NSC SCAN921821

SCAN921821
Dual 18-Bit Serializer with Pre-emphasis, IEEE 1149.1
(JTAG), and At-Speed BIST
General Description
Features
The SCAN921821 is a dual channel 18-bit serializer featuring signal conditioning, boundary SCAN, and at-speed BIST.
Each serializer block transforms an 18-bit parallel LVCMOS/
LVTTL data bus into a single Bus LVDS data stream with
embedded clock. This single serial data stream with embedded clock simplifies PCB design and reduces PCB cost by
narrowing data paths that in turn reduce PCB size and
layers. The single serial data stream also reduces cable
size, the number of connectors, and eliminates clock-to-data
and data-to-data skew.
Each channel also has an 8-level selectable pre-emphasis
feature that significantly extends performance over lossy
interconnect. Each channel also has its own powerdown pin
that saves power by reducing supply current when the channel is not being used.
The SCAN921821 also incorporates advanced testability
features including IEEE 1149.1 and at-speed BIST PRBS
pattern generation to facilitate verification of board and link
integrity
n 15-66 MHz Dual 18:1 Serializer with 2.376 Gbps total
throughput
n 8-level selectable pre-emphasis on each channel drives
lossy cables and backplanes
n > 15kV HBM ESD protection on Bus LVDS I/O pins
n Robust BLVDS serial data transmission with embedded
clock for exceptional noise immunity and low EMI
n Power saving control pin for each channel
n IEEE 1149.1 "JTAG" Compliant
n At-Speed BIST - PRBS generation
n No external coding required
n Internal PLL, no external PLL components required
n Single +3.3V power supply
n Low power: 260 mW (typ) per channel at 66 MHz with
PRBS-15 pattern
n Single 3.3 V supply
n Fabricated with advanced CMOS process technology
n Industrial −40 to +85˚C temperature range
n Compact 100-ball FBGA package
Block Diagram
20084401
© 2004 National Semiconductor Corporation
DS200844
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SCAN921821 - Dual 18-Bit Serializer with Pre-emphasis, IEEE 1149.1 (JTAG), and At-Speed BIST
November 2004
SCAN921821
Absolute Maximum Ratings (Note 1)
Derating Above 25˚C
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
θJC
Supply Voltage (VDD)
−0.3V to +4V
Supply Voltage (VDD)
Ramp Rate
< 30 V/ms
28.57 mW/˚C
Thermal resistance θJA
35˚C/W
11.1˚C/W
ESD Rating
HBM, 1.5 KΩ, 100 pF
> 8 kV
> 15 kV
> 1200 V
> 2 kV
All pins
LVCMOS/LVTTL Input
Voltage
−0.3V to (VDD +0.3V)
LVCMOS/LVTTL Output
Voltage
−0.3V to (VDD +0.3V)
Bus LVDS Driver Output
Voltage
−0.3V to +3.9V
Bus LVDS Output Short
Circuit Duration
10ms
Bus LVDS pins
MM, 0Ω, 200 pF
Junction Temperature
+150˚C
Storage Temperature
−65˚C to +150˚C
CDM
Recommended Operating
Conditions
Lead Temperature
(Soldering, 4 seconds)
+220˚C
Min
Nom
Max
Units
Supply Voltage (VDD)
3.15
3.3
3.45
V
Operating Free Air
Temperature (TA)
−40
+25
+85
˚C
Clock Rate
15
Supply Noise
66
MHz
100
mV p-p
Maximum Package Power Dissipation at 25˚C
FBGA-100
3.57 W
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVCMOS/LVTTL Input DC Specifications
VIH
High Level Input
Voltage
2.0
VDD
V
VIL
Low Level Input
Voltage
GND
0.8
V
VCL
Input Clamp Voltage
ICL = −18 mA
−1.5
-0.7
IINH
High Level Input
Current
VIN = VDD = VDDMAX
−20
±2
+20
µA
IINL
Low Level Output
Current
VIN = VSS, VDD = VDDMAX
−10
±2
+10
µA
V
1149.1 (JTAG) DC Specifications
VIH
High Level Input
Voltage
2.0
VDD
V
VIL
Low Level Input
Voltage
GND
0.8
V
VCL
Input Clamp Voltage
ICL = −18 mA
−1.5
IINH
High Level Input
Current
VIN = VDD = VDDMAX
-20
+20
µA
IINL
Low Level Output
Current
VIN = VSS, VDD = VDDMAX
-200
+200
µA
VOH
High Level Output
Voltage
IOH = −9 mA
2.3
VDD
mV
VOL
