SPICE MODELS: SBG3030CT SBG3040CT SBG3045CT SBG3050CT SBG3060CT SBG3030CT - SBG3060CT 30A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features · · · · · · · Schottky Barrier Chip · Lead Free Finish/RoHS Compliant Version (Note 3) Guard Ring Die Construction for Transient Protection Low Power Loss, High Efficiency High Surge Capability D2PAK E High Current Capability and Low Forward Voltage Drop A Surge Overload Rating to 250A Peak For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Applications 4 1 2 · · Case: D2PAK · · Moisture Sensitivity: Level 1 per J-STD-020C · · · · · Ordering Information, Page 2 PIN 1 Polarity: See Diagram PIN 3 Dim Min Max H A 9.65 10.69 B 14.60 15.88 C 0.51 1.14 D 2.29 2.79 4.83 J B Mechanical Data G 3 M Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 D K C Terminals: Finish - Bright Tin. Solderable per MIL-STD-202, Method 208 L PIN 2 & 4 E 4.37 G 1.14 1.40 H 1.14 1.40 J 8.25 9.25 K 0.30 0.64 L 2.03 2.92 M 2.29 2.79 All Dimensions in mm Marking: Type Number Mounting Position: Any Weight: 1.7 grams (approximate) Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Symbol SBG 3030CT SBG 3040CT SBG 3045CT SBG 3050CT SBG 3060CT Unit VRRM VRWM VR 30 40 45 50 60 V VR(RMS) 21 28 32 35 42 V IO 30 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) IFSM 250 A Forward Voltage, per Element @ IF = 15A, TC = 25°C VFM Peak Reverse Current at Rated DC Blocking Voltage @ TC = 25°C @ TC = 100°C Average Rectified Output Current @ TC = 100°C Typical Junction Capacitance (Note 2) Typical Thermal Resistance Junction to Case (Note 1) Operating and Storage Temperature Range Notes: 0.55 0.70 V IRM 1.0 75 Cj 420 pF RqJC 1.5 K/W Tj, TSTG -65 to +150 °C mA 1. Thermal resistance: junction to case mounted on heat sink. 2. Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC. 3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. DS30025 Rev. 5 - 2 1 of 2 www.diodes.com SBG3030CT - SBG3060CT ã Diodes Incorporated 100 IF, INSTANTANEOUS FORWARD CURRENT (A) I(AV), AVERAGE RECTIFIED CURRENT (A) 30 24 18 12 6 0 0 50 100 10 1.0 0.1 0.2 150 TC, CASE TEMPERATURE (° C) Fig. 1 Forward Derating Curve 0.8 1.0 1000 8.3 ms single half-sine-wave JEDEC method 250 Cj, JUNCTION CAPACITANCE (pF) IFSM, PEAK FORWARD CURRENT (A) 0.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 300 200 150 100 50 100 Tj = 25° C f = 1.0MHz 10 0 1 10 0.1 100 Ordering Information 1.0 10 100 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance NUMBER OF CYCLES AT 60Hz Fig. 3 Maximum Non-Repetitive Surge Current Notes: 0.4 (Note 4) Device Packaging Shipping SBG3030CT-T-F D2PAK 800/Tape & Reel, 13-inch SBG3040CT-T-F D2PAK 800/Tape & Reel, 13-inch SBG3045CT-T-F D2PAK 800/Tape & Reel, 13-inch SBG3050CT-T-F D2PAK 800/Tape & Reel, 13-inch SBG3060CT-T-F D2PAK 800/Tape & Reel, 13-inch 4. For packaging details, visit our website at http://www.diodes.com/datasheets/ap02007.pdf. DS30025 Rev. 5 - 2 2 of 2 www.diodes.com SBG3030CT - SBG3060CT