Industry First Low Capacitance ESD Protection Arrays w/Backdrive Protection CM1223 Features • • • • • • • • • • • • Two, four, and eight channels of ESD protection with integrated backdrive protection on all lines Provides ESD protection to IEC61000-4-2 Level 4: ±8kV contact discharge ±15kV air discharge Low channel input capacitance of 1.0pF (typical) Minimal capacitance change with temperature and voltage Channel I/O to GND capacitance difference of 0.02pF typical is ideal for differential signals Mutual capacitance between signal pin and adjacent signal pin at 0.11pF (typical) Zener diode protects supply rail and eliminates the need for external bypass capacitors Pin compatible with CM1213-02, -04, and -08 Each I/O pin can withstand over 1000 ESD strikes* Available in SOT, and MSOP packages RoHS-compliant, lead-free packaging Applications • • • • • • • USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays UDI and display ports Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection Product Description The CM1223 family of diode arrays are designed to provide ESD protection for electronic components or subsystems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series, which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, to absorb positive ESD strikes and provide ESD protection for the VP rail. An additional diode is integrated to serve as backdrive current protection. The CM1223 protects against ESD pulses up to ±8kV per the IEC 61000-4-2 standard. In addition, all pins are protected from contact discharges of greater than ±15kV as outlined by the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD. These devices are particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire, iLink), serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives, as well as other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1223 family of devices are manufactured with RoHS-compliant, lead-free packaging. Block Diagram ©2010 SCILLC. All rights reserved. April 2010 – Rev.4 Publication Order Number: CM1223/D CM1223 Package/Pinout Diagrams Rev. 4 | Page 2 of 19 | www.onsemi.com CM1223 Pin Configuration PIN DESCRIPTIONS 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE PIN PIN NAME TYPE 1 CH1 I/O 2 NC 3 VP PWR I/O PIN NAME TYPE 1 VN GND 2 CH1 I/O ESD Channel 3 CH2 I/O ESD Channel 4 CH2 4 VP PWR Positive voltage supply rail 5 NC 6 CH3 7 NC 8 VN GND 9 CH4 I/O 10 NC Negative voltage supply rail DESCRIPTION ESD Channel No connect Positive voltage supply rail ESD Channel No connect I/O ESD Channel 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE PIN NAME TYPE DESCRIPTION 1 NC 2 VN GND 3 CH1 I/O ESD Channel 4 CH2 I/O ESD Channel 5 VP PWR No connect Negative voltage supply rail No connect Negative voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGE NAME TYPE 1 CH1 I/O 2 VN GND 3 CH2 I/O ESD Channel 4 CH3 I/O ESD Channel 5 VP PWR 6 CH4 I/O DESCRIPTION ESD Channel Negative voltage supply rail Positive voltage supply rail ESD Channel No connect 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE Positive voltage supply rail PIN ESD Channel PIN NAME TYPE 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 CH3 I/O ESD Channel 4 CH4 I/O ESD Channel 5 VN GND 6 CH5 I/O ESD Channel 7 CH6 I/O ESD Channel 8 VP PWR 9 CH7 I/O ESD Channel 10 CH8 I/O ESD Channel Rev. 4 | Page 3 of 19 | www.onsemi.com DESCRIPTION Negative voltage supply rail Positive voltage supply rail CM1223 Ordering Information PART NUMBERING INFORMATION # of Channels Leads Package Ordering Part Number Part Marking 2 5 SOT23-5 CM1223-02SO D334 2 4 SOT143-4 CM1223-02SR D337 4 6 SOT23-6 CM1223-04SO D335 4 10 MSOP-10 CM1223-04MR D338 8 10 MSOP-10 CM1223-08MR D336 1 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V Operating Temperature Range -40 to +85 °C Storage Temperature Range -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT143-4 Package (CM1223-02SR) SOT23-5 Package (CM1223-02SO) SOT23-6 Package (CM1223-04SO) MSOP-10 Package (CM1223-04MR) MSOP-10 Package (CM1223-08MR) Rev. 4 | Page 4 of 19 | www.onsemi.com RATING UNITS -40 to +85 °C 225 225 225 400 400 mW mW mW mW mW CM1223 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS (SEE NOTE 1) MIN TYP MAX UNITS 3.3 5.5 V 8.0 µA VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V Signal Clamp Voltage Positive Transients Negative Transients IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V ±0.1 ±1.0 µA CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 1.0 1.5 pF ∆C Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.02 pF CMUTUAL Mutual Capacitance between signal pin and adjacent signal pin At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.11 pF VESD ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MIL-STD-883, Method 3015 VSCL IN VCL RDYN 6.7 0.60 V V TA=25°C; Notes 3 and 4 ±8 kV TA=25°C; Notes 2 and 4 ±15 kV Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20µS; Note 4 Dynamic Resistance Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20µS Any I/O pin to Ground; Note 4 Note 1: Note 2: Note 3: Note 4: 8.2 0.80 +8.8 -1.4 V V 0.7 0.4 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP (VP floating). Rev. 4 | Page 5 of 19 | www.onsemi.com CM1223 Performance Information Input Channel Capacitance Performance Curves Rev. 4 | Page 6 of 19 | www.onsemi.com CM1223 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-8 Package) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V, MSOP-8 Package) Rev. 4 | Page 7 of 19 | www.onsemi.com CM1223 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-10 Package) Figure 4. