the DC supply voltage is limited by a chain of stabilizer diodes between the RX and VEE connections (see Fig.3). A stabilized reference voltage (VZ) is available at pin 11 to power an external temperature sensing bridge. Proportional range control input PR (pin 5) The output duty factor changes from 0% to 100% by a variation of 80 mV at the control input CI (pin 6) with the proportional range control input PR open. For temperature control this corresponds to a temperature difference of 1 K. Supply operation During the positive mains half-cycles the current through the external voltage dropping resistor RD charges the external smoothing capacitor CS until RX attains the stabilizing potential of the internal stabilizing diodes. RD should be selected to be capable of supplying the current ICC for the TDA1023, the average output current I3(AV), recharge the smoothing capacitor CS and provide the supply for an external temperature bridge. (see Figs 9 to 12). Any excess current is by-passed by the internal stabilizer diodes. The maximum rated supply current, however, must not be exceeded. By connecting the proportional range control input PR (pin 5) to ground the range may be increased to 400 mV, i.e. 5 K. Intermediate values may be obtained by connecting the PR input to ground via a resistor R5 (see Table 1). Hysteresis control input HYS (pin 4) With the hysteresis control input HYS (pin 4) open, the device has a built-in hysteresis of 20 mV. For temperature control this corresponds with 0.25 K. During the negative mains half-cycles external smoothing capacitor CS supplies the sum of the current demand described above. Its capacitance must be sufficiently high to maintain the supply voltage above the specified minimum. Hysteresis is increased to 320 mV, corresponding to 4 K, by grounding HYS (pin 4). Intermediate values are obtained by connecting pin 4 via resistor R4 to ground. Table 1 provides a set of values for R4 and R5 giving a fixed ratio between hysteresis and proportional range. Dissipation in resistor RD is halved by connecting a diode in series (see Fig.4b and 9 to 12). A further reduction in dissipation is possible by using a high quality dropping capacitor CD in series with a resistor RSD (see Figs 4c and 14). Protection of the TDA1023 and the triac against mains-borne transients can be provided by connecting a suitable VDR across the mains input. May 1991 TDA1023/T 4 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T Trigger pulse width control input PW (pin 10) The width of the trigger pulse may be adjusted to the value required for the triac by choosing the value of the external synchronization resistor RS between the trigger pulse width control input PW (pin 10) and the AC mains. The pulse width is inversely proportional to the input current (see Fig.13). Output Q (pin 3) Since the circuit has an open-emitter output it is capable of sourcing current. It is thus suited for generating positive-going trigger pulses. The output is current-limited and short-circuit protected. The maximum output current is 150 mA and the output pulses are stabilized at 10 V for output currents up to that value. To minimize the total supply current and power dissipation, a gate resistor RG must be connected between the output Q and the triac gate to limit the output current to the minimum required by the triac (see Figs 5 to 8). Pull-down resistor Rpd (pin 1) The TDA1023 includes a 1.75 kΩ pull-down resistor Rpd between pins 1 and 13 (VEE, ground connection) intended for use with sensitive triacs. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER MIN. MAX. UNIT DC supply voltage − 16 V I16(AV) average − 30 mA I16(RM) repetitive peak − 100 mA VCC Supply current I16(SM) non-repetitive peak (tp < 50 µs) − 2 A VI input voltage, all inputs − 16 V I6, 7, 9, 10 input current − 10 mA V1 voltage on Rpd connection − 16 V V3, 8, 11 output voltage, Q, QR, VZ − 16 V -IOH(AV) average − 30 mA -IOH(M) peak max. 300 µs − 700 mA Ptot total power dissipation − 500 mW Tstg storage temperature range −55 +150 °C Tamb operating ambient temperature range −20 +75 °C Output current May 1991 5 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T CHARACTERISTICS VCC = 11 to 16 V; Tamb = −20 to +75 °C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 12 13.7 15 V Supply VCC internally stabilized supply voltage at I16 = 10 mA ∆VCC/∆I16 variation with I16 I16 supply current at V16-13 = 11 to 16 V; I10 = 1mA; f = 50 Hz; pin 11 open; V6-13 > V7-13 − 30 − mV/mA pins 4 and 5 open − − 6 mA pins 4 and 5 grounded − − 7.1 mA Reference supply output VZ (pin 11) for external temperature bridge V11-13 output voltage − 8 − V −I11 output current − − 1 mA − 7.6 − V V1 = 4 V − − 2 µA Control and reference inputs CI, BR and UR (pins 6, 9 and 7) V6-13 input voltage to inhibit the output I6, 7, 9 input current Hysteresis control input HYS (pin 4) ∆V6 hysteresis pin 4 open 9 20 40 mV ∆V6 hysteresis pin 4 grounded − 320 − mV Proportional control range input PR (pin 5) ∆V6 proportional range pin 5 open 50 80 130 mV ∆V6 proportional range pin 5 grounded − 400 − mV I10(RMS) = 1mA; f = 50 Hz 100 200 300 µs 320 600 960 ms/µF Pulse width control input PW (pin 10) tw pulse width Firing burst repetition time control input TB (pin 12) TbCT firing