PHILIPS PCF84C81

INTEGRATED CIRCUITS
DATA SHEET
PCF84C81A
Telecom microcontroller
Product specification
Supersedes data of 1996 Nov 20
File under Integrated Circuits, IC14
1998 Apr 20
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
INSTRUCTION SET
7
HIGH SINK OUTPUT CURRENTS
8
ROM MASK OPTIONS
9
HANDLING
10
LIMITING VALUES
11
DC CHARACTERISTICS
12
AC CHARACTERISTICS
13
PACKAGE OUTLINES
14
SOLDERING
14.1
14.2
14.2.1
14.2.2
14.3
14.3.1
14.3.2
14.3.3
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO
Reflow soldering
Wave soldering
Repairing soldered joints
15
DEFINITIONS
16
LIFE SUPPORT APPLICATIONS
17
PURCHASE OF PHILIPS I2C COMPONENTS
1998 Apr 20
2
Philips Semiconductors
Product specification
Telecom microcontroller
1
PCF84C81A
FEATURES
• Manufactured in silicon gate CMOS process
• 8-bit CPU, ROM, RAM, I/O in a 28-lead package
• 8 kbyte ROM, 256 byte RAM (PCF84C81A)
• I2C-bus interface with multi-master capability
• Over 100 instructions (based on MAB8048) all of
1 or 2 cycles
2
This data sheet details the specific properties of the
PCF84C81A. The shared properties of the PCF84CxxxA
family of microcontrollers are described in the
“PCF84CxxxA family” data sheet which should be read in
conjunction with this publication.
• 20 quasi-bidirectional I/O Port lines
• High sink current capability on the 8 lines of Port 1
• 8-bit programmable timer/event counter 1
• 3 single-level vectored interrupts:
The PCF84C81A is a general purpose CMOS
microcontroller with 8 kbytes of program memory and
256 bytes of RAM. In addition to 20 I/O port lines, the
microcontrollers provide an on-chip I2C-bus interface. This
two-line serial bus extends the microcontroller capabilities
when implemented with the powerful I2C-bus peripherals.
These include LCD drivers, I/O expanders, telecom
circuits, ADC and DAC converters, clock/calendar circuits,
EEPROM and RAM and are listed in “Data Handbook
IC12, I2C Peripherals”.
– external
– 8-bit programmable timer/event counter 1
– I2C-bus
• Two test inputs, one of which also serves as the external
interrupt input
• Stop and Idle modes
• Supply voltage: 2.5 to 5.5 V
• Clock frequency: 1 to 16 MHz
• Operating temperature: −40 to +85 °C.
3
GENERAL DESCRIPTION
The instruction set is based on that of the MAB8048 and
is a sub-set of that listed in the “PCF84CxxxA family” data
sheet.
ORDERING INFORMATION (see note 1)
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF84C81AP
DIP28
plastic dual in-line package; 28 leads (600 mil)
SOT117-1
PCF84C81AT
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
Note
1. Please refer to the Order Entry Form (OEF) for the full type number to use when ordering. This type number will also
specify the required program and the ROM mask options.
1998 Apr 20
3
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8
PORT 2
BUFFER
PORT 2
FLIP-FLOPS
RESIDENT ROM
2 kbytes
(PCF84C21A)
4 kbytes
(PCF84C41A)
8 kbytes
(PCF84C81A)
DECODE
PORT 1
BUFFER
PORT 1
FLIP-FLOPS
INTERNAL
CLOCK
FREQ.
