LX7205.pdf

LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
KEY FEATURES
DESCRIPTION
ƒ Flip Chip construction
ƒ Bi-directional EMI/RFI low-pass
filter
ƒ ESD protection with integrated
line termination resistor
ƒ Bi-directional TVS protects
against negative ESD voltages
in audio applications
ƒ Low TVS operating voltage
(5.0V)
ƒ Low leakage current
ƒ 0.5mm Pitch Chip Scale
Package designed for direct
assembly on FR4 PCB using
conventional assembly
techniques
LX7205 is an integrated low pass
filter with ESD protection that filters
out the undesired frequencies as well as
protecting the port against both positive
and negative ESD voltages. The device
is a 3x2 array flip chip and measures
1.5 x 1.0 x 0.65 mm. The small size
and profile of this device is ideally
suited for portable applications. The
absence of leadframe and bondwires
minimizes inductance and optimizes the
high frequency filter performance.
LX7205 exceeds the requirements of
IEC61000-4-2 (15KV air discharge and
8KV contact discharge).
WWW . Microsemi .C OM
Proliferation of digital portable
electronic equipment has created a
noisy environment in which all
devices become susceptible to
Electromagnetic Interference (EMI).
Interference
form
cell
phone
frequencies of 800-900 MHz and
1.9GHz as well as the growing
wireless LAN frequencies of 2.46GHz can couple into the speaker port
of a handheld device and adversely
affect its performance. FCC Part 15
sets maximum allowable emission and
immunity levels for all digital devices.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPLICATIONS
BENEFITS
ƒ
ƒ
ƒ
ƒ
ƒ Cell phones and Accessories
ƒ Personal Digital Assistants
(PDA’s)
ƒ Pagers
ƒ MP3 Players
ƒ Desktops and Notebook
Computers
ƒ Digital Camcorders
Filter response characterized up to 6 GHz
<2dB insertion loss in the pass band
>20dB attenuation in the 800-900 MHz range
>12dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz
PRODUCT HIGHLIGHT
Device Schematic
A1
Earpiece 1
Input
C
A2, B2
1
Earpiece 2
Output
C
2
3
LX7205 Bumps up (Not to Scale)
LX7205
GND
A
B3
10Ω
C
B
Earpiece 1
Output
C
GND
A3
Earpiece 2
Input
B1
10Ω
A2, B2
PACKAGE ORDER INFO
TJ (°C)
-40 to 125
SP
0.5mm Pitch Chip Scale
Package (CSP)
LX7205ISP
Note: Available in Tape & Reel. Append the letters “TR” to the part
number. (i.e. LX7205ISP-TR)
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
WWW . Microsemi .C OM
Peak Pulse Power (tp = 8/20 µs ) IEC61000-4-5 .......................................... 250W
Peak Pulse Current (tp = 8/20 µs ) IEC61000-4-5 ...........................................26A
ESD Air Discharge per IEC61000-4-2 ......................................................... 30KV
ESD Contact Discharge per IEC61000-4-2 .................................................. 30KV
Operating Temperature ................................................................-40°C to +125°C
Storage Temperature Range.........................................................-55°C to +150°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
SP PACKAGE
(Bump Up Angle)
FUNCTIONAL PIN DESCRIPTION
Name
Description
A1
Line 1 Input
B1
Line 1 Output
A2 & B2
Ground
A3
Line 2 Input
B3
Line 2 Output
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA
where otherwise noted and the following test conditions:.
