RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT TOP OF PCB LP 14,89 0,586 21,27 0,38 ±0,10 0,015 ±0,004 115,95 ±0,20 4,565 ±0,008 114,94 4,525 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 3,20 0,126 1 13,6 7 X 13,97 = (97,79 3,850 ) 3,69 0,145 109,22 ±0,13 4,300 ±0,005 10,89 0,429 NOTE NOTE NOTE NOTE Mate ri al s & Fi n i sh Insulation body Contact material Contact finish, mating zone Contact finish termination zone Shell/shield material Plating shield / shielding pin Stand ard ap p l i c . Standard description Standard description Thickness of plating Thickness of plating Standard description A sse mb l y p ro c e ss Packaging Solder temperature Suitable assembly process A p p ro v al s UL insulation body UL File No. RoHS compliant UL 94 Val ue T e st Data Stan d ard ap p l i c . Val u e PBT 30% Me c hani c al p ro p e rti e s . C5210 (acc. JIS) Insertion/withdrawal force IEC 603-7 max. 20 N see chart Mechanical operations IEC 512-5, 9a min. 1.000 80 µin matte Sn over 50 µin Ni Effectiveness of connector C2680 (acc. JIS) coupling device IEC 512-8, 15f 50 N 50 µin Ni / 80 µin Sn El e c tri c al p ro p e rti e s Cre e p ag e / c l e aranc e d i stan c e s a) Contact - contact IEC 807-3 0,52 mm Tray b) Contact - shell IEC 807-3 min 1,0 mm 235°C at 3-5s Vo l tag e p ro o f (D i e l e c tri c Wi thstan d Vo l tag e ) wave a) Contact - contact IEC 512-2, 4a min. 1.000 V AC/DC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC Current carrying capacity IEC 512-3, 5b 1,5 A @ 25° C V0 Contact resistance IEC 512-2, 2a max. 30 mOhm E145613 Insulation resistance IEC 512-2, 3a min. 500 MOhm Yes Env i ro nme n tal p ro p e rti e s Operation temperature 0 - 70° C Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. T e chnic al spe cif icat io ns 1: SIDE GROUNIDNG PIN IN FRONT 3,68 mm 2: REAR GROUNDING PIN BETWEEN EVERY PORT (T) 3: PANEL GROUND FLANGES BOTH SIDES TOP AND BOTTON (GF5) 4: RoHS COMPLIANT CONTACT FINISH OBERFLÄCHENBEHANDLUNG PART NO. IDENT. NR. TRANSMISSION REQUIREMENT ÜBERTRAGUNGSANFORDERUNG 133618 133216 133225 133609 CATEGORY 3/4 1,27 µm Au [50 µin], OVER 1,27 µm Ni [50 µin] CATEGORY 3/4 0,8 µm Au [30 µin], OVER 1,27 µm Ni [50 µin] CATEGORY 5 0,8 µm Au [30 µin], OVER 1,27 µm Ni [50 µin] 0,8 µm Au [30 µin], OVER 1,27 µm Ni [50 µin] CATEGORY 5E Tolerances Information: Scale 2:1 All Dimensions in mm [in] All rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please contact one of the ERNI companies before using. Designation Subject to modification without prior notice. Drawing will not be updated. MOD JACK - MJR 8P8C, 1X8 133804 www.ERNI.com h 14.10.2014 Index Date Class MJ I (1/2) A3 RECOMMENDED PCB LAYOUT (COMPONENT SIDE VIEW) EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 107,95 4,250 96,52 3,800 93,98 3,700 82,55 3,250 80,01 3,150 68,58 2,700 66,04 2,600 54,61 2,150 52,07 2,050 40,64 1,600 38,10 1,500 26,67 1,050 24,13 0,950 2,54 0,100 12,70 0,500 10,16 0,400 8 1 8 8 1 1 8 1 8 1 1 8 8 8 1 1 0,89 ±0,07 0,035 ±0,003 X64 1,27 0,050 3,68 0,145 8,89 0,350 10,16 0,400 2,54 0,100 3,25 ±0,07 0,128 ±0,003 X3 1,60 ±0,07 0,063 ±0,003 X9 2,73 0,107 2,73 0,107 1:1 Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. 109,22 ±0,13 4,300 ±0,005 Tolerances Information: Scale 2:1 All Dimensions in mm [in] All rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please contact one of the ERNI companies before using. Designation Subject to modification without prior notice. Drawing will not be updated. MOD JACK - MJR 8P8C, 1X8 133804 www.ERNI.com h 14.10.2014 Index Date Class MJ I (2/2) A3