PHILIPS TDA8008

INTEGRATED CIRCUITS
DATA SHEET
TDA8008
Dual multiprotocol smart card
coupler
Objective specification
File under Integrated Circuits, IC02
1999 Dec 14
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
• Chip select input allowing use of several devices in
parallel and memory space paging
FEATURES
• 8xC51 core with 16 kbytes or EPROM (TDA8008),
256 bytes RAM, 512 bytes AUXRAM, Timer 0, 1, 2 and
enhanced UART
• Enhanced ESD protections on card contacts (6 kV min.)
• Software library for easy integration within the
application
• Specific ISO 7816 UART, accessible with MOVX
instructions for automatic convention processing,
variable baud rate through frequency or division ratio
programming, error management at character level for
T = 0 protocol, extra guard time register
• Development tool with a TDA8007B and a regular
emulator.
APPLICATIONS
• Dual VCC generation (5 V ±5% or 3 V ±5%), maximum
current of 60 mA with controlled rise and fall times
• Multiple smart card readers for multiprotocol
applications (EMV banking, digital pay TV, access
control, etc.).
• Dual cards clock generation (up to 10 MHz) with two
times synchronous frequency doubling
• Cards clock STOP HIGH or LOW or 1.25 MHz (from an
integrated oscillator) for cards power reduction mode
GENERAL DESCRIPTION
• Automatic activation and deactivation sequences
through an independent sequencer
The TDA8008 is a complete, one-chip, low cost dual smart
card coupler.
• Supports the asynchronous protocols T = 0 and T = 1 in
accordance with ISO 7816 and EMV
It can be used as the kernel of a multiple card reader. It can
handle all ISO 7816, EMV and GSM11-11 requirements.
The integrated ISO 7816 UART and the time-out counters
allow easy use even at high baud rates with no real time
constraints. Due to its chip select and external I/O and
interrupt features, it simplifies the realization of any
number of cards reader. It gives the cards and the set a
very high level of security, due to its special hardware
against ESD, short-circuiting, power failure and
overheating. Its integrated step-up converter allows
operation within a supply voltage range of 2.7 to 5.5 V at
16 MHz.
• Versatile 24-bit time-out counter for Answer To Reset
(ATR) and waiting times processing
• 22 ETU counter for block guard time
• Supports synchronous cards
• Current limitations on cards contacts
• Special circuitry for killing spikes during power-on or off
• Supply supervisor for Power-on reset
• Step-up converter (supply voltage from 2.7 to 5.5 V at
16 MHz), doubler, tripler or follower according to VCC
and VDD
The OTP version of the TDA8008 allows fast and reliable
software development and fast product introduction.
• Speed up to 25 MHz at VDD = 5 V
A software library has been developed, that can handle all
actions required for T = 0, T = 1 and synchronous
protocols.
• Additional I/O pin allowing the use of the ISO 7816
UART for an external card interface (pin IOAUX)
• Additional interrupt pin allowing detection of level
toggling on an external signal (pin INTAUX)
• Fast and efficient swapping between the 3 cards due to
separate buffering of parameters for each card
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA8008HL
1999 Dec 14
LQFP80
DESCRIPTION
plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm
2
VERSION
SOT315-1
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2.7
−
5.5
V
−
−
tbf
µA
supply current in sleep mode
VDD = 3.3 V; cards active at
−
VCC = 5V; clock stopped; 8xC51
controller in Idle mode; note 1
−
tbf
mA
IDD(om)
supply current in operating mode
VDD = 3.3 V; fXTAL1 = 20 MHz
VCC1 = VCC2 = 5 V;
ICC1 + ICC2 = 80 mA; note 1
−
−
tbf
mA
VCC
card output supply voltage
including static loads (5 V card)
4.75
5.0
5.25
V
with 40 nAs dynamic loads on
200 nF capacitor (5 V card)
4.6
5.0
5.4
V
including static loads (3 V card)
2.80
3.0
3.20
V
with 40 nAs dynamic loads on
200 nF capacitor (3 V card)
2.75
3.0
3.25
V
operating
−
−
65
mA
overload detection
−
80
−
mA
−
−
80
mA
VDD
supply voltage
IDD(pd)
supply current in Power-down mode VDD = 3.3 V; cards inactive;
8xC51 controller in power-down
mode; note 1
IDD(sm)
ICC
card output supply current
VDDD = VDDA = VDDP
ICC1 + ICC2
sum of both cards currents
SR
slew rate on VCC (rise and fall)
0.10
0.16
0.22
V/µs
tde
deactivation cycle duration
−
−
100
µs
tact
activation cycle duration
−
−
225
µs
fXTAL
crystal frequency
3.5
−
25
MHz
fop
operating frequency
0
−
25
MHz
Tamb
ambient temperature
−25
−
+85
°C
CL = 300 nF (max.)
external frequency applied to
pin XTAL1
Note
1. IDD in all configurations includes the current at pins VDDD, VDDA and VDDP.
1999 Dec 14
3
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
BLOCK DIAGRAM
RSTOUT
EA/VPP
PSEN
ALE/PROG
18
24
25 16
SAM
SBP
6
SAP
52
3
200 nF
200 nF
SBM
51
RESET
CDELAY
GNDD
VDDD
handbook, full pagewidth
SUPPLY
39
SUPERVISOR
STEP-UP
CONVERTER
63
41 to 48
34
33
TIMER 0, 1 and 2
P10 to P17
8
ISO 7816
UART
ENHANCED UART
P30 to P37
ANALOG
8
TDA8008
P20 to P27
CLOCK
CIRCUITRY
53 to 62
27
AND
15
14
ALE
P36/WR
47
P37/RD
48
INTAUX
IOAUX
CS
INTERFACE CONTROL
67 to 74
512 BYTES AUXRAM
BY MOVX
13
12
11
10
9
8
5
XTAL
OSCILLATOR
INTERNAL
OSCILLATOR
35
37
38
32
31
30
29
28
DRIVERS
SEQUENCER
P00 to P07
GNDP
VUP
4
256 BYTES RAM
75 to 80,
1, 2
17
200 nF
TIME-OUT
COUNTER
16 KBYTES ROM or OTP
64
VDDP
26
8xC51 CONTROLLER
65
23
19 to 22, 40,
58, 59, 66
50
VDDA
I/01
C81
PRES1
C41
RST1
VCC1
CLK1
GNDC1
GNDC2
CLK2
VCC2
RST2
C42
C82
I/02
PRES2
GNDA
XTAL1
49
36
7
XTAL2
TEST
INHIB
n.c.
FCE568
Fig.1 Block diagram.
1999 Dec 14
4
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
PINNING
SYMBOL
PIN
DESCRIPTION
P16
1
8xC51 general purpose I/O port
P17
2
8xC51 general purpose I/O port
RESET
3
reset input: a HIGH on this pin for 2 machine cycles while the oscillator is running, resets the
device. An internal diffused resistor connected to GNDD permits a Power-on reset using an
external capacitor connected to VDDD.
VDDA
4
analog supply voltage
GNDA
5
analog ground
CDELAY
6
pin for an external delay capacitor
INHIB
7
test pin (must be left open-circuit in the application)
PRES2
8
card 2 presence contact input (active HIGH or LOW by mask option)
IO2
9
data line to/from card 2 (ISO C7 contact)
C82
10
auxiliary I/O for ISO C8 contact for card 2 (i.e. synchronous cards)
C42
11
auxiliary I/O for ISO C4 contact for card 2 (i.e. synchronous cards)
RST2
12
card 2 reset output (ISO C2 contact)
VCC2
13
card 2 output supply voltage (ISO C1 contact)
CLK2
14
clock output of card 2 (ISO C3 contact)
GNDC2
15
ground for card 2
SAM
16
contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
GNDP
17
ground for the step-up converter
SBM
18
contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
n.c.