Symbol
Stand-Off Voltage
Breakdown Voltage
Leakage Current
Series Resistance, A1 to B1
Series Resistance, A3 to B3
Temperature Coefficient of RS
Capacitor, A1 or B1 to GND
Capacitor, A3 or B3 to GND
VRWM
VBR
IR
RS
RS
TCOEFF
C
C
Copyright © 2004
Rev. 1.0, 2004-10-05
Test Conditions
IR = 1mA
VRWM = ±5.0V, TA = 25°C
Each Line
VR = 2.5V, f = 1MHz
VR = 2.5V, f = 1MHz
Min
6
-1
9
9
115
115
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
+125°C except
LX7205
Typ
10
10
200
145
145
Max
5.0
1
11
11
175
175
Units
V
V
µA
Ω
Ω
Ppm
pF
pF
PACKAGE DATA
Parameter
≤
Page 2
LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
RECOMMENDED PCB PARAMETERS
WWW . Microsemi .C OM
Parameter
Value
Cu pad size
0.275 +0.0/-0.025 mm
Pad Pitch
0.5mm
Pad Definition
Non-Solder Mask Defined
Solder Mask Opening
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Solder Stencil
Pad Protective Finish
Non-Solder Mask Defined Cu
Pad (OSP finish)
0.275 mm dia.
Solder Mask Opening
0.325 mm dia.
Figure 1 – Recommended Non-Solder Mask Defined Pad
Temperature (oC)
240 oC max
183 oC
150 oC
~ 1min
Flux Activation
Zone
~2 min
Solder Reflow
Zone
~ 1min
APPLICATIONS
Preheat Zone
Cooling Zone
Time (s)
Figure 2 – Solder Reflow Profile. Max Temperature is 240°C and maximum time above liquious (183°C) is 60 seconds
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
0 Acqs
TEK Stopped Single Seq
1Acqs
WWW . Microsemi .C OM
TEK Preview Single Seq
8KV Contact ESD
M 40.0ns
5.0V
Chart 1 – 8KV ESD Input pulse as per IEC61000-4-2. Vertical scale
is equivalent to 5A/DIV
log 5dB/
Chart 2 – Clamping Characteristics when device subjected to an 8KV
ESD pulse.
REF 0dB
12
Clamping Voltage V C (V)
S21
0 dB
Insertion Loss
M 40.0ns
Ch1 5.0V
-10 dB
-20 dB
10
8
6
Line To GND
4
GND t o Line
2
0
5
10
15
20
25
30
P e a k P uls e C urre nt _ I P P ( A )
-30 dB
Chart 4 – Clamping Voltage vs. Peak Pulse Current.
Waveform parameters: Tr = 8µs, td = 20µs. Per
IEC61000-4-5
-40 dB
1
10
100
1000
6000
CHARTS
0.3
Frequency (MHz)
Chart 3 – Typical frequency response curve of the EMI filter
(A1 – B1 or A3 – B3)
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
PACKAGE DIMENSIONS & MARKING
WWW . Microsemi .C OM
SP
0.5mm Chip Scale Package
1.5mm
0.25mm dia. 63/37 Sn/Pb
Eutectic Solder Bumps
Pin A1 Identification Mark
0.5mm
05
YWWA
B
0.5mm
1.0 mm
A
Y = Year | WW = Work Week | A = Lot Code
SP Package – Bump Side Down
2
1
3
Bumps Up View
05
YWWA
05
YWWA
05
YWWA
Part Orientation in Tape
MECHANICALS
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
LX7205
®
TM
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
TAPE SPECIFICATIONS
A
B
J
Dim
A
B
C
D
E
F
G
H
J
K
L
L
P
D
H
K
E
5°M A X
F
G
3.50 mm ± 0.05
8.00 mm + 0.30
-0.10
4.00 mm ± 0.10
0.254 mm ± 0.02
32° MAX
2.67 mm ±0.05
MILLIMETERS
MIN
MAX
3.90
4.10
1.95
2.05
1.65
1.85
3.45
3.55
1.90
2.10
0.67
0.77
1.03
1.13
1.75
1.85
1.40
1.60
0.45
0.55
0.252 0.256
2.00 mm ± 0.05
4.00 mm ± 0.10
0.51 mm
WWW . Microsemi .C OM
C
1.14 mm ± 0.05
MECHANICALS
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P RODUCTION D ATA S HEET
NOTES
WWW . Microsemi .C OM
NOTES
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in
any way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reserves the right to change the
configuration and performance of the product and to discontinue product at any time.
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7