burst repetition time, ratio to capacitor CT Output of reference buffer QR (pin 8) output voltage at input voltage: V8-13 V9-13 = 1.6 V − 3.2 − V V8-13 V9-13 = 4.8 V − 4.8 − V V8-13 V9-13 = 8 V − 6.4 − V −IOH = 150 mA 10 − − V − − 150 mA 1 1.75 3 kΩ Output Q (pin 3) VOH output voltage HIGH −IOH output current HIGH Internal pull-down resistor Rpd (pin 1) Rpd May 1991 resistance to VEE 6 Philips Semiconductors Product specification Proportional-control triac triggering circuit Table 1 TDA1023/T Adjustment of proportional range and hysteresis. Combinations of resistor values giving hysteresis > 1⁄4 proportional range. Proportional range Proportional range resistor Minimum hysteresis Maximum hysteresis resistor R5 R4 mV kΩ mV kΩ 80 open 20 open 160 3.3 40 9.1 240 1.1 60 4.3 320 0.43 80 2.7 400 0 100 1.8 Table 2 Timing capacitor values CT Effective DC value Catalogue number(1) Marked AC specification µF µF V 68 47 25 2222 016 90129 47 33 40 - - 90131 33 22 25 - 015 90102 22 15 40 - - 90101 15 10 25 - - 90099 10 6.8 40 - - 90098 Note 1. Special electrolytic capacitors recommended for use with the TDA1023. handbook, halfpage RX 16 14 STABILIZER 13 VEE VCC 11 V Z MBA483 Fig.3 Internal supply connections. May 1991 7 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T handbook, full pagewidth load (heater) RSD VCC RX –U 16 14 CS 3 TDA1023 Q RG 13 V EE AC mains voltage VS MBA470 a. handbook, full pagewidth D1 load (heater) RD VCC 14 CS RX 16 –U 3 TDA1023 Q RG 13 V EE AC mains voltage VS MBA482 b. handbook, full pagewidth RSD CD load (heater) BAW62 D2 BAW62 D1 VCC 14 CS RX 16 TDA1023 3 –U AC mains voltage VS RG Q 13 VEE MBA469 c. Fig.4 Alternative supply arrangements. May 1991 8 Philips Semiconductors Product specification Proportional-control triac triggering circuit Fig.5 VS = 110 V, 50 Hz. May 1991 TDA1023/T Fig.6 VS = 220 V, 50 Hz. 9 Philips Semiconductors Product specification Proportional-control triac triggering circuit Fig.7 VS = 240 V, 50Hz. May 1991 TDA1023/T Fig.8 VS = 380 V, 50 Hz. 10 Philips Semiconductors Product specification Proportional-control triac triggering circuit Fig.9 VS = 110 V. May 1991 TDA1023/T Fig.10 VS = 220 V. 11 Philips Semiconductors Product specification Proportional-control triac triggering circuit Fig.11 VS = 240 V. May 1991 TDA1023/T Fig.12 VS = 380 V. 12 Philips Semiconductors Product specification Proportional-control triac triggering circuit Fig.14 Nominal value of voltage dropping capacitor CD and power PRSD dissipated in a voltage dropping resistor RSD as a function of average supply current I16 (AV) with the mains supply voltage VS as a parameter. Fig.13 Synchronization resistor Rs as a function of required trigger pulse width tw with a mains voltage Vs as a parameter. May 1991 TDA1023/T 13 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T handbook, full pagewidth D1 load (heater) RD VCC VZ R1 CI CS –θ BR C1 R NTC 11 6 9 14 RX 16 line RS triac PW 10 3 Q TDA1023 13 8 7 4 5 12 VEE QR UR HYS PR TB Rp 1 R pd RG –U AC mains voltage VS neutral CT MBA513 Conditions:- Mains supply; VS = 220 V; Temperature range = 5 to 30 °C. BT139 data at Tj = 25 °C; Vgt < 1.5 V; Igt > 70 mA; IL < 60 mA Fig.15 The TDA1023/T used in a 1200 to 2000 W heater with triac BT139. For component values see Table 3. May 1991 14 Philips Semiconductors Product specification Proportional-control triac triggering circuit Table 3 TDA1023/T Temperature controller component values (see Fig.15). Notes 1, 2 SYMBOL PARAMETER REMARKS VALUE tw trigger pulse width see BT139 data sheet 75 µs RS synchronization resistor see Fig.13 180 kΩ RG gate resistor see Fig.6 110 Ω I3(AV) max. average gate current see Fig.8 4.1 mA R4 hysteresis resistor see Table 1 n.c. R5 proportional band resistor see Table 1 n.c. I16(AV) min. required supply current RD mains dropping resistor see Fig.10 6.2 kΩ PRD power dissipated in RD see Fig.10 4.6 W CT timing capacitor (eff. value) see Table 2 68 µF VDR voltage dependent resistor cat. no. 2322 593 62512 250 V AC D1 rectifier diode R1 resistor to pin 11 1% tolerance 18.7 kΩ RNTC NTC thermistor (at 25 °C) B = 4200 K cat no. 2322 642 12223 22 kΩ Rp potentiometer 22 kΩ C1 capacitor between pins 6 and 9 47 nF CS smoothing capacitor 220 µF; 16 V 11.1 mA BYW56 If RD and D1 are replaced by CD and RSD CD mains dropping capacitor 470 nF 390 Ω RSD series dropping resistor PRSD power dissipated in RSD see Fig.14 0.6 W VDR voltage dependent resistor cat. no. 2322 594 62512 250 V AC Notes 1. ON/OFF control: pin 12 connected to pin 13. 2. If translation circuit is not required: slider of Rp to pin 7; pin 8 open; pin 9 connected to pin 11. May 1991 15 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE May 1991 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 16 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.244 0.050 0.041 0.228 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC May 1991 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 17 o 8 0o Philips Semiconductors Product specification Proportional-control triac triggering circuit Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. May 1991 TDA1023/T 18 Philips Semiconductors Product specification Proportional-control triac triggering circuit TDA1023/T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1991 19