19
not connected
n.c.
20
not connected
n.c.
21
not connected
n.c.
22
not connected
VDDP
23
supply voltage for the step-up converter
SBP
24
contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
SAP
25
contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
VUP
26
output of the step-up converter
GNDC1
27
ground for card 1
CLK1
28
clock output of card 1 (ISO C3 contact)
VCC1
29
card 1 output supply voltage (ISO C1 contact)
RST1
30
card 1 reset output (ISO C2 contact)
C41
31
auxiliary I/O for ISO C4 contact for card 1 (i.e. synchronous cards)
PRES1
32
card 1 presence contact input (active HIGH or LOW by mask option)
C81
33
auxiliary I/O for ISO C8 contact for card 1 (i.e. synchronous cards)
IO1
34
data line to and from card 1 (ISO C7 contact)
INTAUX
35
auxiliary interrupt input
1999 Dec 14
5
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
SYMBOL
PIN
TDA8008
DESCRIPTION
TEST
36
test pin (must be left open-circuit in the application)
IOAUX
37
input or output for an I/O line issued on an auxiliary smart card interface
CS
38
chip select input (active LOW)
RSTOUT
39
open-drain output for resetting external chips
n.c.
40
not connected
P30/RXD
41
8xC51 general purpose I/O port/serial input port
P31/TXD
42
8xC51 general purpose I/O port/serial output port
P32/INT0
43
8xC51 general purpose I/O port/external interrupt 0
P33/INT1
44
8xC51 general purpose I/O port/external interrupt 1
P34/T0
45
8xC51 general purpose I/O port/Timer 0 external input
P35/T1
46
8xC51 general purpose I/O port/Timer 1 external input
P36/WR
47
8xC51 general purpose I/O port/external data memory write strobe
P37/RD
48
8xC51 general purpose I/O port/external data memory read strobe
XTAL2
49
connection pin for an external crystal (output from the inverting oscillator amplifier)
XTAL1
50
connection pin for an external crystal, or input for an external clock signal (input to the
inverting oscillator amplifier and input to the internal clock generator circuits)
VDDD
51
digital supply voltage
GNDD
52
digital ground
P20/A8
53
8xC51 general purpose I/O port/address 8
P21/A9
54
8xC51 general purpose I/O port/address 9
P22/A10
55
8xC51 general purpose I/O port/address 10
P23/A11
56
8xC51 general purpose I/O port/address 11
P24/A12
57
8xC51 general purpose I/O port/address 12
n.c.
58
not connected
n.c.
59
not connected
P25/A13
60
8xC51 general purpose I/O port/address 13
P26/A14
61
8xC51 general purpose I/O port/address 14
P27/A15
62
8xC51 general purpose I/O port/address 15
PSEN
63
Program store enable output: this is the read strobe to the external program memory. When
executing code from the external program memory, PSEN is activated twice each machine
cycle, except that two PSEN activations are skipped during each access to external data
memory. PSEN is not activated during fetches from internal program memory.
ALE/PROG
64
Address latch enable/program pulse: this is the output pulse for latching the low byte of the
address during an access to external memory. In normal operation, ALE pulses are emitted at
a constant rate of 1⁄6 of the oscillator frequency and can be used for external timing or
clocking. It should be noted that one ALE pulse is skipped during each access to external data
memory. This pin is also the program pulse input (PROG) during EPROM programming. ALE
can be disabled by setting bit SFR Auxiliary 0. With this bit set, ALE will be active only during
a MOVX instruction.
1999 Dec 14
6
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
SYMBOL
TDA8008
PIN
DESCRIPTION
EA/VPP
65
External access enable/programming supply voltage: EA must be externally held LOW to
enable the device to fetch code from external program memory locations starting with 0000H.
