Addendum MF1MOA4S50 contactless chip card module

MF1 MOA4 S50
Contactless Chip Card Module Specification
Rev. 3.2 — 19 December 2006
Product data sheet
083032
PUBLIC
1. General description
1.1 Addendum
This document gives specifications for the product MF1 MOA4 S50.
The MF1 MOA4 S50 is the integrated circuit MF1 ICS50 in the package SOT500BA2.
Therefore this document encompasses all information not covered by the specification of
the package and/or the functional specification of the integrated circuit.
Detailed information on the package is given in the “MOA4 contactless chip card module
specification”.
Functionality of the integrated circuit is described in the “MF1 IC S50 functional
specification”.
1.2 Chip
Functionality of the integrated circuit is described in the document “MF1 IC S50 functional
specification”.
2. Ordering information
Table 1.
Ordering information
Type number
Package
Name
MF1 MOA4 S50 / D
Description
Ordering Code
Silicon Source ICN, ASMC
12 NC: 9352 737 01118
MF1 MOA4 S50
NXP Semiconductors
Contactless Chip Card Module Specification
3. Limiting values
Table 2.
Limiting values[1][2][3]
In accordance with the Absolute Maximum Rating System(IEC 134)
Symbol
Parameter
Min
Max
Unit
TSTOR
Storage temperature
-25
85
°C
TOP
Operating temperature
-25
70
°C
Processing temperature: refer to “MOA4 contactless chip card module specification“
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device
[2]
These are stress ratings only. Operation of the device at these or any other conditions above those given in
the Characteristics section of the specification is not implied
[3]
Exposure to limiting values for extended periods may affect device reliability
4. Characteristics
4.1 Characteristics
Table 3.
Electrical characteristics
Symbol
Parameter
fIN
input frequency
CIN
Input capacitance
[1][2][3]
Conditions
22 °C, Cp-D,
Min
Typ
Max
Unit
-
13.56
-
MHz
14.4
16.1
17.4
pF
2.9
-
ms
(LCR meter HP4258) 13.56 MHz, 2 V
tW
EEPROM write time
-
tRET
EEPROM data
retention
10
years
NWE
EEPROM write
endurance
105
cycles
VESD
electrostatic
discharge voltage
LA-LB
2
kV
[4]
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device
[2]
These are stress ratings only. Operation of the device at these or any other conditions above those given in
the Characteristics section of the specification is not implied
[3]
Exposure to limiting values for extended periods may affect device reliability
[4]
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kW
5. Support information
For additional information, please visit: http://www.nxp.com
083032
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 3.2 — 19 December 2006
2 of 5
MF1 MOA4 S50
NXP Semiconductors
Contactless Chip Card Module Specification
6. Revision history
Table 4.
Revision history
Document ID
Modifications:
Release date
Data sheet status
19 December
2006
Product data sheet
Supersedes
5.1
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
083032
Product data sheet
Change notice
© NXP B.V. 2006. All rights reserved.
Rev. 3.2 — 19 December 2006
3 of 5
MF1 MOA4 S50
NXP Semiconductors
Contactless Chip Card Module Specification
7. Legal information
7.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
7.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
7.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
7.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Mifare — is a trademark of NXP B.V.
8. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
083032
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 3.2 — 19 December 2006
4 of 5
MF1 MOA4 S50
NXP Semiconductors
Contactless Chip Card Module Specification
9. Tables
Table 1.
Table 2.
Ordering information . . . . . . . . . . . . . . . . . . . . .1
Limiting values[1][2][3] . . . . . . . . . . . . . . . . . . . . . .2
Table 3.
Table 4.
Characteristics [1][2][3] . . . . . . . . . . . . . . . . . . . . . 2
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 3
10. Contents
1
1.1
1.2
2
3
4
5
5.1
6
7
8
8.1
8.2
8.3
8.4
9
10
11
General description . . . . . . . . . . . . . . . . . . . . . .
Addendum . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . .
Support information . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
4
4
4
4
4
5
6
6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 December 2006
Document identifier: 083032