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 4 | Page 8 of 19 | www.onsemi.com CM1223 Backdrive Protection Backdrive protection is needed to block against backdrive current flowing from a high potential voltage node toward a lower potential voltage node through the interface cable. For example, consider a DVD player connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of associated bulk supply capacitance, and it is possible over time to charge that bulk supply capacitance to some intermediate level. If that level rises above the power-on-reset (POR) voltage level of some of the integrated circuits, the DVD player may not reset properly when the DVD player is turned back on. This is largely because all CMOS logic exhibits a very high impedance on the power rail node even when "off". To avoid this situation, the CM1223 with integrated backdrive protection diode was designed to block backdrive current, guaranteeing no more than 5µA on any I/O pin when the I/O pin voltage is greater than the CM1223 supply voltage. Application Information Design Considerations To realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/Ground rails as well as the signal trace segments between the signal input (typically a connector) and the ESD protection device. Application of Positive ESD Pulse between Input Channel and Ground illustrates an example of a positive 8kV ESD pulse striking an input channel. The 8kV ESD current pulse will divert along the path as indicated in Application of Positive ESD Pulse between Input Channel and Ground, through the D1 diode and the Zener diode back to the ground rail. An ESD current pulse can rise from zero to its peak value in a very short time. For example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. The CM1223 has a fast response time of less than 1ns and low clamp voltage to handle this pulse scenario. Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1223 also has an integrated backdrive diode between VP and VN to prevent backdrive current flow from the powered sources. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.cmd.com. Rev. 4 | Page 9 of 19 | www.onsemi.com CM1223 POSITIVE SUPPLY One Channel of CM1223 PATH OF POSI TIVE ESD CURRENT PULSE IESD LINE BEING PROTECTED SYSTEM OR CIR CUITRY I/O pin PATH OF NEGA TIVE ESD GROUND RAIL Figure 5. Application of Positive ESD Pulse between Input Channel and Ground Figure 6. Application of Positive ESD Pulse between Input Channel and Ground Rev. 4 | Page 10 of 19 | www.onsemi.com CM1223 Mechanical Details The CM1223 is available in SOT143-4, SOT23-5, SOT23-6, and MSOP-10 packages with a lad-free finishing option. The various package drawings are presented below. SOT143 Mechanical Specifications Dimensions for CM1223-02SR devices supplied in 4-pin SOT143 packages are presented below. PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions Millimeters Inches Min Max Min Max A 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 e 1.92 BSC e1 0.20 BSC L L1 # per tape and reel 0.4 0.055 0.075 BSC 0.008 BSC 0.6 0.54 REF 0.047 0.016 0.024 0.021 REF 3000 pieces Package Dimensions for SOT143 Controlling dimension: millimeters Rev. 4 | Page 11 of 19 | www.onsemi.com CM1223 Tape and Reel Specifications PACKAGE SIZE PART NUMBER (mm) CM1223-02SR 2.92 X 2.37 X 1.01 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 2.60 X 3.15 X 1.20 8mm 178mm (7") 3000 4mm 4mm Rev. 4 | Page 12 of 19 | www.onsemi.com CM1223 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications The CM1223-02SO is supplied in a 5-pin SOT23 package. Dimensions are presented below. PACKAGE DIMENSIONS Package SOT23-5 (JEDEC name is MO-178) Pins 5 Dimensions Millimeters Inches Min Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L L1 # per tape and reel 0.30 0.60 0.60 REF 0.0118 0.0236 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-5 Rev. 4 | Page 13 of 19 | www.onsemi.com CM1213 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1223-02SO 2.90 X 2.80 X 1.45 3.20 X 3.20 X 1.40 8mm 178mm (7") 3000 4mm 4mm Rev. 4 | Page 14 of 19 | www.onsemi.com CM1223 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1223-04SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. PACKAGE DIMENSIONS Package SOT23-6 (JEDEC name is MO-178) Pins 6 Dimensions Millimeters Inches Min Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L L1 # per tape and reel 0.30 0.60 0.60 REF 0.0118 0.0236 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-6 Rev. 4 | Page 15 of 19 | www.onsemi.com CM1213 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1223-04SO 2.90 X 2.80 X 1.45 3.20 X 3.20 X 1.40 8mm 178mm (7") 3000 4mm 4mm Rev. 4 | Page 16 of 19 | www.onsemi.com CM1223 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications, 10 pin The CM1223-08MR 10-lead MSOP package dimensions are presented below. PACKAGE DIMENSIONS Package MSOP Pins 10 Dimensions Millimeters Inches Min Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.17 0.27 0.007 0.013 C 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 e 0.50 BSC 0.0196 BSC H 4.90 BSC 0.193 BSC L # per tape and reel 0.40 0.70 0.0137 0.029 4000 Controlling dimension: millimeters Package Dimensions for MSOP-10 Rev. 4 | Page 17 of 19 | www.onsemi.com CM1223 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1223-08MR 3.00 X 3.00 X 0.85 3.30 X 5.30 X 1.30 12mm 330mm (13") 4000 4mm 8mm Rev. 4 | Page 18 of 19 | www.onsemi.com CM1223 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Literature Distribution Center for ON Semiconductor Toll Free USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your Email: [email protected] Phone: 81-3-5773-3850 local Sales Representative Rev. 4 | Page 19 of 19 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit