TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TOSHIBA LED Lamps TLRF1060(T18), TLSF1060(T18), TLOF1060(T18), TLYF1060(T18), TLPYF1060(T18), TLGF1060(T18), TLFGF1060(T18), TLPGF1060(T18) Panel Circuit Indicator Unit: mm • Surface-mount devices • 2.2 (L) × 1.4 (W) × 1.3 (H) mm • Flat-top type • InGaAℓP LEDs • High luminous intensity • Low drive current, high-intensity light emission • Colors: red, orange, yellow, green, pure green • Pb free reflow soldering is possible • Applications: automotive use, message signboards, backlighting etc. • Standard embossed tape packing: T18 (3000/reel) 8-mm tape reel Color and Material Product Name Color TLRF1060 Red TLSF1060 Red TLOF1060 Orange TLYF1060 Yellow TLPYF1060 Yellow TLGF1060 Green TLFGF1060 Green TLPGF1060 Pure Green JEDEC ― JEITA ― TOSHIBA Material 4-2F1 Weight: 0.01 g (typ.) InGaAℓP 1 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) Maximum Ratings (Ta = 25°C) Product Name Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (°C) Storage Temperature Tstg (°C) 30 15 75 −40~100 −40~100 TLRF1060 TLSF1060 TLOF1060 TLYF1060 TLPYF1060 TLGF1060 TLFGF1060 TLPGF1060 Note 1: Forward current derating IF – Ta Allowable forward current IF (mA) 50 40 30 20 10 0 0 20 40 60 Ambient temperature 80 Ta 100 120 (°C) Electrical Characteristics (Ta = 25°C) Product Name TLRF1060 Forward Voltage VF Min Typ. Max 1.7 2.0 2.5 TLSF1060 1.7 2.0 2.5 TLOF1060 1.7 2.0 2.5 TLYF1060 1.7 2.1 2.5 TLPYF1060 1.7 2.1 2.5 TLGF1060 1.7 2.2 2.5 TLFGF1060 1.7 2.2 2.5 TLPGF1060 1.7 2.2 2.5 Unit V Reverse Current IR IF Max VR 20 10 15 mA μA V 2 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) Optical Characteristics–1 (Ta = 25°C) Available Iv rank Luminous Intensity IV Product Name Min Typ. Max IF Please see Note 2 TLRF1060 40 100 320 20 PA / QA / RA / SA TLSF1060 100 200 500 20 RA / SA / TA TLOF1060 100 220 500 20 RA / SA / TA TLYF1060 63 180 320 20 QA / RA / SA TLPYF1060 40 100 320 20 PA / QA / RA / SA TLGF1060 40 80 320 20 PA / QA / RA / SA TLFGF1060 25 50 125 20 NA / PA / QA TLPGF1060 10 20 50 20 LA / MA / NA Unit mcd mA Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Rank Luminous Intensity IV Min Max LA 10 20 MA 16 32 NA 25 50 PA 40 80 QA 63 125 RA 100 200 SA 160 320 TA 250 500 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λp Product Name Δλ Dominant Wavelength λd Min Typ. Max Typ. Min Typ. Max TLRF1060 ⎯ 644 ⎯ 18 624 630 638 TLSF1060 ⎯ 623 ⎯ 17 607 613 621 TLOF1060 ⎯ 612 ⎯ 15 599 605 613 TLYF1060 ⎯ 590 ⎯ 13 580 587 595 TLPYF1060 ⎯ 583 ⎯ 13 574 580 586 TLGF1060 ⎯ 574 ⎯ 11 565 571 576 TLFGF1060 ⎯ 568 ⎯ 11 565 565 565 TLPGF1060 ⎯ 562 ⎯ 11 555 558 564 Unit nm nm nm IF 20 mA The cautions • • This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light. This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source. 3 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLRF1060 IF – V F IV – IF (typ.) IV (mcd) Ta = 25°C 30 Luminous intensity Forward current IF (mA) Ta = 25°C 10 3 1 1.4 (typ.) 1000 100 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 300 100 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 3 Relative intensity Relative intensity IV 0.8 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 60 Case temperature Tc 80 0 580 100 (°C) 600 620 640 Wavelength 660 680 700 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 4 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLSF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 580 100 (°C) 600 620 640 Wavelength 660 680 700 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 5 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLOF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage VF 2.4 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.6 0.4 0.3 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 540 100 (°C) 560 580 600 Wavelength 620 640 660 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 6 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLYF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 540 100 (°C) 560 580 600 Wavelength 620 640 