ETC AP909

AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
Datasheet
Revision 0.0
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
Table of Contents
1. OVERVIEW................................................................................................................................................................ 1 2. APPLICATIONS ........................................................................................................................................................ 1 2.1. TARGET APPLICATIONS ...................................................................................................................................................... 1 2.2. APPLICATION FEATURES..................................................................................................................................................... 1 2.2.1 DOCKING CONTROL FEATURES ...................................................................................................................................... 1 2.2.2 CLOCK AND ALARM FEATURES ....................................................................................................................................... 1 2.2.3 RADIO FEATURES ........................................................................................................................................................... 1 2.2.4 OTHER SYSTEM FEATURES ............................................................................................................................................ 1 3. ORDERING INFORMATION ..................................................................................................................................... 1 4. PIN CONFIGURATION.............................................................................................................................................. 1 5. BLOCK DIAGRAM .................................................................................................................................................... 2 6. BUILT IN PERIPHERALS ......................................................................................................................................... 2 7. PIN DESCRIPTION ................................................................................................................................................... 3 8. ELECTRICAL SPECIFICATION ............................................................................................................................... 5 8.1. 8.2. 8.3. 8.4. ABSOLUTE MAXIMUM RATING............................................................................................................................................. 5 RECOMMENDED OPERATING CONDITION ........................................................................................................................... 5 LEAKAGE CURRENT AND CAPACITANCE ............................................................................................................................ 5 DC ELECTRICAL CHARACTERISTICS .................................................................................................................................. 5 9. PACKAGE INFORMATION....................................................................................................................................... 6 10. SOLDERING INDICATION........................................................................................................................................ 7 1. 2. 3. 4. REFLOW SOLDERING .......................................................................................................................................................... 7 WAVE SOLDERING .............................................................................................................................................................. 7 MANUAL SOLDERING .......................................................................................................................................................... 7 SUITABILITY OF SURFACE MOUNT IC PACKAGES FOR WAVE AND REFLOW SOLDERING METHODS ............................... 9 Revision 0.0
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
1. OVERVIEW
2.2.3 Radio Features
The AP909 is a controller IC for docking application with
remote control function and LCD driver. It has a built-in
PLL controller for controlling external radio tuner IC to
form a complete digital tuning system (DTS). AP909
also supports real time clock with 12/24 hour display
format and dual alarm clock timer. Built-in with LCD
driver and support for docking system of prevalent music
players and mobile phones, AP909 is suitable for a wide
range of audio applications that have build-in clock
alarm, radio and docking features.
• Auto/Manual radio station scanning
• Programmable radio station memory ( independent
memory slots for FM and AM )
2. APPLICATIONS
2.2.4 Other System Features
• Support 24 segment x 4 common or 6 common, 1/3
bias LCD display
• Automatic detection of AC power
• Low standby current
3. ORDERING INFORMATION
2.1. Target Applications
ORDERING NUMBER
AP909-LQ-L
• Docking system
• Clock radio
• Bluetooth application
PACKAGE
LQFP
4. PIN CONFIGURATION
75 P71
74 P70
73 P63
72 P62
71 P61
70 P60
69 P53
68 P52
67 P51
66 P50
65 GND
64 P43
63 P42
62 P41
61 P40
60 P33
59 P32
58 P31
57 P30
56 P23
55 P22
54 P21
53 P20
52 P13
51 P12
2.2. Application Features
2.2.1 Docking Control Features
• 12/24 hour clock display mode selectable by user
• Dual alarm clocks
• User selectable alarm mode – wake-to-buzzer, waketo-radio or wake-to-docked_device
• Fixed snooze feature
• Programmable sleep timer
Page 1 of 10
P11
P10
P113
P112
ADCIO5
ADCIO4
ADCIO3
ADCIO2
ADCIO1
ADCIO0
W2
P133
P132
TESTB3
TESTB2
DTSPLLFLT
GND
IFIN
AMIN
FMIN
VDD
P103
P102
P101
P100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
2.2.2 Clock and Alarm Features
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P72 76
P73 77
P80 78
P81 79
P82 80
P83 81
VLCD2 82
VLCD1 83
VLCD 84
ACIN 85
P120 86
P121 87
P122 88
P123 89
W3 90
PGM 91
ATONE 92
VDD 93
XOSCO 94
XOSCI 95
GND 96
P142 97
P143 98
P140 99
P141 100
P90
P91
P92
P93
RSTB
PWRDET
AVDD
PLLFLT
AGND
GND
P150
P151
VDD
VPP
P130
P131
WDTEN
W0
W1
P00
P01
P02
P03
P110
P111
• Docking control through front panel buttons or remote
controller
• PLAY, PAUSE, STOP, FAST FORWARD, FAST
BACKWARD, RANDOM, REPEAT functions
• Device charging through docking system
• Support Apple Authentication Coprocessor
Revision 0.0
PINS
100
Figure 1 100-Pin LQFP Package of AP909
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
5. BLOCK DIAGRAM
The following diagram shows the system blocks embedded in AP909.
