ATMEL MG2RT

Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Full Range of Matrices with up to 480K Gates
0.5 µm Drawn CMOS, 3 Metal Layers, Sea of Gates
RAM and DPRAM Compilers
Library Optimized for Synthesis, Floor Plan and Automatic Test Generation (ATG)
3 and 5 Volts Operation; Single or Dual Supply Mode
High Speed Performances:
– 450 ps Max NAND2 Propagation Delay at 4.5V, 720 ps at 2.7V and FO = 5
– Min 610 MHz Toggle Frequency at 4.5V, 320 MHz at 2.7V
Programmable PLL Available upon Request
High System Frequency Skew Control through Clock Tree Synthesis Software
Low Power Consumption:
– 1.96 µW/Gate/MHz at 5V
– 0.6 µW/Gate/MHz at 3V
Integrated Power On Reset
Matrices with a Max of 484 Fully Programmable Pads
Standard 3, 6, 12 and 24 mA I/Os
Versatile I/O Cell: Input, Output, I/O, Supply, Oscillator
CMOS/TTL/PCI Interface
ESD (2 kV) and Latch-up Protected I/O
High Noise and EMC Immunity:
– I/O with Slew Rate Control
– Internal Decoupling
– Signal Filtering between Periphery and Core
– Application Dependent Supply Routing and Several Independant Supply Sources
Wide Selection of MQFPs and MCGA Packages up to 472 Pins
Delivery in Die Form with 94.6 µm Pad Pitch
Advanced CAD Support: Floor Plan, Proprietary Delay Models, Timing Driven Layout,
Power Management
Cadence®, Mentor®, Vital® and Synopsys® Reference Platforms
EDIF and VHDL Reference Formats
Available in Military and Space Quality Grades (SCC, MIL-PRF-38535)
No Single Event Latch-up below an LET threshold of 80MeV/mg/cm2
Tested up to a Total Dose of 60 Krad (Si) according to MIL STD 883 Method 1019
QML Q and V with SMD 5962-00B02
Description
The MG2RT series is a 0.5 micron, array based, CMOS product family. Several arrays
up to 480K gates cover most system integration needs. The MG2RT is manufactured
using a 0.5 micron drawn, 3 metal layer CMOS process, called SCMOS 3/2RT.
The base cell architecture of the MG2RT series provides high routability of logic with
extremely dense compiled memories: RAM and DPRAM. ROM can be generated
using synthesis tools.
Accurate control of clock distribution can be achieved by PLL hardware and CTS
(Clock Tree Synthesis) software. New noise prevention techniques are applied in the
array and in the periphery: three or more independent supplies, internal decoupling,
customiszation dependent supply routing, noise filtering, skew controlled I/Os, low
swing differential I/Os, all contribute to improve the noise immunity and reduce the
emission level.
The MG2RT is supported by an advanced software environment based on industry
standards linking proprietary and commercial tools. Verilog, Modelsym and Design
Compiler are the reference front-end tools. Floor planning associated with timingdriven layout provides a short back-end cycle.
Rad Tolerant
350K Used Gates
0.5 µm CMOS
Sea of Gates
MG2RT
The MG2RT library allows straight forward migration from the MG1RT and MG1 Sea of Gates.
A netlist based on this library can be simulated as either MG2RT or MG2RTP. It can also be simulated as MG2 provided there are no SEU hardened cells.
Table 1. List of Available MG2RT Matrices
Type
Total Gates
Typical Usable
Gates
Total Pads
Maximum
Programmable I/O
MG2044E (1)
44616
31200
173
150
MG2091E
91464
64000
237
214
193800
135600
333
310
264375
185000
385
362
361680
253100
445
422
481143
336800
507
484
MG2194E
(1)
MG2265E
MG2360E
(1)
MG2480E
Note:
Libraries
Not available for new designs.
The MG2RT cell library has been designed to take full advantage of the features offered by both
logic and test synthesis tools.
Design testability is assured by the full support of SCAN, JTAG (IEEE 1149) and BIST
methodologies.
More complex macro functions are available in VHDL, such as Two-wire Interface (TWI), UART,
Timer.
Block Generators
2
Block generators are used to create a customer specific simulation model and metallisation pattern for regular functions like RAM and DPRAM. The basic cell architecture allows one bit per
cell for RAM and DPRAM. The main characteristics of these generators are summarised below.