30
4
8
8
8
8
ACCUMULATOR
TEMPORARY
REGISTER 2
8
PORT 0
FLIP-FLOPS
HIGHER
PROGRAM
COUNTER
LOWER
PROGRAM
COUNTER
5
8
PROGRAM
STATUS
WORD
8
8
8
8
8
8
MULTIPLEXER
TEMPORARY
REGISTER 1
RAM
ADDRESS
REGISTER
timer interrupt
SIO/
derivative
interrupt
ARITHMETIC
LOGIC UNIT
INSTRUCTION
REGISTER
&
DECODER
INT / T0
T1
external interrupt
CONDITIONAL
BRANCH
LOGIC
DECIMAL
ADJUST
INT / T0
INTERRUPT
INITIALIZE
8 LEVEL STACK
(VARIABLE LENGTH)
OPTIONAL SECOND
REGISTER BANK
TIMER
FLAG
CARRY
DATA STORE
ACC
XTAL 2
OSCILLATOR
ACC BIT
TEST
Fig.1 Block diagram.
Fig.1 Block diagram of PCF84C21A;
PCF84C41A and PCF84C81A.
RESIDENT RAM ARRAY
MBB561
Product specification
IDLE
CONTROL &
TIMING
RESET
XTAL 1
D
E
C
O
D
E
REGISTER 0
REGISTER 1
REGISTER 2
REGISTER 3
REGISTER 4
REGISTER 5
REGISTER 6
REGISTER 7
PCF84C81A
STOP
handbook, full pagewidth
4
INTERRUPT
LOGIC
TIMER/
EVENT
COUNTER
T1
8
PORT 0
BUFFER
MEMORY
BANK
FLIP-FLOPS
32
I2C-BUS
INTERFACE
8
Telecom microcontroller
DATA
CLOCK
3
BLOCK DIAGRAM
SDA/P2.3
P0.0 to P0.7
P1.0 to P1.7
Philips Semiconductors
4
1998 Apr 20
P2.0 to P2.2
SCLK
Philips Semiconductors
Product specification
Telecom microcontroller
5
PCF84C81A
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
Table 1
DIP28 and SO28 packages
SYMBOL
handbook, halfpage
P2.2
1
28 VDD
SDA/P2.3
2
27 P2.1
SCLK
3
26 P2.0
P0.0
4
25 P1.7
P0.1
5
24 P1.6
P0.2
6
23 P1.5
P0.3
7
22 P1.4
P0.4
8
P0.5
FUNCTION
P2.2
1
1 bit of Port 2: 4-bit
quasi-bidirectional I/O port
SDA/P2.3
2
bidirectional data line of the
I2C-bus interface, or 1 bit of
Port 2: 4-bit quasi-bidirectional
I/O port
SCLK
3
bidirectional clock line of the
I2C-bus interface
P0.0 to P0.7 4 to 11
8 bits of Port 0: 8-bit
quasi-bidirectional I/O port
21 P1.3
INT/T0
12
Interrupt/Test 0
9
20 P1.2
T1
13
Test 1/count input of 8-bit
timer/event counter 1
P0.6 10
19 P1.1
VSS
14
ground
P0.7
18 P1.0
XTAL1
15
crystal oscillator input or
external clock input
XTAL2
16
crystal oscillator output
RESET
17
Reset input
PCF84C81A
11
INT/T0 12
17 RESET
T1 13
16 XTAL2
VSS 14
15 XTAL1
P1.0 to P1.7 18 to 25 8 bits of Port 1: 8-bit
quasi-bidirectional I/O port
MBB562
P2.0 to P2.1 26 to 27 2 bits of Port 2: 4-bit
quasi-bidirectional I/O port
Fig.2 Pin configuration.
VDD
6
PIN
INSTRUCTION SET
7
See the “PCF84CxxxA family ” data sheet for a complete
description of the instruction set.
28
positive supply
HIGH SINK OUTPUT CURRENTS
The Port 1 outputs of these devices are designed for high
current drive in the logic 0 state. They are capable of
driving 10 mA loads and higher. Applications include drive
for small relays and light-emitting diodes (LEDs).
To avoid overload, care should be taken that the total
Port 1 current averages less than 80 mA, i.e. an average
of 10 mA per Port 1 line. Refer to Chapter “Limiting values”
which specifies an upper limit of 100 mA for ISS.
