RB751 series Schottky barrier single diodes Rev. 01 — 21 May 2007 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier single diodes with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package NXP JEITA Package configuration RB751CS40 SOD882 - leadless ultra small RB751S40 SOD523 SC-79 ultra small RB751V40 SOD323 SC-76 very small 1.2 Features n Low forward voltage n Low capacitance 1.3 Applications n n n n Ultra high-speed switching Voltage clamping Line termination Reverse polarity protection 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter IF Min Typ Max Unit forward current - - 120 mA VRRM repetitive peak reverse voltage - - 40 V VF forward voltage - - 370 mV [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Conditions IF = 1 mA [1] RB751 series NXP Semiconductors Schottky barrier single diodes 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol SOD882 1 cathode 2 anode [1] 1 1 2 2 sym001 Transparent top view SOD323; SOD523 1 cathode 2 anode [1] 1 1 2 2 sym001 001aab540 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Type number Package Name Description Version RB751CS40 - leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm SOD882 RB751S40 SC-79 plastic surface-mounted package; 2 leads SOD523 RB751V40 SC-76 plastic surface-mounted package; 2 leads SOD323 4. Marking Table 5. Marking codes Type number Marking code RB751CS40 F6 RB751S40 G4 RB751V40 W8 RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 2 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VRRM Conditions Min Max Unit repetitive peak reverse voltage - 40 V VR reverse voltage - 40 V IF forward current - 120 mA IFSM non-repetitive peak forward current square wave; tp < 10 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C [1] RB751CS40 [2] - 250 mW RB751S40 [2] - 280 mW - 280 mW Tj junction temperature RB751V40 - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit [1] RB751CS40 [2] - - 500 K/W RB751S40 [2] - - 450 K/W - - 450 K/W RB751V40 [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Typ Max Unit VF forward voltage IF = 1 mA - - 370 mV IR reverse current VR = 30 V - - 0.5 µA Cd diode capacitance VR = 1 V; f = 1 MHz - 2 - pF [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. RB751_SER_1 Product data sheet Min [1] © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 3 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes mlc361 102 mlc362 103 IR (µA) IF (mA) (1) 102 10 10 (1) (2) (3) (4) (2) 1 1 10−1 10−1 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 10−2 1 10 0 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C 20 30 VR (V) 40 (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values mlc363 5 Cd (pF) 4 3 2 1 0 0 10 20 30 VR (V) 40 f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 4 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 8. Package outline 0.85 0.75 0.50 0.46 0.62 0.55 0.65 0.58 1 2 0.30 0.22 0.30 0.22 1.65 1.25 1.55 1.15 1.02 0.95 0.65 1 2 0.55 0.47 cathode marking on top side Dimensions in mm 0.34 0.26 03-04-17 Fig 4. Package outline SOD882 0.17 0.11 Dimensions in mm 02-12-13 Fig 5. Package outline SOD523 (SC-79) 1.35 1.15 1.1 0.8 0.45 0.15 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Fig 6. Package outline SOD323 (SC-76) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 3000 8000 10000 RB751CS40 SOD882 2 mm pitch, 8 mm tape and reel - - -315 RB751S40 SOD523 2 mm pitch, 8 mm tape and reel - -315 - 4 mm pitch, 8 mm tape and reel -115 - -135 RB751V40 SOD323 4 mm pitch, 8 mm tape and reel -115 - -135 [1] For further information and the availability of packing methods, see Section 13. RB751_SER_1 Product data sheet Packing quantity © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 5 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 10. Soldering 1.30 R = 0.05 (8×) 0.30 R = 0.05 (8×) 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist 0.30 (2×) 0.40 (2×) 0.50 (2×) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD882 2.15 0.50 0.60 1.20 solder lands solder paste 0.30 0.40 solder resist occupied area 1.80 1.90 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD523 (SC-79) RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 6 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 9. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 10. Wave soldering footprint SOD323 (SC-76) RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 7 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes RB751_SER_1 20070521 Product data sheet - - RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 8 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] RB751_SER_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 21 May 2007 9 of 10 RB751 series NXP Semiconductors Schottky barrier single diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Packing information. . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 21 May 2007 Document identifier: RB751_SER_1