Typical Characteristics (16 Kbits) at 5V
Function
Maximum
Size (bits)
Bits/Word
Access Time (ns)
Used Cells
RAM
32K
1-36
8.6
20K
DPRAM
32K
1-36
9.2
23K
MG2RT
4115L–AERO–06/05
MG2RT
I/O Buffer Interfacing
I/O Flexibility
All I/O buffers may be configured as input, output, bi-directional, oscillator or supply. A level
translator is located close to each buffer.
Inputs
Input buffers with CMOS or TTL thresholds are non-inverting and feature versions with and without hysteresis. The CMOS and TTL input buffers may incorporate pull-up or pull down
terminators. For special purposes, a buffer allowing direct input to the matrix core is available.
Outputs
Several kinds of CMOS and TTL output drivers are offered: fast buffers with 3, 6, 12 and 24 mA
drive at 5V, low noise buffers with 12 mA drive at 5V.
Clock Generation and PLL
Clock Generation
Atmel offers 6 different types of oscillators: 4 high frequency crystal oscillators and 2 RC oscillators. For all devices, the mark-space ratio is better than 40/60 and the start-up time less than 10
ms.
Frequency (MHz)
PLL
Typical
Consumption (mA)
Oscillators
Max 5V
Max 3V
5V
3V
Xtal 7M
12
7
1.2
0.4
Xtal 20M
28
17
2.5
0.8
Xtal 50M
70
40
7
2
Xtal 100M
130
75
16
5
RC 10M
10
10
2
1
RC 32M
32
32
3
1.5
Contact factory.
3
4115L–AERO–06/05
Power Supply
and Noise
Protection
The speed and density of the SCMOS3/2RT technology cause large switching current spikes for
example when:
•
either 16 high current output buffers switch simultaneously,
•
or 10% of the 480,000 gates are switching within a window of 1 ns.
Sharp edges and high currents cause some parisitic elements in the packaging to become significant. In this frequency range, the package inductance and series resistance should be taken
into account. It is known that an inductor slows down the settling time of the current and causes
voltage drops on the power supply lines. These drops can affect the behavior of the circuit itself
or disturb the external application (ground bounce).
In order to improve the noise immunity of the MG core matrix, several mechanisms have been
implemented inside the MG arrays. Two kinds of protection have been added: one to limit the I/O
buffer switching noise and the other to protect the I/O buffers against the switching noise coming
from the matrix.
I/O Buffers
Switching
Protection
Three features are implemented to limit the noise generated by the switching current:
•
The power supplies of the input and output buffers are separated.
•
The rise and fall times of the output buffers can be controlled by an internal regulator.
•
A design rule concerning the number of buffers connected on the same power supply line
has been imposed.
Matrix Switching
This noise disturbance is caused by a large number of gates switching simultaneously. To allow
Current Protection this without impacting the functionality of the circuit, three new features have been added:
4
•
Decoupling capacitors are integrated directly on the silicon to reduce the power supply drop.
•
A power supply network has been implemented in the matrix. This solution reduces the
number of parasitic elements such as inductance and resistance and constitutes an artificial
VDD and Ground plane. One mesh of the network supplies approximately 150 cells.
•
A low pass filter has been added between the matrix and the input to the output buffer. This
limits the transmission of the noise coming from the ground or the VDD supply of the matrix
to the external world via the output buffers.
MG2RT
4115L–AERO–06/05
MG2RT
Packaging
Atmel offers a wide range of packaging options which are listed below:
Package Type(1)
MQFP
Note:
Pins
Lead Spacing
min/max
(mils)
100
132
196
256
352
25
25
25
20
20
1. Contact Atmel local design centers to check the availability of the matrix/package combination.
5
4115L–AERO–06/05
Design Flows and Tools
Design Flows and
Modes
A generic design flow for an MG2RT array is illustrated below.
A top down design methodology is proposed which starts with high level system description and
is refined in successive design steps. At each step, structural verification is performed which
includes the following tasks:
•
Gate level logic simulation and comparison with high level simulation results.
•
Design and test rules check.
•
Power consumption analysis.
•
Timing analysis (only after floor plan).
The main design stages are:
•
System specification, preferably in VHDL form.
•
Functional description at RTL level.
•
Logic synthesis.
•
Floor planning and bonding diagram generation.
•
Test/Scan insertion, ATG and/or fault simulation.