1998 Apr 20
5
Philips Semiconductors
Product specification
Telecom microcontroller
8
PCF84C81A
ROM MASK OPTIONS
ROM CODE
OPTION
Any mix of instructions and data up to ROM size of
8 kbytes.
Program/data
Port Output
P0.0 to P0.7
standard
open-drain
push-pull
P1.0 to P1.7
standard
open-drain
push-pull
P2.0 to P2.2
standard
open-drain
push-pull
SDA/P2.3
−
open-drain
−
P0.0 to P0.7
set
reset
−
P1.0 to P1.7
set
reset
−
P2.0 to P2.2
set
reset
−
SDA/P2.3
set
−
−
LOW (gmL)
MEDIUM (gmM)
HIGH (gmH)
Port State after reset
Oscillator
Transconductance
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices. See “Data Handbook IC14, Section: Handling MOS devices”.
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
supply voltage
−0.5
+7
V
VI
all input voltages
−0.5
VDD + 0.5
V
II
DC input current
−10
+10
mA
IO
DC output current except Port 1 output LOW
−10
+10
mA
IO
DC output current, Port 1 output LOW
−10
+20
mA
Ptot
total power dissipation
−
125
mW
PO
power dissipation per output
−
30
mW
IDD
supply current
−50
+50
mA
ISS
ground supply current
−100
+50
mA
Tstg
storage temperature range
−55
+150
°C
Tj
operating junction temperature
−
90
°C
1998 Apr 20
6
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
11 DC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
V
VDD = 3 V; fxtal = 3.58 MHz (gmL)
−
0.3
0.6
mA
VDD = 5 V; fxtal = 10 MHz (gmL)
−
1.1
3.0
mA
VDD = 5 V; fxtal = 16 MHz (gmM)
−
1.7
5.0
mA
VDD = 5 V; fxtal = 16 MHz (gmH)
−
2.5
6.0
mA
VDD = 3 V; fxtal = 3.58 MHz (gmL)
−
0.2
0.4
mA
VDD = 5 V; fxtal = 10 MHz (gmL)
−
0.8
1.6
mA
VDD = 5 V; fxtal = 16 MHz (gmM)
−
1.2
4.0
mA
VDD = 5 V; fxtal = 16 MHz (gmH)
−
1.7
5.0
mA
−
1.2
10
µA
−
IDD
operating supply current
note 1; see Figs 4 and 5
supply current (Stop mode)
UNIT
5.5
see Fig.3
IDD(stp)
MAX.
−
operating supply voltage
supply current (Idle mode)
TYP.
2.5
VDD
IDD(idle)
MIN.
note 1; see Figs 6 and 7
VDD = 2.5 V; notes 1 and 2; see Fig.8
Inputs
VIL
LOW level input voltage
0
VIH
HIGH level input voltage
0.7VDD −
VDD
0.3VDD V
V
ILI
input leakage
VSS ≤ VI ≤ VDD
−1
−
+1
µA
IOL
LOW level output sink current
[except Port 1; SDA/P2.3 and
SCLK]
VDD = 5 V; VO = 0.4 V; see Fig.9
1.6
5
−
mA
IOL1
LOW level output sink current;
Port 1
VDD = 5 V; VO = 1.2 V; see Fig.10
10
19
−
mA
IOL2
LOW level output sink current;
SDA/P2.3 and SCLK
VDD = 5 V; VO = 0.4 V; see Fig.11
3
6.5
−
mA
IOH
HIGH level pull-up output
source current
VDD = 5 V; VO = 3.5 V; see Fig.12
40
100
−
µA
VDD = 5 V; VO = 0 V; see Fig.12
−
−140 −400
µA
HIGH level push-pull output
source current
VDD = 5 V; VO = 4.6 V; see Fig.13
−1.6
−7
−
mA
Outputs
IOH1
Oscillator (see Fig.14)
gmL
LOW transconductance
VDD = 5 V
0.2
0.4
1.0
mS
gmM
MEDIUM transconductance
VDD = 5 V
0.9
1.6
3.2
mS
gmH
HIGH transconductance
VDD = 5 V
3.0
4.5
9.0
mS
RF
feedback resistor
0.3
1.0
3.0
MΩ
Notes
1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values
at 25 °C with crystal connected between XTAL1 and XTAL2).
