TOSHIBA TLSE1100B

TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TOSHIBA LED Lamps
TLRE1100B(T11), TLSE1100B(T11), TLOE1100B(T11),
TLYE1100B(T11), TLGE1100B(T11), TLFGE1100B(T11)
TLPGE1100B(T11)
Unit: mm
Panel Circuit Indicator
•
Surface-mount devices
•
3.2 (L) × 2.8 (W) × 1.9 (H) mm
•
Flat-top type
•
InGaAℓP LEDs
•
High luminous intensity
•
Low drive current, high-intensity light emission
•
Colors: red, orange, yellow, green, pure green
•
Pb-free reflow soldering is possible
•
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
Product Name
Color
TLRE1100B
Red
TLSE1100B
Red
TLOE1100B
Orange
TLYE1100B
Yellow
TLGE1100B
Green
TLFGE1100B
Green
TLPGE1100B
Pure Green
Material
JEDEC
―
JEITA
―
TOSHIBA
4-3R1
Weight: 0.035 g (typ.)
InGaAℓP
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
Maximum Ratings (Ta = 25°C)
Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
50
4
120
−40~100
−40~100
TLRE1100B
TLSE1100B
TLOE1100B
TLYE1100B
TLGE1100B
TLFGE1100B
TLPGE1100B
Note 1:
Forward current derating
IF – Ta
Allowable forward current
IF (mA)
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C))
Electrical Characteristics (Ta = 25°C)
Min
Typ.
Max
TLRE1100B
1.6
1.9
2.4
TLSE1100B
1.6
1.9
2.4
TLOE1100B
1.6
2.0
2.4
TLYE1100B
1.6
2.0
2.4
TLGE1100B
1.6
2.0
2.4
TLFGE1100B
1.6
2.0
2.4
TLPGE1100B
1.6
2.1
2.4
Unit
Reverse Current
IR
Forward Voltage VF
Product Name
V
IF
Max
VR
20
10
4
mA
μA
V
2
2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
Optical Characteristics–1 (Ta = 25°C)
Product Name
Luminous Intensity IV
Available Iv rank
Min
Typ.
Max
IF
Please see Note 2
TLRE1100B
40
100
320
20
PA / QA / RA / SA
TLSE1100B
63
180
500
20
QA / RA / SA / TA
TLOE1100B
63
150
500
20
QA / RA / SA / TA
TLYE1100B
63
150
500
20
QA / RA / SA / TA
TLGE1100B
40
100
320
20
PA / QA / RA / SA
TLFGE1100B
25
45
125
20
NA / PA / QA
TLPGE1100B
10
25
50
20
LA / MA / NA
mcd
mcd
mcd
mA
Unit
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
Luminous Intensity IV
Min
Max
LA
10
20
MA
16
32
NA
25
50
PA
40
80
QA
63
125
RA
100
200
SA
160
320
TA
250
500
Unit
mcd
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp
Product Name
Min
Δλ
Typ.
Max
Typ.
Dominant Wavelength λd
Min
Typ.
Max
TLRE1100B
⎯
644
⎯
18
624
630
638
TLSE1100B
⎯
623
⎯
15
607
613
621
TLOE1100B
⎯
612
⎯
15
599
605
613
TLYE1100B
⎯
590
⎯
15
581
587
595
TLGE1100B
⎯
574
⎯
13
565
571
576
TLFGE1100B
⎯
568
⎯
11
561
565
569
TLPGE1100B
⎯
562
⎯
11
555
558
564
Unit
nm
nm
nm
IF
20
mA
The cautions
•
•
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLRE1100B
IF – V F
IV – IF
(typ.)
50
1000
IV (mcd)
10
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
30
5
3
1
1.6
1.7
1.8
1.9
2.0
Forward voltage
2.1
VF
50
30
3
5
10
30
IF
50
100
(mA)
Wavelength characteristic
(typ.)
(typ.)
1.0
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
100
Forward current
IV – Tc
3
300
(V)
10
5
Ta = 25°C
500
10
1
2.2
(typ.)
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLSE1100B
IF – V F
IV – IF
(typ.)