•
Physical cell placement, JTAG insertion and clock tree synthesis.
•
Routing.
To meet the various requirements of designers, several interface levels between the customer
and Atmel are possible.
For each of the possible design modes a review meeting is required for data transfer from the
user to Atmel. In all cases the final routing and verifications are performed by Atmel.
The design acceptance is formalized by a design review which authorizes Atmel to proceed with
sample manufacturing.
6
MG2RT
4115L–AERO–06/05
MG2RT
Figure 1. MG2RT Design Flow
System
Specifications
RTL
Simulation
Logic
synthesis
Floor Plan
Bonding diagram
Gate Level
Simulation
Scan insertion
ATG and Fault Simulation
Placement
JTAG insertion
Clock Tree Synthesis
Routing + Extract
Backannotated
Simulation
Sign-off
Samples
Manufacturing
and Test
7
4115L–AERO–06/05
Design Tool and
Design Kits (DK)
The basic content of a design kit is described in the table below.
The interface formats to and from Atmel rely on IEEE or industry standard:
•
VHDL for functional descriptions
•
VHDL or EDIF for netlists
•
Tabular, log or .VCD for simulation results
•
SDF (VITAL format) and SPF for back annotation
•
LEF and DEF for physical floor plan information
The design kits supported for several commercial tools are listed below.
Design Kit Support
•
Cadence/Verilog (RTL and gate), Logic Design Planner
•
Mentor/Modelsim (RTL and gate), Velocity, BSD Architect, Flex Test
•
Synopsys, Design Compiler, PrimeTime
•
Vital
Table 2. Design Kit Description
Design Tool or library
Third Party Tools
Design manual and libraries
(1)
Synthesis library
(1)
Gate level simulation library
(1)
Design rules analyser
Power consumption analyser
STAR
COMET
Floor plan library
(1)
Timing analyser library
(1)
Package and bonding software
PIM
Scan path and JTAG insertion
(1)
ATG and fault simulation library
(1)
Note:
8
Atmel Software Name
1. Refer to “Design kits cross reference tables” ATD-TS-WF-R0181
MG2RT
4115L–AERO–06/05
MG2RT
Electrical Characteristics
Absolute Maximum Ratings
Note:
Ambient temperature under bias (TA)
Military ...................................................... -55 to +125°C
Junction temperature.................................... TJ < 175°C
Storage temperature................................. -65 to +150°C
Stresses above those listed may cause permanent
damage to the device. Exposure to absolute maximum rating conditions for extended period may affect
device reliability.
TTL/CMOS:
Supply voltage VDD ................................... -0.5V to +7V
I/O voltage ......................................-0.5V to VDD + 0.5V
DC Characteristics
Table 3. DC Characteristics - Specified at VDD = +5V ± 10%
Symbol
Parameter
VIL
Input LOW voltage (3)
CMOS input
TTL input
VIH
Input HIGH voltage(3)
CMOS input
TTL input
VOL
Output LOW voltage
VOH
Output HIGH voltage
VT+
Schmitt trigger positive threshold
CMOS input
TTL input
VT-
Delta V
IL
IOZ
Schmitt trigger negative threshold
CMOS input
TTL input
Min
Typ
0
0
1.5
3.5
VDD
2.2
VDD
0.8
0.4
3.9
3.6
1.8
1.2
Unit
V
V
V
IOL =24, 12, 6, 3 mA(1)
V
IOL =-24, -12, -6, -3 mA(1)
V
V
CMOS hysteresis 25°C/5V
1.9
TTL hysteresis 25°C/5V
0.6
V
Input leakage
No pull up/down
Pull up
Pull down
-5
-55
-69
+5
-120
79
125
330
µA
µA
µA
3-State Output Leakage current
-5
+5
µA
90
180
270
540
IOSN
IOSP
BOUT3
BOUT6
mA
BOUT12
BOUT24
ICCSB
Leakage current per cell
1.0
10.0
nA
ICCOP
Operating current per cell
0.39
0.58
µA/MHz/gate
Notes:
Conditions
1.0
Output Short circuit current
IOS
Max
1. According buffer: Bout24, Bout12, Bout6, Bout3.
2. Supplied as a design limit but not guaranteed or tested. No more than one output at a time may be shorted for a maximum
duration of 10 seconds.
