PHILIPS PMDXB600UNE

DF
N1
0
10B
-6
PMDXB600UNE
20 V, dual N-channel Trench MOSFET
16 September 2013
Product data sheet
1. General description
Dual N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small
DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using Trench
MOSFET technology.
2. Features and benefits
•
•
•
•
•
Trench MOSFET technology
Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm
Exposed drain pad for excellent thermal conduction
ElectroStatic Discharge (ESD) protection > 1 kV HBM
Drain-source on-state resistance RDSon = 470 mΩ
3. Applications
•
•
•
•
Relay driver
High-speed line driver
Low-side load switch
Switching circuits
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
-
20
V
VGS
gate-source voltage
-8
-
8
V
ID
drain current
-
-
600
mA
-
470
620
mΩ
Per transistor
VGS = 4.5 V; Tamb = 25 °C
[1]
Static characteristics (per transistor)
RDSon
drain-source on-state
resistance
[1]
VGS = 4.5 V; ID = 600 mA; Tj = 25 °C
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
2
drain 1 cm .
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PMDXB600UNE
NXP Semiconductors
20 V, dual N-channel Trench MOSFET
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
S1
Simplified outline
Graphic symbol
source TR1
D2
D1
1
6
2
G1
gate TR1
3
D2
drain TR2
4
S2
source TR2
5
G2
gate TR2
6
D1
drain TR1
Transparent top view
7
D1
drain TR1
DFN1010B-6 (SOT1216)
8
D2
drain TR2
7
2
3
G1
5
8
G2
4
S1
S2
017aaa256
6. Ordering information
Table 3.
Ordering information
Type number
Package
PMDXB600UNE
Name
Description
Version
DFN1010B-6
plastic thermal enhanced ultra thin small outline package; no
leads; 6 terminals
SOT1216
7. Marking
Table 4.
Marking codes
Type number
Marking code
PMDXB600UNE
00 10 00
MARKING CODE
(EXAMPLE)
READING
DIRECTION
MARK-FREE AREA
PIN 1
INDICATION MARK
VENDOR CODE
READING EXAMPLE:
11
01
10
Fig. 1.
YEAR DATE
CODE
aaa-007665
DFN1010B-6 (SOT1216) binary marking code description
PMDXB600UNE
Product data sheet
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20 V, dual N-channel Trench MOSFET
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
20
V
VGS
gate-source voltage
-8
8
V
ID
drain current
Per transistor
VGS = 4.5 V; Tamb = 25 °C
[1]
-
600
mA
VGS = 4.5 V; Tamb = 100 °C
[1]
-
400
mA
-
2.5
A
[2]
-
265
mW
[1]
-
380
mW
-
4025
mW
-
0.4
A
IDM
peak drain current
Tamb = 25 °C; single pulse; tp ≤ 10 µs
Ptot
total power dissipation
Tamb = 25 °C
Tsp = 25 °C
Source-drain diode
IS
source current
Tamb = 25 °C
[1]
Per device
Tj
junction temperature
-55
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
PMDXB600UNE
Product data sheet
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
[2]
drain 1 cm .
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
2
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PMDXB600UNE
NXP Semiconductors
20 V, dual N-channel Trench MOSFET
017aaa001
120
017aaa002
120
Pder
(%)
Ider
(%)
80
80
40
40
0
- 75
Fig. 2.
- 25
25
75
0
- 75
125
175
Tamb (°C)
Normalized total power dissipation as a
function of ambient temperature
Fig. 3.
- 25
25
75
125
175
Tamb (°C)
Normalized continuous drain current as a
function of ambient temperature
aaa-008997
10
Limit RDSon = VDS/ID
ID
(A)
tp = 10 µs
1
tp = 100 µs
10-1
tp = 1 ms
DC; Tsp = 25 °C
tp = 10 ms
DC; Tamb = 25 °C;
drain mounting pad 1 cm2
10-2
10-1
1
tp = 100 ms
10
102
VDS (V)
IDM = single pulse
Fig. 4.