CLOCK
SYNTHESIZER
XOSC
DTS PLL
CLKGEN
RCOSC
TIMER
ADC
SPI
PROG PROM
32kx8x2
DATA RAM
2kx8
AC_DET
UART
I2C MS
REMOTE
MCU
ROTARY SW
EMU
MCU EIRQ
BUZZER
GPIO & PIN MUX
LCD Display
GPIO & PIN MUX
INTCON
Figure 2 Internal Block Diagram of AP909
6. BUILT-IN PERIPHERALS
• High performance 8 bit CPU
o Support C language programming
• 64 kbyte one time program ROM
• 2 kbyte data RAM
• Interrupt controller
o 13 interrupt sources
• Watchdog reset
• Real time clock
• Embedded RC oscillator
• Programmable timer
o 3 units
• Pulse width modulation
o 3 units
• LCD driver
o 24 segment x 4 common or 6
common, 1/3 bias LCD display
• DTS PLL unit
Revision 0.0
• 6-bit ADC
o 6 channels
• AC line frequency detection unit
• External interrupt
o 4 channels
• IR remote transmit and receive control unit
• Buzzer unit
o output level control available
• Rotary type switch counter unit
• UART interface
o 2 units
• I2C interface
o 3 channels
• SPI interface
o 1 channel
• Selectable oscillator option
o XOSC : low speed 32.768kHz / 75kHz crystal
o RCOSC: 3.7MHz internal RC oscillator
Page 2 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
7. PIN DESCRIPTION
Pin
Name
Alternative
Function
Type
Pullup
/down
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
P90
P91
P92
P93
RSTB
PWRDET
AVDD
PLLFLT
AGND
GND
P150
P151
VDD
VPP
P130
P131
WDTEN
W0
W1
P00
P01
P02
P03
SPIDIO
SPICLK
SPIDI
IO,S
IO,S
IO,S
IO,S
I,S
IA
PU
PU
PU
PU
U
24
OA
IO,S
IO,S
I2CCLK0
I2CDAT0
PWMO2
REMO
IO,S
IO,S
I,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
PU
PU
U
PU
PU
PU
PU
PU
PU
P110
RCK
IO,S
PU
25
P111
RCD
IO,S
PU
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P100
P101
P102
P103
VDD
FMIN
AMIN
IFIN
GND
DTSPLLFLT
TESTB2
TESTB3
P132
P133
W2
ADCIO0
ADCIO1
ADCIO2
ADCIO3
ADCIO4
ADCIO5
P112
P113
P10
P11
TX0
RX0
BOUT0
PWMO1
IO,S
IO,S
IO,S
IO,S
PU
PU
PU
PU
I2CCLK1
I2CDAT1
TONE
BOUT1
OA
I,S
I,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
51
P12
COM6 / TX1
IO,S,L
PU
52
P13
COM5 / RX1
IO,S,L
PU
53
54
55
56
57
58
P20
P21
P22
P23
P30
P31
COM4
COM3
COM2
COM1
SEG1
SEG2
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
PU
PU
PU
PU
PU
PU
Revision 0.0
RDSCLK
IA
IA
IA
TONE
U
U
PU
PU
PU
PU
PU
PU
PU
Page 3 of 10
Descriptions
General purpose IO port / SPI data IO
General purpose IO port / SPI clock IO
General purpose IO port / SPI data input
General purpose IO port
Active low chip reset input
Low-voltage detect
Analog supply voltage
PLL filter
Analog ground
Ground
General purpose IO port
General purpose IO port
Power supply
Power supply
General purpose IO port pin
General purpose IO port pin
Watchdog enable ( active high)
General purpose IO port pin / external interrupt.