1000
Ta = 25°C
IV (mcd)
100
(mA)
50
Luminous intensity
Forward current
IF
30
10
5
3
1
1.6
1.7
1.8
1.9
2.1
2.0
Forward voltage
VF
IV – Tc
100
50
30
3
5
10
30
Forward current
50
IF
100
(mA)
Wavelength characteristic
(typ.)
(typ.)
1.0
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
3
300
(V)
10
5
Ta = 25°C
500
10
1
2.2
(typ.)
1
0.5
0.3
0.1
−25
25
0
75
50
Case temperature
Tc
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLOE1100B
IF – V F
IV – IF
(typ.)
100
1000
IV (mcd)
50
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
5
3
1
1.7
1.8
1.9
2.0
2.1
Forward voltage
VF
2.2
IV – Tc
100
50
30
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
(typ.)
1.0
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
3
300
(V)
10
5
500
10
1
2.3
(typ.)
Ta = 25°C
1
0.5
0.3
1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLYE1100B
IF – V F
IV – IF
(typ.)
100
IV (mcd)
Ta = 25°C
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
1.7
1.8
1.9
2.0
2.1
Forward voltage
2.2
VF
100
50
20
1
2.3
3
5
10
30
IF
50
100
(mA)
Wavelength characteristic
(typ.)
(typ.)
1.0
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
300
Forward current
IV – Tc
3
500
(V)
10
5
(typ.)
1000
1
0.5
0.3
0.1
−25
25
0
75
50
Case temperature
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLGE1100B
IF – V F
IV – IF
(typ.)
100
IV (mcd)
Ta = 25°C
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
1.7
1.8
1.9
2.0
2.1
Forward voltage
VF
100
50
30
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
1.0
(typ.)
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
300
(V)
IV – Tc
3
500
10
1
2.3
2.2
10
5
(typ.)
1000
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
Wavelength
600
620
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLFGE1100B
IF – V F
IV – IF
(typ.)
100
IV (mcd)
Ta = 25°C
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
1.7
1.8
1.9
2.0
2.1
Forward voltage
VF
10
5
3
3
5
10
Forward current
30
IF
50
100
(mA)
Wavelength characteristic
(typ.)
1.0
(typ.)
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
30
(V)
IV – Tc
3
50
1
1
2.3
2.2
10
5
(typ.)
100
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
Wavelength
600
620
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
9
2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
TLPGE1100B
IF – V F
(typ.)
100
IV (mcd)
(mA)
Luminous intensity
Forward current
IF
30
10
5
3
1.8
1.9
2.1
2.0
Forward voltage
VF
2.2
IV – Tc
30
10
5
3
1
1
2.3
3
5
10
Forward current
30
IF
50
100
(mA)
Wavelength characteristic
(typ.)
1.0
(typ.)
IF = 20 mA
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
3
50
(V)
10
5
(typ.)
Ta = 25°C
Ta = 25°C
50
1
1.7
IV – IF
100
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
520
100
(°C)
540
560
Wavelength
580
600
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
140~160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60~120 s max(*)
Time
•
•
•
•
•
260°C max
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150~180°C 230°C
4°C/s max(*)
max(*)
60~120 s
Time
(s)
30~50s max(*)
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65
Unit: mm
1.15
1.65
2.41
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T14 (4-mm pitch)
(2) Example
TLRE1100B (T11)
Tape type
Toshiba product No.
2.
Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
8.0
±0.3
P0
4.0
±0.1
P
4.0
±0.1
t
0.3
±0.05
A0
2.9
±0.1
F
3.5
±0.05
B0
3.7
±0.1
D1
1.5
±0.1
K0
2.3
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
3. Reel dimensions
Unit: mm
9 ± 0.3
φ60
2 ± 0.5
φ13
φ44
+0
180 −4
11.4 ± 1.0
4. Leader and trailer sections of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
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TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
5. Packing form
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLRE1100B (T11)
P/N:
TOSHIBA
TYPE
TLRE1100B
ADDC
(T11)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
2,000 pcs
2000
Use under 5-30degC/60%RH within 168h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape feel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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2006-05-31
TL(RE,SE,OE,YE,GE,FGE,PGE)1100B(T11)
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-05-31