2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open
drain outputs connected to VSS; all other outputs open.
1998 Apr 20
7
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
MBC953 - 1
MLA712
3
18
handbook, halfpage
handbook, halfpage
I DD
(mA)
f xtal
(MHz)
16 MHz
2
12
10 MHz
guaranteed
operating range
6
1
3.58 MHz
0
0
1
3
5
1
7
V DD (V)
3
5
V DD (V)
7
Supply current based on optimal oscillator selection.
Fig.3
Maximum clock frequency as a function of
operating supply voltage (VDD).
Fig.4
MBB563
MLA713 - 1
3
Typical operating supply current (IDD) as a
function of operating supply voltage (VDD).
1.5
handbook, halfpage
handbook, halfpage
16 MHz
IDD(idle)
(mA)
I DD
(mA)
1.0
2
10 MHz
5V
0.5
1
3.58 MHz
3V
0
0
0.1
1
10
f xtal (MHz)
1
100
3
5
V DD (V)
7
Supply current based on optimal oscillator selection.
Supply current based on optimal oscillator selection.
Fig.6
Fig.5
Typical operating supply current (IDD) as a
function of clock frequency (fxtal).
1998 Apr 20
8
Typical supply current in Idle mode (IDD(idle))
as a function of operating supply voltage
(VDD).
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
MBB564 - 1
MBC954
1.5
3
handbook, halfpage
handbook, halfpage
IDD(idle)
(mA)
IDD(stp)
5V
(µA)
2
1.0
o
85 C
o
0.5
25 C
1
3V
0
0
0.1
1
10
f xtal (MHz)
1
100
3
5
V DD (V)
7
Supply current based on optimal oscillator selection.
Fig.8
Fig.7
Typical supply current in Stop mode
(IDD(stp)) as a function of operating supply
voltage (VDD).
Typical supply current in Idle mode (IDD(idle))
as a function of clock frequency (fxtal).
MBB565
MBB566
60
16
handbook, halfpage
I OL
(mA)
IOL1
(mA)
12
40
8
20
0
4
1
3
5
V DD (V)
7
1
3
5
VDD (V)
7
VO = 0.4 V.
VO = 1.2 V.
Fig.9
Fig.10 Typical LOW level output sink current for
Port 1 (IOL1) as a function of operating
supply voltage (VDD).
Typical LOW level output sink current (IOL)
as a function of operating supply voltage
(VDD).
1998 Apr 20
9
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
MBB567
16
MBC960
300
handbook, halfpage
IOL2
(mA)
I OH
(µA)
12
200
VO = VSS
8
VO = 0.7 V DD
100
4
0
1
3
5
VDD (V)
7
Fig.11 Typical LOW level output sink current for
SDA/P2.3 or SCLK (IOL2) as a function of
operating supply voltage (VDD).
5
V DD (V)
7
Fig.12 Typical HIGH level pull-up output source
current (IOH) as a function of operating
supply voltage (VDD).
MBC961
12
3
1
MBC962
6
handbook, halfpage
handbook, halfpage
I OH1
(mA)
gm
(mS)
8
4
4
2
g mH
g mM
g mL
0
0
1
3
5
V DD (V)
1
7
3
5
V DD (V)
7
VOL = VDD − 0.4 V.
Fig.13 Typical HIGH level push-pull output source
current (IOH1) as a function of operating
supply voltage (VDD).
1998 Apr 20
Fig.14 Typical transconductance values (gm) as a
function of operating supply voltage (VDD)
for the options gmL, gmM and gmH.