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drainsource voltage
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance
from junction to
ambient
in free air
Min
Typ
Max
Unit
[1]
-
410
475
K/W
[2]
-
285
330
K/W
Per transistor
Rth(j-a)
PMDXB600UNE
Product data sheet
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
Symbol
Parameter
Rth(j-sp)
thermal resistance
from junction to solder
point
[1]
[2]
Conditions
Min
Typ
Max
Unit
-
27
31
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm .
aaa-006902
103
duty cycle = 1
Zth(j-a)
(K/W)
0.75
0.5
102
0.25
0.33
0.2
0.1
0.05
0
0.02
0.01
10
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-006903
103
Zth(j-a)
(K/W)
duty cycle = 1
0.75
0.5
102
0.25
0.33
0.2
0.1
0.05
0
10
10-3
0.02
0.01
10-2
10-1
FR4 PCB, mounting pad for drain 1 cm
Fig. 6.
1
10
102
tp (s)
103
2
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMDXB600UNE
Product data sheet
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics (per transistor)
V(BR)DSS
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = 25 °C
20
-
-
V
VGSth
gate-source threshold
voltage
ID = 250 µA; VDS = VGS; Tj = 25 °C
0.45
0.7
0.95
V
IDSS
drain leakage current
VDS = 20 V; VGS = 0 V; Tj = 25 °C
-
-
1
µA
IGSS
gate leakage current
VGS = 8 V; VDS = 0 V; Tj = 25 °C
-
-
10
µA
VGS = -8 V; VDS = 0 V; Tj = 25 °C
-
-
-10
µA
VGS = 4.5 V; VDS = 0 V; Tj = 25 °C
-
-
1
µA
VGS = -4.5 V; VDS = 0 V; Tj = 25 °C
-
-
-1
µA
VGS = 4.5 V; ID = 600 mA; Tj = 25 °C
-
470
620
mΩ
VGS = 4.5 V; ID = 600 mA; Tj = 150 °C
-
760
1000
mΩ
VGS = 2.5 V; ID = 500 mA; Tj = 25 °C
-
620
850
mΩ
VGS = 1.8 V; ID = 100 mA; Tj = 25 °C
-
845
1300
mΩ
VGS = 1.5 V; ID = 10 mA; Tj = 25 °C
-
1125
3000
mΩ
VGS = 1.2 V; ID = 1 mA; Tj = 25 °C
-
2210
-
mΩ
VDS = 5 V; ID = 0.6 A; Tj = 25 °C
-
1
-
S
RDSon
gfs
drain-source on-state
resistance
forward
transconductance
Dynamic characteristics (per transistor)
QG(tot)
total gate charge
VDS = 10 V; ID = 600 mA; VGS = 4.5 V;
-
0.4
0.7
nC
QGS
gate-source charge
Tj = 25 °C
-
0.1
-
nC
QGD
gate-drain charge
-
0.1
-
nC
Ciss
input capacitance
VDS = 10 V; f = 1 MHz; VGS = 0 V;
-
21.3
-
pF
Coss
output capacitance
Tj = 25 °C
-
5.4
-
pF
Crss
reverse transfer
capacitance
-
4.2
-
pF
td(on)
turn-on delay time
VDS = 10 V; ID = 600 mA; VGS = 4.5 V;
-
5.6
-
ns
tr
rise time
RG(ext) = 6 Ω; Tj = 25 °C
-
9.2
-
ns
td(off)
turn-off delay time
-
19
-
ns
tf
fall time
-
51
-
ns
-
0.8
1.2
V
Source-drain diode (per transistor)
VSD
source-drain voltage
PMDXB600UNE
Product data sheet
IS = 0.36 A; VGS = 0 V; Tj = 25 °C
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
aaa-008998
2.5
ID
(A)
aaa-008999
10-3
4.5 V
ID
(A)
2.0
2.5 V
10-4
1.5
min
1.0
1.8 V
0.5
typ
max
10-5
1.5 V
VGS = 1.2 V
0
Fig. 7.
0
1
2
3
10-6
4
VDS (V)
0
0.5
1.0
VGS (V)
1.5
Tj = 25 °C
Tj = 25 °C; VDS = 5 V
Output characteristics: drain current as a
Fig. 8.
function of drain-source voltage; typical values
Sub-threshold drain current as a function of
gate-source voltage
aaa-009000
3
RDSon
(Ω)
1.5 V
1.2 V
1.8 V
aaa-009001
3
2V
RDSon
(Ω)
2.5 V
2
2
3V
1
1
Tj = 150 °C
VGS = 4.5 V
0
0
0.5
1.0
1.5
2.0
ID (A)
Tj = 25 °C
0
2.5
Tj = 25 °C
Fig. 9.