If EA is held HIGH, the device executes from the internal program memory unless the program
counter contains an address greater than 3FFFH (16 kbytes boundary). This pin also receives
the 12.75 V programming supply voltage (VPP) during EPROM programming. If security bit 1
is programmed, EA will be internally latched on reset.
n.c.
66
not connected
P07/AD7
67
8xC51 general purpose I/O port/address/data 7
P06/AD6
68
8xC51 general purpose I/O port/address/data 6
P05/AD5
69
8xC51 general purpose I/O port/address/data 5
P04/AD4
70
8xC51 general purpose I/O port/address/data 4
P03/AD3
71
8xC51 general purpose I/O port/address/data 3
P02/AD2
72
8xC51 general purpose I/O port/address/data 2
P01/AD1
73
8xC51 general purpose I/O port/address/data 1
P00/AD0
74
8xC51 general purpose I/O port/address/data 0
P10/T2
75
8xC51 general purpose I/O port/timer, counter 2 external count input and clock output
P11/T2EX
76
8xC51 general purpose I/O port/timer, counter 2 reload, capture and direction control
P12
77
8xC51 general purpose I/O port
P13
78
8xC51 general purpose I/O port
P14
79
8xC51 general purpose I/O port
P15
80
8xC51 general purpose I/O port
1999 Dec 14
7
Philips Semiconductors
Objective specification
41 P30/RXD
42 P31/TXD
43 P32/INT0
44 P33/INT1
45 P34/T0
46 P35/T1
47 P36/WR
48 P37/RD
49 XTAL2
TDA8008
50 XTAL1
51 VDDD
52 GNDD
53 P20/A8
54 P21/A9
55 P22/A10
56 P23/A11
57 P24/A12
58 n.c.
59 n.c.
handbook, full pagewidth
60 P25/A13
Dual multiprotocol smart card coupler
P26/A14 61
40 n.c.
P27/A15 62
39 RSTOUT
PSEN 63
38 CS
ALE/PROG 64
37 IOAUX
EA/VPP 65
36 TEST
n.c. 66
35 INTAUX
P07/AD7 67
34 IO1
P06/AD6 68
33 C81
P05/AD5 69
32
PRES1
31
C41
P03/AD3 71
30
RST1
P02/AD2 72
29
VCC1
P01/AD1 73
28
CLK1
P00/AD0 74
27
GNDC1
P10/T2 75
26
VUP
P11/T2EX 76
25
SAP
P12 77
24
SBP
P13 78
23 VDDP
P14 79
22 n.c.
P15 80
21 n.c.
P04/AD4 70
Fig.2 Pin configuration.
1999 Dec 14
8
n.c. 20
n.c. 19
SBM 18
GNDP 17
SAM 16
GNDC2 15
CLK2 14
VCC2 13
RST2 12
7
INHIB
C42 11
6
CDELAY
C82 10
5
GNDA
9
4
VDDA
IO2
3
RESET
8
2
P17
PRES2
1
P16
TDA8008HL
FCE569
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
PACKAGE OUTLINE
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
SOT315-1
c
y
X
A
60
41
40 Z E
61
e
E HE
A A2
(A 3)
A1
w M
θ
bp
L
pin 1 index
80
Lp
21
detail X
20
1
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.16
0.04
1.5
1.3
0.25
0.27
0.13
0.18
0.12
12.1
11.9
12.1
11.9
0.5
HD
HE
14.15 14.15
13.85 13.85
L
Lp
v
w
y
1.0
0.75
0.30
0.2
0.15
0.1
Z D (1) Z E (1)
θ
1.45
1.05
7
0o
1.45
1.05
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
95-12-19
97-07-15
SOT315-1
1999 Dec 14
EUROPEAN
PROJECTION
9
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Dec 14
TDA8008
10
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Dec 14
11
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Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 68
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/01/pp12
Date of release: 1999
Dec 14
Document order number:
9397 750 06532