10
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
12 AC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
tr
rise time all outputs
VDD = 5 V; Tamb = 25 °C; CL = 50 pF
−
30
−
ns
tf
fall time all outputs
VDD = 5 V; Tamb = 25 °C; CL = 50 pF
−
30
−
ns
fxtal
clock frequency
see Fig.3
1
−
16
MHz
Table 2
I2C-bus timing (see Figs 15 and 16)
SYMBOL
PARAMETER
INPUT
(see Fig.14)
OUTPUT
(see Fig.15; note 1)
SCLK
tHD;STA
START condition hold time
14
≥ -------f xtal
tLOW
SCLK LOW time
17
≥ -------f xtal
DF – 3
-----------------2 × f xtal
; note 2
tHIGH
SCLK HIGH time
17
≥ -------f xtal
DF + 3
-----------------2 × f xtal
; note 2
tRC
SCLK rise time
≤1 µs
≤1 µs; note 3
tFC
SCLK fall time
≤0.3 µs
≤0.1 µs; note 4
tBUF
bus free time
14
≥ -------f xtal
tSU;DAT
data set-up time
tHD;DAT
data hold time
tRD
SDA/P2.3 rise time
≤1 µs
≤1 µs; note 3
tFD
SDA/P2.3 fall time
≤0.3 µs
≤0.1 µs; note 4
tSU;STO
STOP condition set-up time
14
≥ -------f xtal
DF + 9
-----------------2 × f xtal
SDA
≥ 250 ns
≥ 4.7 µs; note 5
15
≥ -------f xtal
≥0
9
≥ -------f xtal
Notes
1. DF stands for Division Factor: the divisor of fxtal (see the “PCF84CxxxA family” data sheet).
3 ( DF + 1 )
DF – 3
2. Values given for ASC = 0; for ASC = 1: tHIGH = ---------------------------- ; tLOW = -----------------4 × f xtal
4 × f xtal
3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor.
4. At maximum allowed I2C-bus capacitance Cb = 400 pF.
5. Determined by program.
t LOW – 9
24
6. If tLOW < -------- , tSU:DAT ≥ --------------------- , independent of ASC.
f xtal
f xtal
1998 Apr 20
11
; note 6
DF – 3
-----------------2 × f xtal
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
0.7 V DD
SCLK
0.3 VDD
t LOW
t HIGH
0.7 V DD
SDA/P2.3
0.3 VDD
t BUF
t HD;STA
t RD
t RC
t HD;DAT
t FC
t SU;DAT
t FD
t SU;STO
MBB568
Fig.15 Slave SCLK receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs).
t LOW
0.9 VDD
SCLK
VOLmax
t HIGH
t FD
t FC
0.9 V DD
SDA/P2.3
acknowledge bit
t HD;STA
t HD;DAT
t HD;DAT
V OLmax
t HD;DAT
t SU;STO
t SU;DAT
MBB569
t SU;DAT
Fig.16 Master SCLK and transmitter SDA/P2,3 timing (SCLK and SDA/P2.3 are outputs).
1998 Apr 20
12
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
13 PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
1998 Apr 20
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
13
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
HE
v M A
Z
15
28
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
e
bp
0
detail X
w M
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT136-1
075E06
MS-013AE
1998 Apr 20
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
14
o
8
0o
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
14 SOLDERING
14.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
14.3.2
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
14.2
14.2.1
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
14.2.2
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
14.3
14.3.1
14.3.3
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Apr 20
WAVE SOLDERING
15
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
15 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1998 Apr 20
16
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
NOTES
1998 Apr 20
17
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
NOTES
1998 Apr 20
18
Philips Semiconductors
Product specification
Telecom microcontroller
PCF84C81A
NOTES
1998 Apr 20
19
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© Philips Electronics N.V. 1996
SCA52
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Printed in The Netherlands
455102/00/04/pp20
Date of release: 1998 Apr 20
Document order number:
9397 750 03728