Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MKW21D256VHA5R MAPLGA 63 8*8*0.91 P0.5 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-01-20 00B7K00165D040A1.7 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes MKW21D256VHA5R MAPLGA 63 8*8*0.91 P0.5 ALL 0.188200 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.0027 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.0002025 g Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.00054 g Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.0002025 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 Bonding Wire SubstanceWeight SubPart% ARTICLEPPM ARTICLE% UoM SubPart PPM 75000 7.5 1075 0.1075 200000 20 2869 0.2869 g 75000 7.5 1075 0.1075 0.00054 g 200000 20 2869 0.2869 0.001215 g 450000 45 6455 0.6455 1000000 100 1062 0.1062 g 0.0002 Bonding Wire Die Encapsulant, Halogen-free Exemption g Metals Gold, metal 7440-57-5 0.0002 0.126 g g Die Encapsulant, Halogen-free Metals Other aluminum compounds - 0.00378 g 30000 3 20085 2.0085 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.00126 g 10000 1 6695 0.6695 Die Encapsulant, Halogen-free Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00378 g 30000 3 20085 2.0085 Die Encapsulant, Halogen-free Plastics/polymers Other phenolic resins - 0.00378 g 30000 3 20085 2.0085 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.1071 g 850000 85 569087 56.9087 Die Encapsulant, Halogen-free Plastics/polymers Other Non-halogenated Epoxy resins - 0.0063 g 50000 5 33475 3.3475 Silicon Semiconductor Die 0.012 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00024 g 20000 2 1275 0.1275 Silicon Semiconductor Die Glass Silicon, doped - 0.01176 g 980000 98 62486 6.2486 Silicon Semiconductor Die 0.012 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00024 g 20000 2 1275 0.1275 Silicon Semiconductor Die Glass Silicon, doped - 0.01176 g 980000 98 62486 6.2486 Organic Substrate 0.0353 g Organic Substrate Metals Barium sulfate 7727-43-7 0.00257535 g 72956 7.2956 13684 1.3684 Organic Substrate Metals Copper, metal 7440-50-8 0.01060956 g 300554 30.0554 56373 5.6373 Organic Substrate Plastics/polymers Epikote 862 28064-14-4 0.0022497 g 63731 6.3731 11953 1.1953 Organic Substrate Plastics/polymers Formaldehyde, polymer with 2-methylphenol, glycidyl ether 64425-89-4 0.00398992 g 113029 11.3029 21200 2.12 Organic Substrate Metals Gold, metal 7440-57-5 0.00026997 g 7648 0.7648 1434 0.1434 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00210868 g 59736 5.9736 11204 1.1204 Organic Substrate Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00122848 g 34801 3.4801 6527 0.6527 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.00752444 g 213157 21.3157 39981 3.9981 Organic Substrate Glass Silicon dioxide 7631-86-9 0.00064497 g 18271 1.8271 3427 0.3427 Organic Substrate Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.00041347 g 11713 1.1713 2196 0.2196 Organic Substrate Metals Aluminum Hydroxide 21645-51-2 0.00368546 g 104404 10.4404 19582 1.9582 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MKW21D256VHA5R_IPC1752_v11.xml http://www.freescale.com/mcds/MKW21D256VHA5R_IPC1752A.xml