INTEGRATED CIRCUITS DATA SHEET PCF84C85A Microcontroller with extended I/O Product specification Supersedes data of May 1994 File under Integrated Circuits, IC14 1996 Nov 21 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 5.2 Pinning Pin description 6 PARALLEL PORTS 7 INSTRUCTION SET 8 SUMMARY OF DERIVATIVE PORTS AND REGISTERS 9 ROM MASK OPTIONS 10 HANDLING 11 LIMITING VALUES 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 13.1 I2C-bus interface characteristics 14 PACKAGE OUTLINES 15 SOLDERING 15.1 15.2 15.2.1 15.2.2 15.3 15.3.1 15.3.2 15.3.3 Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO and VSO Reflow soldering Wave soldering Repairing soldered joints 16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 18 PURCHASE OF PHILIPS I2C COMPONENTS 1996 Nov 21 2 Philips Semiconductors Product specification Microcontroller with extended I/O 1 PCF84C85A 2 FEATURES • 8-bit CPU, ROM, RAM, I/O in a single 40-lead package GENERAL DESCRIPTION This data sheet details the specific properties of the PCF84C85A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the “PCD84xxxA family” data sheet which should be read in conjunction with this publication. • 8 kbytes ROM • 256 bytes RAM • I2C-bus interface with multi-master capability • Over 100 instructions (based on MAB8048) all of 1 or 2 cycles The PCF84C85A is a general purpose CMOS microcontroller with emphasis on input/output. It provides 32 I/O port lines, 8 kbytes of program memory and 256 bytes of RAM. In addition to the 32 I/O port lines, the microcontroller provides an on-chip I2C-bus interface. This two-line serial bus extends the microcontroller's capabilities when implemented with the powerful I2C-bus peripherals.These include LCD drivers, telecom circuits, AD/DA converters, clock/calendar circuits, EEPROM and RAM and are listed in “Data Handbook IC12, I2C Peripherals”. • 32 quasi-bidirectional I/O port lines • 8-bit programmable timer/event counter 1 • Three single-level vectored interrupts: – external – 8-bit programmable timer/event counter 1 – I2C-bus • Two test inputs, one of which also serves as the external interrupt input The instruction set is based on that of the MAB8048 and is a sub-set of that listed in the “PCF84CXXXA family” data sheet. • Stop and Idle modes • Logic supply voltage: VDD = 2.5 to 5.5 V • Clock frequency: 1 to 16 MHz • Operating temperature: −40 to +85 °C • Manufactured in silicon gate CMOS process. 3 ORDERING INFORMATION (see note 1) PACKAGE TYPE NUMBER NAME PCF84C85AP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT 129-1 PCF84C85AT VSO40 plastic very small outline package; 40 leads SOT 158-1 DESCRIPTION VERSION Note 1. Please refer to the Order Entry Form (OEF) for this device for the full type number to use when ordering. This type number will also specify the required program and the ROM mask options. 1996 Nov 21 3 1996 Nov 21 8 4 SIO/ derivative interrupt 1 PORT 2 BUFFER IDLE STOP external interrupt timer interrupt ACCUMULATOR 8 PORT 2 FLIP-FLOPS DATA I2C-BUS INTERFACE INTERRUPT LOGIC CLOCK SDA/P2.3 INTERRUPT INT / T0 TEMPORARY REGISTER 1 TEMPORARY REGISTER 2 INITIALIZE RESET 8 5 8 8 CONDITIONAL BRANCH LOGIC ACC BIT TEST ACC CARRY TIMER FLAG T1 8 8 PROGRAM STATUS WORD D E C O D E 8 REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 MULTIPLEXER 8 RESIDENT RAM ARRAY 256 bytes DATA STORE OPTIONAL SECOND REGISTER BANK 8 DERIVATIVE PORT 0 BUFFER DERIVATIVE PORT 0 FLIP-FLOPS 8 DP0.0 to DP0.7 8-LEVEL STACK (VARIABLE LENGTH) PORT 0 BUFFER 8 P0.0 to P0.7 PORT 0 FLIP-FLOPS RAM ADDRESS REGISTER 8 INT / T0 LOWER PROGRAM COUNTER INSTRUCTION REGISTER & DECODER HIGHER PROGRAM COUNTER RESIDENT ROM 8 kbytes DECODE Fig.1 Block diagram. XTAL 2 OSCILLATOR XTAL XTAL 1 CONTROL & TIMING DECIMAL ADJUST 8 TIMER/ EVENT COUNTER MEMORY BANK FLIP-FLOPS ARITHMETIC LOGIC UNIT 8 8 T1 32 INTERNAL CLOCK FREQ. 30 8 PORT 