Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MMA7455LR1 LGA 14 3*5*1.0P0.8 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-01-03 6433K11262D001A1.24 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No Yes e4 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MMA7455LR1 LGA 14 3*5*1.0P0.8 ALL 0.033000 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight Bonding Wire 0.0002 Bonding Wire Non-conductive Epoxy SubstanceClass Substance CAS Metals Gold, metal 7440-57-5 Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 1000000 100 6060 0.606 g 0.0002 0.0002 g g Non-conductive Epoxy Solvents, additives, and other materials [3-(2,3-epoxypropoxy)propyl]trimethoxysilane 2530-83-8 0.00001 g 50000 5 303 0.0303 Non-conductive Epoxy Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.00014 g 700000 70 4242 0.4242 Non-conductive Epoxy Solvents, additives, and other materials Dimethyl,methyl hydrogen siloxane 68037-59-2 0.00001 g 50000 5 303 0.0303 Non-conductive Epoxy Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.00004 g 200000 20 1212 0.1212 Die Encapsulant 0.0134 g Die Encapsulant Metals Other aluminum compounds - 0.000268 g 20000 2 8121 0.8121 Die Encapsulant Plastics/polymers Other Epoxy resins - 0.00067 g 50000 5 20303 2.0303 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.000134 g 10000 1 4060 0.406 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - 0.000134 g 10000 1 4060 0.406 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.000402 g 30000 3 12181 1.2181 Die Encapsulant Plastics/polymers Other phenolic resins - 0.000402 g 30000 3 12181 1.2181 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.01139 g 850000 85 345162 34.5162 Substrate 0.0131 g Substrate Metals Barium sulfate 7727-43-7 0.00027262 g 20811 2.0811 8261 0.8261 Substrate Metals Copper, metal 7440-50-8 0.00580999 g 443510 44.351 176060 17.606 Substrate Plastics/polymers Epikote 862 28064-14-4 0.00099612 g 76040 7.604 30185 3.0185 Substrate Metals Gold, metal 7440-57-5 0.00004205 g 3210 0.321 1274 0.1274 Substrate Nickel (external applications only) Nickel 7440-02-0 0.00024475 g 18683 1.8683 7416 0.7416 Substrate Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00053845 g 41103 4.1103 16316 1.6316 Substrate Glass Fibrous-glass-wool 65997-17-3 0.00329799 g 251755 25.1755 99939 9.9939 Substrate Glass Silicon dioxide 7631-86-9 0.00028268 g 21579 2.1579 8566 0.8566 Substrate Metals Aluminum Hydroxide 21645-51-2 0.00161535 g 123309 12.3309 48950 4.895 Silicon Semiconductor Die 0.0023 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000046 g 20000 2 1393 0.1393 Silicon Semiconductor Die Glass Silicon, doped - 0.002254 g 980000 98 68303 6.8303 Pb Glass Frit Semiconductor Di 0.0038 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00003945 g 10381 1.0381 1195 0.1195 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00003778 g 9943 0.9943 1144 0.1144 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00003778 g 9943 0.9943 1144 0.1144 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00368499 g 969733 96.9733 111666 11.1666 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MMA7455LR1_IPC1752_v11.xml http://www.freescale.com/mcds/MMA7455LR1_IPC1752A.xml