Low Level Output
Voltage
IOL = 9 mA
GND
0.5
mV
IOS
Output Short Circuit
Current
VOUT = 0 V
-100
-50
mA
IOZ
Output Tri-state
Current
PWDN or EN = 0.8V, VOUT = 0 V
-10
+10
µA
PWDN or EN = 0.8V, VOUT = VDD
-30
+30
µA
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2
-0.7
-80
V
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Figure 10, RL = 100Ω
450
500
550
mV
2
15
mV
1.2
1.25
V
2.7
15
mV
Bus LVDS Output DC Specifications
VOD
Output Differential
Voltage (DO+) (DO-)
∆VOD
Output Differential
Voltage Unbalance
VOS
Offset Voltage
∆VOS
Offset Voltage
Unbalance
QPOV
Pre-Emphasis Output
Voltage Ratio
| VODPRE / VOD |
IOS
Output Short Circuit
Current
IOZ
TRI-STATE Output
Current
1.05
Pre-Emphasis Level = 1
1.10
1.24
1.35
Pre-Emphasis Level = 2
1.35
1.47
1.55
Pre-Emphasis Level = 3
1.55
1.70
1.80
Pre-Emphasis Level = 4
1.80
1.91
1.95
Pre-Emphasis Level = 5
1.95
2.08
2.20
Pre-Emphasis Level = 6
2.10
2.21
2.35
Pre-Emphasis Level = 7
2.15
2.30
2.50
DO = 0V, Din = H, PWDN and EN = 2.4V
-10
-25
-75
mA
PWDN or EN = 0.8V, DO = 0V (Note 4)
-10
µA
-55
±1
±6
+10
PWDN or EN = 0.8V, DO = VDD (Note 4)
+55
µA
f = 66 MHz, PRBS-15
Pattern
160
225
mA
f = 66 MHz, Worst
Case Pattern
(Checker-Board
Pattern)
180
mA
f = 66 MHz, PRBS-15
Pattern
240
mA
f = 66 MHz, Worst
Case Pattern
(Checker-Board
Pattern)
280
325
mA
1.0
3.0
mA
Power Supply Current (DVDD, PVDD and AVDD Pins)
IDD
IDDP
IDDX
Total Supply Current
(includes load
current)
Total Supply Current
with Pre-Emphasis
(includes load
current)
Supply Current
Powerdown
CL = 15pF,
RL = 100 Ω
CL = 15pF,
RL = 100 Ω
PWDN = 0.8V, EN = 0.8V
Timing Requirements for TCLK
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Units
tTCP
Transmit Clock
Period
Conditions
15.2
T
66.7
ns
tTCIH
Transmit Clock High
Time
0.4T
0.5T
0.6T
ns
tTCIL
Transmit Clock Low
Time
0.4T
0.5T
0.6T
ns
tCLKT
TCLK Input
Transition Time
3
6
ns
tJIT
TCLK Input Jitter
80
ps (RMS)
(Note 5)
3
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SCAN921821
DC Electrical Characteristics
SCAN921821
AC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
0.3
0.4
ns
0.3
0.4
ns
Serializer AC Specifications
tLLHT
Bus LVDS
Low-to-High
Transition Time
tLHLT
Bus LVDS
High-to-Low
Transition Time
tDIS
DIN (0-17) Setup to
TCLK
tDIH
DIN (0-17) Hold from
TCLK
tHZD
DO ± HIGH to
TRI-STATE Delay
tLZD
DO ± LOW to
TRI-STATE Delay
tZHD
DO ± TRI-STATE to
HIGH Delay
tZLD
DO ± TRI-STATE to
LOW Delay
tSPW
SYNC Pulse Width
Figure 7,
RL = 100Ω
tPLD
Serializer PLL Lock
Time
Figure 6,
RL = 100Ω
tSD
Serializer Delay
Figure 8 , RL = 100Ω
tSKCC
Channel to Channel
Skew
tRJIT
Random Jitter
tDJIT
Deterministic Jitter
Figure 9, (Note 5)
Figure 2, (Note 5)
RL = 100Ω,
CL=10pF to GND
Figure 4, (Note 5)
RL = 100Ω,
CL=10pF to GND
1.9
ns
0.6
ns
3.9
10
ns
3.5
10
ns
3.2
10
ns
2.4
10
ns
5*tTCP
6*tTCP
ns
510*tTCP
1024*tTCP
ns
tTCP + 2.5 tTCP + 4.5 tTCP + 6.5
ns
70
ps
6.1
ps
(RMS)
Figure 5
RL = 100Ω,
CL=10pF to GND
Room Temperature, VDD = 3.3V,
66 MHz
15 MHz
-390
320
ps
66 MHz
-60
30
ps
1149.1 (JTAG) AC Specifications
fMAX
Maximum TCK Clock
Frequency
25
MHz
tS
TDI or TMS Setup to
TCK, H or L
2.4
ns
tH
TDI or TMS Hold
from TCK, H or L
2.8
ns
tW1
TCK Pulse Width, H
or L
10
ns
tW2
TRST Pulse Width, L
10
ns
tREC
Recovery Time,
TRST to TCK
2
ns
CL = 15pF,
RL = 500 Ω
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Typical values are given for VCC = 3.3V and TA = +25˚C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground except VOD, ∆VOD,
VTH and VTL which are differential voltages.
Note 4: IOZ is measured at each pin. The DOUT pin not under test is floated to isolate the TRI-STATE current flow.
Note 5: Guaranteed by Design (GBD) using statistical analysis.