1 FLIP-FLOPS PORT 1 BUFFER 8 P1.0 to P1.7 MLA596 8 DERIVATIVE PORT 1 BUFFER DERIVATIVE PORT 1 FLIP-FLOPS 8 DP1.0 to DP1.6 4 handbook, full pagewidth SCLK Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A BLOCK DIAGRAM Philips Semiconductors Product specification Microcontroller with extended I/O 5 5.1 PCF84C85A PINNING INFORMATION 5.2 Pinning Pin description Table 1 DIP40 and VSO40 packages. SYMBOL PIN TYPE 1 I P0.0 to P0.7 2 to 9 I/O 8 bits of Port 0: 8-bit quasi-bidirectional I/O port P1.0 to P1.7 10 to 17 I/O 8 bits of Port 1: 8-bit quasi-bidirectional I/O port XTAL1 18 I XTAL input: crystal oscillator/external clock input XTAL2 19 O XTAL output: crystal oscillator output VSS 20 P ground Reset input INT/T0 handbook, halfpage Interrupt/Test 0 INT / T0 1 40 V DD P0.0 2 39 T1 P0.1 3 38 SCLK P0.2 4 37 SDA / P2.3 P0.3 5 36 DP1.6 P0.4 6 35 DP1.5 P0.5 7 34 DP1.4 P0.6 8 33 DP1.3 P0.7 9 32 DP1.2 P1.0 10 31 DP1.1 RESET 21 I P1.1 11 30 DP1.0 22 to 29 I/O P1.2 12 29 DP0.7 DP0.0 to DP0.7 Derivative Port 0: quasi-bidirectional I/O port (8-bit) P1.3 13 28 DP0.6 I/O 14 27 DP0.5 DP1.0 to DP1.6 30 to 36 P1.4 P1.5 15 26 DP0.4 Derivative Port 1: quasi-bidirectional I/O lines (7-bit) P1.6 16 25 DP0.3 SDA/P2.3 37 I/O P1.7 17 24 DP0.2 XTAL1 18 23 DP0.1 bidirectional data line of the I2C-bus interface; or Port 2 quasi-bidirectional I/O port (1 bit only) XTAL2 19 22 DP0.0 SCLK 38 I/O V SS 20 21 RESET bidirectional clock line of the I2C-bus interface T1 39 I Test 1: count input of 8-bit timer/event counter 1 VDD 40 P positive supply PCF84C85A MLA597 Fig.2 Pin configuration. 6 DESCRIPTION PARALLEL PORTS 7 See “PCF84CXXXA family” data sheet for a complete description of the instruction set. Of the standard quasi-bidirectional I/O ports, Port 2 is incomplete, providing only line SDA/P2.3 that is shared with the I2C-bus interface. In addition to the standard ports, two derivative I/O ports are available: • Derivative Port of 8 lines (DP0.0 to DP0.7) • Derivative Port of 7 lines (DP1.0 to DP1.6). Missing bits of incomplete ports, i.e. P2.0 to P2.2 and DP1.7, are fixed at zero in the corresponding registers. 1996 Nov 21 INSTRUCTION SET 5 Philips Semiconductors Product specification Microcontroller with extended I/O 8 PCF84C85A SUMMARY OF DERIVATIVE PORTS AND REGISTERS Table 2 Derivative Ports. DERIVATIVE ADDRESS REGISTER MNEMONIC TYPE DESCRIPTION 00H R DP0L Derivative Port 0 lines 01H R DP1L Derivative Port 1 lines 02H R/W DP0FF Derivative Port 0 flip-flops 03H R/W DP1FF Derivative Port 1 flip-flops 04H − − Table 3 Derivative Registers. REGISTER MNEMONIC 7 6 5 4 3 2 1 0 DP0L D0.7 D0.6 D0.5 D0.4 D0.3 D0.2 D0.1 D0.0 DP1L 0 D1.6 D1.5 D1.4 D1.3 D1.2 D1.1 D1.0 DP0FF F0.7 F0.6 F0.5 F0.4 F0.3 F0.2 F0.1 F0.0 DP1FF 0 F1.6 F1.5 F1.4 F1.3 F1.2 F1.1 F1.0 9 ROM MASK OPTIONS ROM CODE OPTION Program/data Any mix of instructions and data up to ROM size of 8 kbytes. Port Output P0.0 to P0.7 standard open-drain push-pull P1.0 to P1.7 standard open-drain push-pull SDA/P2.3 − open-drain − DP0.0 to DP0.7 standard open-drain push-pull DP1.0 to DP1.7 standard open-drain push-pull P0.0 to P0.7 set reset − P1.0 to P1.7 set reset − SDA/P2.3 set − − DP1.0 to DP1.7 set reset − DP2.0 to DP2.2 set reset − LOW (gmL) MEDIUM (gmM) HIGH (gmH) Port State after reset Oscillator Transconductance 1996 Nov 21 6 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A 10 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See “Data Handbook IC14, Section: Handling MOS devices”. 11 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage −0.5 +7 V VI all input voltages −0.5 VDD + 0.5 V II DC input current −10 +10 mA IO DC output current −10 +10 mA Ptot total power dissipation − 125 mW PO power dissipation per output − 30 mW ISS ground supply current (VSS) −50 +50 mA Tstg storage temperature range −65 +150 °C Tj operating junction temperature − 90 °C 1996 Nov 21 7 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A 12 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS V VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.3 0.6 mA VDD = 5 V; fxtal = 10 MHz (gmL) − 1.1 3.0 mA VDD = 5 V; fxtal = 16 MHz (gmM) − 1.7 5.