3. Without Schmitt trigger.
9
4115L–AERO–06/05
Table 4. DC Characteristics - Specified at VDD = +3V ± 0.3V
Symbol
Parameter
VIL
Input LOW voltage(3)
LVCMOS input
LVTTL input
VIH
Input HIGH voltage(3)
LVCMOS input
LVTTL input
VOL
Output LOW voltage
LVTTL
VOH
Output high voltage
LVTTL
VT+
Schmitt trigger positive threshold
LVCMOS input
LVTTL input
VT-
Delta V
IL
IOZ
IOS
Schmitt trigger negative threshold
LVCMOS input
LVTTL input
Min
Typ
Max
Unit
0
0
0.3 VDD
V
0.7 VDD
VDD
2.0
VDD
0.8
0.4
2.4
V
V
V
2.2
0.9
0.8
V
0.8
TTL hysteresis 25°C/3V
0.2
V
-1
-20
24
+1
-60
32
42
150
µA
µA
µA
3-State Output Leakage current
±1
µA
Output Short circuit current
90
180
270
540
IOSN
BOUT3
BOUT6
mA
BOUT12
BOUT24
ICCSB
Leakage current per cell
0.6
5
nA
ICCOP
Operating current per cell
0.2
0.25
µA/MHz/gate
10
IOH= -8, -4, -2, -1 mA(1)
V
IOSP
Notes:
IOL=12, 6, 3, 1.5 mA(1)
1.2
CMOS hysteresis 25°C/3V
Input leakage
No pull up/down
Pull up
Pull down
Conditions
1. According buffer: Bout24, Bout12, Bout6, Bout3.
2. Supplied as a design limit but not guaranteed or tested. No more than one output at a time may be shorted for a maximum
duration of 10 seconds.
3. Without Schmitt trigger.
MG2RT
4115L–AERO–06/05
MG2RT
AC Characteristics
Table 5. AC Characteristics - TJ = 25°C, Process typical (all values in ns)
VDD
Buffer
Description
Load
BOUT12
Output buffer with 12 mA drive
60 pf
BOUT3
BOUTQ
B3STA3
B3STA12
B3STAQ
Output buffer with 3 mA drive
Low noise output buffer with 12 mA drive
3-state output buffer with 3 mA drive
3-state output buffer with 12 mA drive
Low noise 3-state output buffer with 12 mA drive
Transition
5V
3V
Tplh
2.53
3.91
Tphl
2.76
3.64
Tplh
4.63
7.22
Tphl
4.86
6.36
Tplh
2.97
4.48
Tphl
4.36
6.24
Tplh
4.73
7.35
Tphl
4.89
6.44
Tplh
2.64
4.07
Tphl
2.79
3.72
Tplh
3.01
4.61
Tphl
4.42
6.34
60 pf
60 pf
60 pf
60 pf
60 pf
11
4115L–AERO–06/05
Table 6. AC Characteristics - TJ = 25°C, Process typical (all values in ns)
VDD
Cell
Description
Load
BINCMOS
CMOS input buffer
15 fan
BINTTL
INV
NAND2
FDFF
BUF4X
NOR2
OAI22
OSFF
12
TTL input buffer
Inverter
2 - input NAND
D flip-flop, Clk to Q
High drive internal buffer
2-Input NOR gate
4-input OR AND INVERT gate
D flip-flop with scan input, Clk to Q
Transition
5V
3V
Tplh
0.77
1.14
Tphl
0.75
1.06
Tplh
0.9
1.31
Tphl
0.7
1.1
Tplh
0.52
0.8
Tphl
0.42
0.53
Tplh
0.73
1.11
Tphl
0.66
0.9
Tplh
0.8
1.21
Tphl
0.68
1.02
Ts
0.33
0.44
Th
-0.12
-0.24
Tplh
0.76
1.1
Tphl
0.58
0.81
Tplh
0.65
1.08
Tphl
0.37
0.45
Tplh
0.68
1.14
Tphl
0.42
0.54
Tplh
0.83
1.23
Tphl
1.00
1.38
Ts
0.56
0.8
Th
-0.34
-0.6
16 fan
12 fan
12 fan
8 fan
51 fan
8 fan
8 fan
8 fan
MG2RT
4115L–AERO–06/05
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Atmel Operations
Memory
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© Atmel Corporation 2005. All rights reserved. Atmel ®, logo and combinations thereof, are registered trademarks, and Everywhere You Are ®
are the trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Printed on recycled paper.
4115L–AERO–06/05