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4
SCAN921821
AC Timing Diagrams and Test Circuits
20084403
FIGURE 1. “Worst Case” Serializer IDD Test Pattern
20084405
FIGURE 2. Serializer Bus LVDS Distributed Output Load and Transition Times
20084407
FIGURE 3. Serializer Input Clock Transition Time
20084408
FIGURE 4. Serializer Setup/Hold Times
5
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SCAN921821
AC Timing Diagrams and Test Circuits
(Continued)
20084409
FIGURE 5. Serializer TRI-STATE Test Circuit and Timing
20084410
FIGURE 6. Serializer PLL Lock Time, and PWRDN TRI-STATE Delays
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6
SCAN921821
AC Timing Diagrams and Test Circuits
(Continued)
20084434
FIGURE 7. SYNC Timing Delay
20084411
FIGURE 8. Serializer Delay
7
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SCAN921821
AC Timing Diagrams and Test Circuits
(Continued)
20084429
FIGURE 9. Deterministic Jitter and Ideal Bit Position
20084416
VOD = (DO+)–(DO−).
Differential output signal is shown as (DO+)–(DO−), device in Data Transfer mode.
FIGURE 10. VOD Diagram
Pre-emphasis Truth Table
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PEM LEVEL
PEM2
PEM1
PEM0
0
L
L
L
1
L
L
H
2
L
H
L
3
L
H
H
4
H
L
L
5
H
L
H
6
H
H
L
7
H
H
H
8
SCAN921821
Pin Diagram
SCAN921821TVV
Top View
20084402
9
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SCAN921821
Pin Descriptions
Pin Name
Pin Count
I/O, Type
Description
I, LVCMOS
Transmitter inputs. There is a pull-down circuitry on each of these pins which are
active if respective PWDNA or PWDNB pin is pulled high.
DATA PINS
DINA0-17
18
DINB0-17
18
DOUTAP
1
DOUTAN
1
DOUTBP
1
DOUTAN
1
O,BLVDS
Inverting and non-inverting differential transmitter outputs.
TIMING AND CONTROL PINS
TxCLK
1
ENA
1
ENB
1
PWDNA
1
PWDNB
1
SYNCA
1
SYNCB
1
I, LVCMOS
Transmitter reference clock. Used to strobe data at the inputs and to drive the
transmitter PLL. There is a pull-up circuitry on this pin which is always active.
I, LVCMOS
Transmitter outputs enable pins. There is a pull-down circuitry on each of these
pins that are active if corresponding PWDNA or PWDNB pin is pulled high.
When these pins are set to LOW, the transmitter outputs will be disabled. The
PLL will remain locked.
I, LVCMOS
Stand-by mode pins. There is a pull-down circuitry on each of these pins that are
always active. When these pins are set to LOW, the transmitter will be put in low
power mode and the PLL will lose lock.
I, LVCMOS
Transmitter synchronization pins. There is a pull-down circuitry on each of these
pins that are active if corresponding PWDNA or PWDNB pin is pulled high.
When these pins are set to HIGH, the transmitter will ignore incoming data and
send SYNC patterns to provide a locking reference to receiver(s).
I, LVCMOS
8-level pre-emphasis selection pins. There is a pull-down circuitry on each of
these pins which are active if corresponding PWDNA or PWDNB pin is pulled
high.
PRE-EMPHASIS PINS
PEMA0-2
PEMB0-2
3
3
JTAG PINS
TDI
1
I, LVCMOS
Test Data Input to support IEEE 1149.1. There is a pull-up circuitry on this pin
which is always active.
TDO
1
O, LVCMOS
Test Data Output to support IEEE 1149.1.
TMS
1
I, LVCMOS
Test Mode Select Input to support IEEE 1149.1. There is a pull-up circuitry on
this pin which is always active.
TCK
1
I, LVCMOS
Test Clock Input to support IEEE 1149.1. There is no failsafe circuitry on this pin.
TRST
1
I, LVCMOS
Test Reset Input to support IEEE 1149.1. There is a pull-up circuitry on this pin
which is always active.
BISTA
1
I, LVCMOS
BISTB
1
BIST selection pins. These pins select which transmitter will generate a PRBS
like data. There is a pull-down circuitry on these pins which are active if
corresponding PWDNA or PWDNB pin is pulled high.
BIST PINS
POWER PINS
AVDD
6
I, POWER
Power Supply for the LVDS circuitry.
DVDD
8
I, POWER
Power Supply for the digital circuitry.
PVDD
5
I, POWER
Power Supply for the PLL and BG circuitry.
AVSS
5
I, POWER
Ground reference for the LVDS circuitry.
DVSS
10
I, POWER
Ground reference for the digital circuitry.
PVSS
5
I, POWER
Ground reference for the PLL and BG circuitry.
1
N/A
OTHER PINS
NC
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Not connected.
10
inches (millimeters) unless otherwise noted
Dimensions shown in millimeters only
Order Number SCAN921821TSM
NS Package Number SLC100A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
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SCAN921821 - Dual 18-Bit Serializer with Pre-emphasis, IEEE 1149.1 (JTAG), and At-Speed BIST
Physical Dimensions