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) − 2.5 6.0 mA VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.2 0.4 mA VDD = 5 V; fxtal = 10 MHz (gmL) − 0.8 1.6 mA VDD = 5 V; fxtal = 16 MHz (gmM) − 1.2 4.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) − 1.7 5.0 mA − 1.2 10 µA − IDD operating supply current note 1; see Figs 4 and 5 supply current (Stop mode) UNIT 5.5 see Fig. 3 IDD(stp) MAX. − operating supply voltage supply current (Idle mode) TYP. 2.5 VDD IDD(idle) MIN. note 1; see Figs 6 and 7 VDD = 2.5 V; notes 1 and 2; see Fig.8 Inputs VIL LOW level input voltage 0 VIH HIGH level input voltage 0.7VDD − VDD 0.3VDD V V ILI input leakage current VSS ≤ VI ≤ VDD −1 − +1 µA IOL LOW level output sink current; except SDA/P2.3 and SCLK VDD = 5 V; VO = 0.4 V; see Fig.9 1.6 12 − mA IOL2 LOW level output sink current; SDA/P2.3 and SCLK VDD = 5 V; VO = 0.4 V; see Fig.10 3.0 12 − mA IOH HIGH level pull-up output source current VDD = 5 V; VO = 3.5 V; see Fig.11 −40 −100 − µA VDD = 5 V; VO = 0 V; see Fig.11 − −140 −400 µA HIGH level push-pull output source current VDD = 5 V; VO = 4.6 V; see Fig.12 −1.6 −7 − mA Outputs IOH1 Oscillator (see Fig.13) gmL LOW transconductance VDD = 5 V 0.2 0.4 1.0 mS gmM MEDIUM transconductance VDD = 5 V 0.9 1.6 3.2 mS gmH HIGH transconductance VDD = 5 V 3.0 4.5 9.0 mS RF feedback resistor 0.3 1.0 3.0 MΩ Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 °C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open. 1996 Nov 21 8 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A MBC953 - 1 MLA712 3 18 handbook, halfpage handbook, halfpage I DD (mA) f xtal (MHz) 16 MHz 2 12 10 MHz guaranteed operating range 6 1 3.58 MHz 0 0 1 3 5 1 7 V DD (V) 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.3 Maximum clock frequency (fxtal) as a function of supply voltage (VDD). Fig.4 MBB563 MLA713 - 1 3 Typical operating supply current (IDD) as a function of operating supply voltage (VDD). 1.5 handbook, halfpage handbook, halfpage 16 MHz IDD(idle) (mA) I DD (mA) 1.0 2 10 MHz 5V 0.5 1 3.58 MHz 3V 0 0 0.1 1 10 f xtal (MHz) 1 100 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Supply current based on optimal oscillator selection. Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal). 1996 Nov 21 9 Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD). Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A MBB564 - 1 MBC954 1.5 3 handbook, halfpage handbook, halfpage IDD(idle) (mA) IDD(stp) 5V (µA) 2 1.0 o 85 C o 0.5 25 C 1 3V 0 0 0.1 1 10 f xtal (MHz) 1 100 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.8 Fig.7 Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD). Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal). MBB565 MLA598 - 1 16 16 handbook, halfpage I OL2 (mA) I OL (mA) 12 12 8 8 4 4 1 3 5 V DD (V) 1 7 3 5 V DD (V) 7 VO = 0.4 V. VO = 0.4 V. Fig.9 Fig.10 Typical LOW level output sink current for SDA/P2.3 or SCLK (IOL2) as a function of operating supply voltage (VDD). Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD). 