660 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 7 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLPYF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 540 100 (°C) 560 580 600 Wavelength 620 640 660 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 8 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLGF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 1.0 (typ.) IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 540 100 (°C) 560 580 Wavelength 600 620 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 9 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLFGF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C IV (mcd) (mA) Ta = 25°C 300 100 Luminous intensity Forward current IF 30 10 3 1 1.4 (typ.) 1000 1.6 1.8 2.0 2.2 Forward voltage 2.4 VF 30 10 3 2.6 1 1 (V) 3 10 Forward current IV – Tc IF 100 (mA) Wavelength characteristic (typ.) 10 30 1.0 (typ.) IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 520 100 (°C) 540 560 Wavelength 580 600 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 10 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) TLPGF1060 IF – V F IV – IF (typ.) 100 Ta = 25°C Luminous intensity IF 30 Forward current 30 IV (mcd) (mA) Ta = 25°C 10 3 1 1.4 (typ.) 100 1.6 1.8 2.0 2.2 Forward voltage VF 2.4 10 3 1 0.3 2.6 0.1 1 (V) 3 10 Forward current IV – Tc 30 IF 100 (mA) Wavelength characteristic (typ.) 10 1.0 (typ.) IF = 20 mA Ta = 25°C 5 0.8 Relative intensity Relative intensity I 3 1 0.5 0.3 0.6 0.4 0.2 0.1 −40 −20 0 20 40 Case temperature 60 Tc 80 0 520 100 (°C) 540 560 Wavelength 580 600 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 11 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the label. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering • Reflow soldering Temperature profile for Pb soldering (example) Temperature profile for Pb-free soldering (example) 5 s max(*) 10 s max (*) (*) (*) 140~160°C max(*) (*) 4°C/s max(*) 4°C/s max 60~120 s max(*) Time • • • • • 260°C max Package surface temperature (°C) Package surface temperature (°C) 240°C max 4°C/s max(*) max(*) 150~180°C 230°C 4°C/s max(*) max(*) 60~120 s Time (s) 30~50s max(*) (s) The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max) Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300°C or less Time : within 3 s Do not perform wave soldering. Recommended soldering pattern 0.8 1.2 Unit: mm 0.8 1.0 12 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES KAO CLEAN TROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) : (made by ASAHI GLASS) : (made by KAO) : (made by ARAKAWA CHEMICAL) : (made by GE TOSHIBA SILICONES) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T18 (4-mm pitch) (2) Example TLSF1060 (T18) Tape type Toshiba product No. 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance D 1.5 +0.1/−0 P2 2.0 ±0.05 E 1.75 ±0.1 W 8.0 ±0.2 P0 4.0 ±0.1 P 4.0 ±0.1 t 0.2 ±0.05 A0 1.5 ±0.1 F 3.5 ±0.05 B0 2.5 ±0.1 D1 1.1 ±0.1 K0 1.5 ±0.1 K0 P0 D t P2 E F W B0 P D1 Polarity A0 13 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) 3. Reel dimensions Unit: mm 9 ± 0.3 φ60 2 ± 0.5 φ13 φ44 +0 180 −4 11.4 ± 1.0 4. Leader and trailer sections of tape 40 mm or more 40 mm or more (Note 1) (Note 2) Leading part: 190 mm (min) Note1: Empty trailer section Note2: Empty leader section 14 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) 5. Packing display (1) Packing quantity Reel 3,000 pcs Carton 15,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLSF1060 (T18) P/N: TOSHIBA TYPE TLSF1060 ADDC (T18) Q’TY Lot Number Key code for TSB (RANK SYMBOL) 32C 3,000 pcs 3000 Use under 5-30degC/60%RH within 168h SEAL DATE: DIFFUSED IN ***** ASSEMBLED IN ***** [[G]]/RoHS COMPATIBLE *Y3804xxxxxxxxxxxxxxxxx* (2) Label location • Reel • Carton Tape feel direction Label position Label position • The aluminum package in which the reel is supplied also has the label attached to center of one side. 15 2006-05-30 TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18) RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 16 2006-05-30