General purpose IO port pin / external interrupt.
General purpose IO port / I2C0 clock output
General purpose IO port / I2C0 data IO port
General purpose IO port / PWM Output 2
General purpose IO port / Remote receiver input
General purpose IO port or rotary switch counter
input
General purpose IO port or rotary switch counter
input
General purpose IO port or UART0 TX output
General purpose IO port or UART0 RX input
General purpose IO port or UART0 clock output
General purpose IO port pin / PWM output 1
Power supply
FM input clock
AM input clock
IF input clock
ground
DTS PLL control voltage output
Active low chip test enable
Active low chip test enable
General purpose IO port pin / buzzer
General purpose IO port pin
General purpose IO port pin / external interrupt.
ADC input channel 0 / General purpose IO port
ADC input channel 1 / General purpose IO port
ADC input channel 2 / General purpose IO port
ADC input channel 3 / General purpose IO port
ADC input channel 4 / General purpose IO port
ADC input channel 5 / General purpose IO port
General purpose IO port pin / I2C1 clock output
General purpose IO port pin / I2C1 data IO
General purpose IO port pin / buzzer output
General purpose IO port pin / UART1 clock *Note
General purpose IO port / LCD common 6 / UART1
TX *Note
General purpose IO port / LCD common 5 / UART1
RX *Note
General purpose IO port / LCD common 4
General purpose IO port / LCD common 3
General purpose IO port / LCD common 2
General purpose IO port / LCD common 1
General purpose IO port / LCD segment 1
General purpose IO port / LCD segment 2
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
I
O
IO
IA
OA
Pin
Name
Alternative
Function
Type
Pullup
/down
59
60
61
62
63
64
65
P32
P33
P40
P41
P42
P43
GND
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
PU
PU
PU
PU
PU
PU
66
P50
SEG9 / LCDD0
IO,S,L
PU
67
P51
SEG10 / LCDD1
IO,S,L
PU
68
P52
SEG11 / LCDD2
IO,S,L
PU
69
P53
SEG12 / LCDD3
IO,S,L
PU
70
P60
SEG13 / LCDD4
IO,S,L
PU
71
P61
SEG14 / LCDD5
IO,S,L
PU
72
P62
SEG15 / LCDD6
IO,S,L
PU
73
P63
SEG16 / LCDD7
IO,S,L
PU
74
P70
SEG17 /
LCDWRB
IO,S,L
PU
75
P71
SEG18 / LCDRDB
IO,S,L
PU
76
P72
SEG19 / LCDA0
IO,S,L
PU
77
P73
SEG20 / LCDCSB
IO,S,L
PU
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
P80
P81
P82
P83
VLCD2
VLCD1
VLCD
ACIN
P120
P121
P122
P123
W3
TEST4
ATONE
VDD
XOSCO
XOSCI
GND
SEG21
SEG22
SEG23
SEG24
IO,S,L
IO,S,L
IO,S,L
IO,S,L
PU
PU
PU
PU
I,S
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S
I,S
OA
U
PU
PU
PU
PU
PU
D
97
P142
PWMO3P
IO,S
PU
98
P143
PWMO3N
IO,S
PU
99
100
P140
P141
I2CCLK2
I2CDAT2
IO,S
IO,S
PU
PU
- Input pin
- Output pin
- Bidirectional pin
- Analog input pin
- Analog output pin
TX1
RX1
BOUT1
IR_TX
O
I
S
(P)U
(P)D
L
0,1,Z
Descriptions