Product data sheet
1
2
3
4
VGS (V)
5
ID = 0.6 A
Drain-source on-state resistance as a function
of drain current; typical values
PMDXB600UNE
0
Fig. 10. Drain-source on-state resistance as a function
of gate-source voltage; typical values
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
aaa-009002
2.5
aaa-009003
2.0
ID
(A)
a
2.0
1.5
1.5
1.0
1.0
Tj = 150 °C
0.5
0
0
1
Tj = 25 °C
2
0.5
3
4
VGS (V)
0
-60
5
VDS > ID × RDSon
Fig. 11. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
aaa-009004
1.5
0
60
120
180
Fig. 12. Normalized drain-source on-state resistance
as a function of junction temperature; typical
values
aaa-009005
102
VGS(th)
(V)
Tj (°C)
C
(pF)
1.0
Ciss
10
max
Coss
0.5
typ
Crss
min
0
-60
0
60
120
Tj (°C)
1
10-1
180
ID = 0.25 mA; VDS = VGS
Product data sheet
10
VDS (V)
102
f = 1 MHz; VGS = 0 V
Fig. 13. Gate-source threshold voltage as a function of
junction temperature
PMDXB600UNE
1
Fig. 14. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
aaa-009006
5
VDS
VGS
(V)
ID
4
VGS(pl)
3
VGS(th)
VGS
2
QGS1
QGS2
QGS
1
QGD
QG(tot)
017aaa137
0
0
0.1
0.2
0.3
Fig. 16. MOSFET transistor: Gate charge waveform
definitions
0.4
0.5
QG (nC)
ID = 0.6 A; VDS = 10 V; Tamb = 25 °C
Fig. 15. Gate-source voltage as a function of gate
charge; typical values
aaa-009007
2.5
IS
(A)
2.0
1.5
1.0
0.5
0
Tj = 150 °C
0
0.4
Tj = 25 °C
0.8
1.2
1.6
2.0
VSD (V)
VGS = 0 V
Fig. 17. Source current as a function of source-drain voltage; typical values
11. Test information
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig. 18. Duty cycle definition
PMDXB600UNE
Product data sheet
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20 V, dual N-channel Trench MOSFET
12. Package outline
0.35
0.35
0.15
0.23
1
3
0.125
0.205
0.22
0.30
0.95
1.05
6
0.04
max
2
0.34
0.40
Dimensions in mm
5
4
0.32
0.40
0.275 0.275
1.05
1.15
13-03-05
Fig. 19. Package outline DFN1010B-6 (SOT1216)
PMDXB600UNE
Product data sheet
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20 V, dual N-channel Trench MOSFET
13. Soldering
Footprint information for reflow soldering of DFN1010B-6 package
SOT1216
0.9
0.35
0.35
0.15 0.2 (6x) 0.15
1.3
1.2
0.35
0.25
0.5
0.6
0.35
0.25
1.1
0.3 (6x)
1
1.35
solder land
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
Issue date
12-11-23
13-03-06
sot1216_fr
Fig. 20. Reflow soldering footprint for DFN1010B-6 (SOT1216)
PMDXB600UNE
Product data sheet
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20 V, dual N-channel Trench MOSFET
14. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMDXB600UNE v.1
20130916
Product data sheet
-
-
PMDXB600UNE
Product data sheet
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NXP Semiconductors
20 V, dual N-channel Trench MOSFET
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
15. Legal information
15.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
15.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PMDXB600UNE
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
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20 V, dual N-channel Trench MOSFET
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
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liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
PMDXB600UNE
Product data sheet
All information provided in this document is subject to legal disclaimers.
16 September 2013
© NXP N.V. 2013. All rights reserved
14 / 15
PMDXB600UNE
NXP Semiconductors
20 V, dual N-channel Trench MOSFET
16. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................3
9
Thermal characteristics .........................................4
10
Characteristics ....................................................... 6
11
Test information ..................................................... 9
12
Package outline ................................................... 10
13
Soldering .............................................................. 11
14
Revision history ................................................... 12
15
15.1
15.2
15.3
15.4
Legal information .................................................13
Data sheet status ............................................... 13
Definitions ...........................................................13
Disclaimers .........................................................13
Trademarks ........................................................ 14
© NXP N.V. 2013. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 September 2013
PMDXB600UNE
Product data sheet
All information provided in this document is subject to legal disclaimers.
16 September 2013
© NXP N.V. 2013. All rights reserved
15 / 15