PHILIPS TDA1552Q

INTEGRATED CIRCUITS
DATA SHEET
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier
Product specification
File under Integrated Circuits, IC01
July 1994
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
GENERAL DESCRIPTION
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package.
The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for
car radio applications.
Features
• Requires very few external components
• Thermally protected
• High output power
• Reverse polarity safe
• Low offset voltage at outputs
• Capability to handle high energy on outputs (VP = 0 V)
• Fixed gain
• Protected against electrostatic discharge
• Good ripple rejection
• No switch-on/switch-off plop
• Mute/stand-by switch
• Low thermal resistance
• Load dump protection
• Flexible leads.
• AC and DC short-circuit-safe to ground and VP
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
operating
VP
6.0
14.4
18.0
V
non-operating
VP
−
−
30
V
load dump protected
VP
−
−
45
V
IORM
−
−
4
A
Total quiescent current
Itot
−
80
160
mA
Stand-by current
Isb
−
0.1
100
µA
Switch-on current
Isw
−
−
60
µA
Input impedance
|ZI|
50
60
75
kΩ
Junction temperature
Tj
−
−
150
°C
20
22
−
W
RR
48
−
−
dB
DC output offset voltage
|∆VO|
−
−
150
mV
Channel separation
α
40
−
−
dB
Channel unbalance
|∆Gv|
−
−
1
dB
Repetitive peak output
current
Stereo application
Output power
RL = 4 Ω; THD = 10% Po
Supply voltage ripple
rejection
RS = 0 Ω
f = 100 Hz to 10 kHz
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
July 1994
2
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
V P1
handbook, full pagewidth
3
input 1
1
mute switch
V P2
10
Cm
4
VA
output 1A
2
kΩ
18 kΩ
power stage
mute switch
Cm
6
VA
60
kΩ
output 1B
2
kΩ
18 kΩ
power stage
VP
11
stand-by
switch
12
stand-by
reference
voltage
VA
mute/stand-by
not connected
15 kΩ
x1
mute
switch
TDA1552Q
15 kΩ
V ref
input 2
13
mute switch
Cm
9
VA
output 2B
2
kΩ
18 kΩ
power stage
mute switch
Cm
7
VA
60
kΩ
2
kΩ
Vref
18 kΩ
2
power stage
5
8
GND1
GND2
ground (signal)
power ground (substrate)
Fig.1 Block diagram.
July 1994
3
MLB952
output 2A
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PINNING
1
IP1
input 1
8
GND2
power ground 2 (substrate)
2
GND
ground (signal)
9
OUT2B
output 2B
3
VP1
positive supply voltage 1
10
VP2
positive supply voltage 2
4
OUT1A
output 1A
11
M/SS
mute/stand-by switch
5
GND1
power ground 1 (substrate)
12
n.c.
not connected
6
OUT1B
output 1B
13
IP2
input 2
7
OUT2A
output 2A
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply switch)
• mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
VP
−
18
V
non-operating
VP
−
30
V
load dump protected
during 50 ms;
VP
−
45
V
Non-repetitive peak output current
tr ≥ 2.5 ms
IOSM
−
6
A
Repetitive peak output current
IORM
−
4
A
Storage temperature range
Tstg
−55
+150
°C
Junction temperature
Tj
−
150
°C
AC and DC short-circuit-safe voltage
VPSC
−
18
V
−
200
mJ
VPR
−
6
V
Ptot
−
60
W
Energy handling capability at outputs
VP = 0 V
Reverse polarity
Total power dissipation
July 1994
see Fig.2
4
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
Fig.2 Power derating curve.
July 1994
5
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
note 1
VP
6.0
14.4
18.0
V
Itot
−
80
160
mA
VO
−
6.9
−
V
|∆VO|
−
−
150
mV
Switch-on voltage level
VON
8.5
−
−
V
Mute condition
Vmute
3.3
−
6.4
V
VO
−
−
2
mV
Total quiescent current
DC output voltage
note 2
DC output offset voltage
Mute/stand-by switch
Output signal in mute
position
VI = 1 V (max);
f = 1 kHz
DC output offset voltage
|∆VO|
−
−
150
mV
Vsb
0
−
2
V
VII < 0.5 V
Isb
−
−
100
µA
0.5 V ≤ VII < 2 V
Isb
−
−
500
µA
Isw
−
25
60
µA
IP
−
5.5
−
mA
(between pins 4 to 6 and 7 to 9)
Stand-by condition
DC current in
stand-by condition
Switch-on current
Supply current
short-circuit
to GND
note 3
July 1994
6
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Po
15
17
−
W
THD = 10%
Po
20
22
−
W
THD = 0.5%
Po
−
12
−
W
THD = 10%
Po
−
17
-
W
Total harmonic distortion
Po = 1 W
THD
−
0.1
−
%
Power bandwidth
THD = 0.5%
Bw
-
20 to
−
Hz
Hz
Output power
THD = 0.5%
Output power at VP = 13.2 V
Po = −1 dB
w.r.t. 15 W
15000
Low frequency roll-off
note 4
−1 dB
fL
−
25
−
fH
20
−
−
kHz
Gv
25
26
27
dB
notes 5, 6
RR
42
−
−
dB
ON
notes 5, 7
RR
48
−
−
dB
mute
notes 5, 6, 7
RR
48
−
−
dB
stand-by
notes 5, 6, 7
RR
80
−
−
dB
|Zi|
50
60
75
kΩ
High frequency roll-off
−1 dB
Closed loop voltage gain
Supply voltage ripple rejection
Input impedance
Noise output voltage
(RMS value)
ON
RS = 0 Ω; note 8
Vno(rms)
-
70
120
µV
ON
RS = 10 kΩ; note 8 Vno(rms)
−
100
−
µV
mute
notes 8, 9
Vno(rms)
−
60
−
µA
Channel separation
α
40
−
−
dB
Channel unbalance
|∆Gv|
-
−
1
dB
Notes to the characteristics
1. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.
2. At 18 V < VP < 30 V the DC output voltage ≤ VP/2.
3. Conditions:
a) V11 = 0 V
b) short-circuit to GND
c) switch V11 to MUTE or ON condition (rise time ≥ 10 µs).
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of RS (VI = 0 V).
July 1994
7
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
APPLICATION INFORMATION
handbook, full pagewidth
mute/stand-by switch
VP
not connected
12
220 nF
input 1
11
3
14.4 V
100
nF
10
2200
µF
1
4
R =4Ω
L
60
kΩ
6
ground (signal)
2
TDA1552Q
reference
voltage
220 nF
input 2
13
9
R =4Ω
L
60
kΩ
7
5
8
MLB951
power ground (substrate)
Fig.3 Application circuit diagram.
July 1994
8
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
L
Q
c
1
13
e1
Z
e
bp
e2
m
w M
0
5
v M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
e1
e2
Eh
j
L
L3
m
Q
v
w
x
Z (1)
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
3.4
1.7
5.08
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-03-11
SOT141-6
July 1994
EUROPEAN
PROJECTION
9
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
10