General purpose IO port / LCD segment 3
General purpose IO port / LCD segment 4
General purpose IO port / LCD segment 5
General purpose IO port / LCD segment 6
General purpose IO port / LCD segment 7
General purpose IO port / LCD segment 8
Ground
General purpose IO port / LCD segment 9/ 8-bit MPU
interface
General purpose IO port / LCD segment 10 / 8-bit
MPU interface
General purpose IO port / LCD segment 11 / 8-bit
MPU interface
General purpose IO port / LCD segment 12 / 8-bit
MPU interface
General purpose IO port / LCD segment 13 / 8-bit
MPU interface
General purpose IO port / LCD segment 14 / 8-bit
MPU interface
General purpose IO port / LCD segment 15 / 8-bit
MPU interface
General purpose IO port / LCD segment 16 / 8-bit
MPU interface
General purpose IO port / LCD segment 17 / 8-bit
MPU interface
General purpose IO port / LCD segment 18 / 8-bit
MPU interface
General purpose IO port / LCD segment 19 / 8-bit
MPU interface
General purpose IO port / LCD segment 20 / 8-bit
MPU interface
General purpose IO port / LCD segment 21
General purpose IO port / LCD segment 22
General purpose IO port / LCD segment 23
General purpose IO port / LCD segment 24
1/3 x VLCD voltage
2/3 x VLCD voltage
LCD driver supply voltage
AC detection input
General purpose IO port / UART1 TX *Note
General purpose IO port / UART1 RX *Note
General purpose IO port / UART1 clock output *Note
General purpose IO port / IR TX output
General purpose IO port pin / external interrupt.
Active high chip test enable
Buzzer output with level control
Power supply
32.768kHz / 75kHz oscillator output
32.768kHz / 75kHz oscillator input
Ground
General purpose IO port / PWM3 complementary
output 1
General purpose IO port / PWM3 complementary
output 2
General purpose IO port pin / I2C2 clock output
General purpose IO port / I2C2 data IO
- CMOS Schmitt Trigger
- (Programmable) Pull-up
- (Programmable) Pull-down
- LCD Pad
- Logic state 0, Logic state 1,High impedance
*Note:
Depending on the UART1 control register’s content, either P12[2:0] or P1[3:1] can be used as the UART1 ports.
Revision 0.0
Page 4 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
8. ELECTRICAL SPECIFICATION
8.1. Absolute Maximum Rating
Item
Power Supply Voltage (logic)
Power Supply Voltage (analog)
Power Supply Voltage (LCD)
Input Voltage
Power Dissipation (Ta = 70°C)
Storage Temperature
Operating Temperature
Symbol
Rating
Unit
VDD
AVDD
VLCD/VLCD1/VLCD2
VIN
Pd
TSTG
Topr
-0.5 to 6.0
-0.5 to 6.0
-0.5 to 6.0
-0.5 to VDD+0.5
TBD
-20 to 125
0 to 70
V
V
V
V
mW
°C
°C
8.2. Recommended Operating Condition
Item
Power Supply Voltage (logic)
Power Supply Voltage (analog)
Power Supply Voltage (LCD)
Input Voltage (digital)
Input Voltage (analog)
Operating Temperature
Symbol
Min.
Typ.
Max.