1996 Nov 21 10 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A MLA599 300 MLA600 12 handbook, halfpage handbook, halfpage IOH1 I OH (mA) (µA) 8 200 VO = VSS VO = 0.7VDD 100 4 0 1 3 5 V DD (V) 0 7 1 3 5 V DD (V) 7 VO = VDD− 0.4 V. Fig.11 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD). Fig.12 Typical HIGH level push-pull output source current (IOH1) as a function of operating supply voltage (VDD). MBB242 10 handbook, halfpage g mH gm (mS) g mM 1 g mL 0.1 1 3 5 VDD (V) 7 Fig.13 Typical transconductance (gm) as a function of operating supply voltage (VDD) for the options gmL, gmM and gmH. 1996 Nov 21 11 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A 13 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT tr rise time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns tf fall time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns fxtal clock frequency see Fig.3 1 − 16 MHz Table 4 I2C-bus timing (see Figs 14 and 15) SYMBOL INPUT (see Fig.14) PARAMETER OUTPUT (see Fig.15; note 1) SCLK tHD;STA START condition hold time 14 ≥ -------f xtal tLOW SCLK LOW time 17 ≥ -------f xtal DF – 3 -----------------2 × f xtal tHIGH SCLK HIGH time 17 ≥ -------f xtal DF + 3 ------------------ ; note 2 2 × f xtal tRC SCLK rise time ≤1 µs ≤1 µs; note 3 tFC SCLK fall time ≤0.3 µs ≤0.1 µs; note 4 tBUF bus free time 14 ≥ -------f xtal tSU;DAT data set-up time ≥250 ns tHD;DAT data hold time tRD SDA/P2.3 rise time ≤1 µs ≤1 µs; note 3 tFD SDA/P2.3 fall time ≤0.3 µs ≤0.1 µs; note 4 tSU;STO STOP condition set-up time 14 ≥ -------f xtal DF + 9 -----------------2 × f xtal ; note 2 SDA ≥0 Notes 1. DF stands for Division Factor: the divisor of fxtal (see “PCF84CXXXA family” data sheet). 3 ( DF + 1 ) DF – 3 2. Values given for ASC = 0; for ASC = 1: tHIGH = ---------------------------- ; tLOW = -----------------4 × f xtal 4 × f xtal 3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor. 4. At maximum allowed I2C-bus capacitance Cb = 400 pF. 5. Determined by program. t LOW – 9 24 6. If tLOW < -------- , tSU:DAT ≥ --------------------- , independent of ASC. f xtal f xtal 1996 Nov 21 12 ≥4.7 µs; note 5 15 ≥ -------f xtal ; note 6 9 ≥ -------f xtal DF – 3 -----------------2 × f xtal Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A handbook, full pagewidth 0.7 V DD SCLK 0.3 VDD t HIGH t LOW 0.7 V DD SDA/P2.3 0.3 VDD t BUF t HD;STA t RD t RC t HD;DAT t FC t SU;DAT t FD t SU;STO MLA504 Fig.14 Slave SCLK and receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs). t LOW handbook, full pagewidth 0.9 VDD SCLK VOLmax t HIGH t FD t FC 0.9 V DD SDA/P2.3 acknowledge bit t HD;STA t HD;DAT t HD;DAT V OLmax t HD;DAT t SU;STO t SU;DAT MLA505 t SU;DAT Fig.15 Master SCLK and transmitter SDA/P2.3 timing (SCLK and SDA/P2.3 are outputs). 1996 Nov 21 13 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A 14 PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 θ pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 θ Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1996 Nov 21 EUROPEAN PROJECTION 14 o 7 0o Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D (1) e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ 1996 Nov 21 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 15 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. 15 SOLDERING 15.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 15.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). 15.2 15.2.1 Wave soldering techniques can be used for all SO and VSO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 15.2.2 Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 15.3 15.3.1 15.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO and VSO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and VSO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Nov 21 WAVE SOLDERING 16 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A 16 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 17 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 18 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1996 Nov 21 17 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A NOTES 1996 Nov 21 18 Philips Semiconductors Product specification Microcontroller with extended I/O PCF84C85A NOTES 1996 Nov 21 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1996 SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 457021/1200/03/pp20 Date of release: 1996 Nov 21 Document order number: 9397 750 01084