Unit
VDD
AVDD
VLCD
VLCD1
VLCD2
VIN
VIN
TOPR
2.7
2.7
VLCD2
0
0
0
0
-
3.6
3.6
VDD
VLCD
VLCD1
VDD
VDD
70
V
V
V
V
V
°C
8.3. Leakage Current and Capacitance
Symbol
IIN
IOZ
CIN
CIN
CBID
*Note1:
Parameter
Condition
Input current
Tri-state leakage current
Input capacitance *Note1
Output capacitance *Note1
Bidirectional buffer capacitance *Note1
No pull-up or pull-down
Min.
Typ.
Max.
Unit
-10
-10
-
-
10
10
5
5
5
μA
μA
pF
pF
pF
capacitance value are specified without the package
8.4. DC Electrical Characteristics
(VDD=3.3V±10%, AVDD=3.3V±10%, operating temperature = 0°C - 70°C unless specified otherwise)
Symbol Parameter
Condition
Min.
Typ.
Max.
Unit
VDD
AVDD
VIH
VIL
RPU
RPD
VINA
IOL
IOH
Idd_opr
Idd_idle
*Note2:
*Note3:
*Note4:
Revision 0.0
Supply Voltage (logic)
Supply Voltage (analog)
Input high voltage
Input low voltage
Pull-up resistance
Pull-down resistance
FMIN,AMIN,IFIN input voltage
Output low current
Output high current
Core operating current
Clock Mode current
Core operating mode
Clock mode
Core operating mode
Clock mode
VIN = 0V
VIN = VDD
VOL = 0.4V *Note4
VOH = VDD-0.4V *Note4
*Note2
VDD=3.3V, T=25°C *Note3
2.7
2.4
2.7
2.4
0.7*VDD
30k
30k
150
2.1
1.4
-
45k
45k
3.3
2.3
7
80
3.6
3.6
3.6
3.6
0.3*VDD
75k
75k
10
100
V
V
V
V
Ω
Ω
mVpp
mA
mA
mA
μA
LCD is ON. The CPU clock source is from the internal PLL clock. No active load is being driven. All
inputs = 0V or VDD.
LCD is ON. The CPU clock source is from the 32kHz oscillator pads. No active load is being driven.
All inputs = 0V or VDD.
Excluding PLLFLT, ATONE, XOSC.
Page 5 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
9. PACKAGE INFORMATION
Revision 0.0
Page 6 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
10. SOLDERING INDICATION
This section gives a very brief insight to a complex technology. There is no soldering method that is ideal for all
surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for
fine pitch SMDs. In these situations reflow soldering is recommended.
1. Reflow Soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should
preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.
2. Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used, the following conditions must be observed for optimal results:
z
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
z
For packages with leads on two sides and a pitch:
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction
of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board.
The footprint must incorporate solder thieves at the downstream end.
z
For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the
printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250°C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
3. Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron
applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and
320 °C.
Revision 0.0
Page 7 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
4. Suitability of Surface Mount IC Packages for Wave and Reflow Soldering Methods
Package
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC (3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Soldering Method
Wave
Reflow (1)
(2)
Not suitable
Suitable
Not suitable
Suitable
Suitable
Suitable
Not recommended (3)(4)
Suitable
Not recommended (5)
Suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks
may occur due to vaporization of the moisture in them (the so called popcorn effect).
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at
bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, the package must be placed at a 45 angle to the solder wave direction. The package
footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch equal to or larger than 0.8 mm; it is
definitely not suitable for packages with a pitch equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch equal to or smaller than 0.5 mm.
Revision 0.0
Page 9 of 10
August 25, 2008
AP909
OTP Microcontroller with LCD Driver for
Wireless Audio Docking Application
Valence Semiconductor Design Limited
Unit 2001, 20/F, APEC Plaza,
49 Hoi Yuen Road, Kwun Tong, Hong Kong
Tel: (852) 2797 3288
Fax: (852) 2776 7770
Email: inquiry@valencetech.com
Website: http://www.valencetech.com
IMPORTANT NOTICE
“Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. ValenceTech Ltd. and its affiliates (“Valence”) believe that the
information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied).
Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the
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August 25, 2008